Integrated Circuit &

Applications
Course Code: ECL305(odd semester)

Naman Joshi
(Assistant Professor)
(EECE Department, ITMU)

Flow:
1. Block Diagram of an Op-Amp
2. Schematic symbol & Equivalent Circuit
3. Integrated Circuits & their classifications
4. Types of IC packages
5. Pin identifications
6. Interpretations of data sheets
7. Characteristics and Parameters of Op-Amp

1. Block Diagram

1. First Stage:
Provides most of the voltage gain and offers high input
resistance
2. Second Stage:
An intermediate stage, usually another DA with Dual Input
Unbalanced output.
3. Third Stage:
A level translator, to shift the dc level to ground (DC level is
above ground level because of direct coupling )
4. Final stage:
A Push-Pull Amplifier, offers high voltage swing , high current
supplying capability and low output resistance.

2. Schematic Symbol

3. Integrated Circuit
When all component of each circuit are fabricated on the same chip, the chip is called an
Integrated Circuit (IC)

Classifications:
A) Mode of Operations
(I) Digital IC

1. Complete predesigned package only requires power supply , input output

2. Used to make multiplexer, demultiplexer, shift resister, gates counters.
3. Acute control on operating region characteristics is not required.
4. High production.
5. Low cost

(II) Linear IC

1. Equivalents of discrete transistor networks.

2. External resistors circuit is necessary for controlled voltage gain and frequency response
3. Example: Op-Amp.
4. Usage: Amplifiers, filters, multipliers, modulators.

NOTE : Op amp can be divided into two categories , General purpose and Special
purpose. General purpose: used for many application like integrator ,differentiator,
active filters comparators.(Example: 741IC). Special purpose : used for specific
application like LM 380 used only for audio power application

(B)Production process
(I) Monolithic

1. All transistors and passive

components like resistor
and capacitors are
fabricated on a single
piece of semiconductor.
2. First , diffusion process is
used to fabricate
components simultaneously
then metallization is
done for interconnections,
electric isolation is achieved
by dielectric, beam-lead or
PN junction (PN is most
economical)
3. Monolithic IC presents good
thermal stability
4. Large values of resistors and
capacitors are not possible
5. Transformer can not be formed.

(II) Hybrid IC
1.Active components are fabricates on
Semiconductor piece but passive
components ( R and C) and their
interconnects are formed on an
insulating substrate
2.This substrate works as a chasis for
chip
3. Depending upon method to form R,C
and interconnections Hybrid IC is
two types : thin film and thick film.
4. Thin film when suitable material is
evaporated.
5. Thick film when etching is performed
on substrate by silk screening.

IC package Types

Flat Pack
1. Enclosed in rectangular ceramic case
2. 8, 10 , 14 ,16 pins
3.Leads accommodate power supply, input output and several special connections
4. more reliable
5. lighter than Comparable DIP package
6. best suited for airborne application
Metal Can transistor pack
1. enclosed in metal or plastic case
2. 3, 5, 8 ,10, 12
3. best suited for power amplifiers as has good heat dissipation capability
4. also permits external heat sinks.
5. It is the only choice if IC is to be operated at relatively high temperature.
6. Costly
Dual in line package (DIP )
1. mounted inside a plastic or ceramic case.
2. Most widely used as easy to mount on bread board and for soldering. Best
suited for experimentation
3. lowest cost. Ceramic DIP able to dissipate more so more costly than plastic DIP.

 Interpretations of Data Sheets

1. Top : device number and brief description of
basic type of the device
2. General Description, Construction process,
Intended Applications & main features
3. Absolute Maximum ratings
4. Pin configurations and package type
5. Internal schematic diagram, equivalent cicuit
6. Electrical characteristics and parameters values
7. Typical performance curves
8. Typical Application and Test Circuits

Electrical Parameters
1.
2.
3.
4.
5.

Large signal voltage gain

Input offset voltage
Input offset current
Input bias current
Differential input
resistance
6. Input capacitance
7. Offset voltage adjustment
range
8. Input voltage range
9. CMRR
10. SVRR
11. Output voltage swing

12. Output resistance

13.
14.
15.
16.
17.
18.
19.

Output short circuit current

Supply current
Power consumption
Transient response
Slew rate
Gain Bandwidth product
Average temperature
coefficient for input offset
voltage and current
20. Long term input offset
voltage and current stability
21. Equivalent input Noise
voltage and current
22. Channel separation

Dependencies - I
AC Parameters
1.
2.
3.
4.
5.
6.
7.
8.
9.

Input resistance
Output resistance
Large Signal voltage gain
Output voltage swing
Average input oofset
voltage and current drift
Long term input offset
voltage and voltage stability
Gain Bandwidth product
and transient response
Slew rate
Equivalent input noise
voltage and current.

DC Parameters
1.
2.
3.
4.
5.

Input resistance
Output resistance
Large Signal voltage gain
Output voltage swing
Input offset voltage and
input offset current.
6. Average input offset
voltage and current drifts
7. Long term input offset
voltage and stability.

Dependencies - II
Supply voltage dependent parameters:
Voltage Gain, output voltage swing, input common mode voltage range,
power consumption and input offset current

Frequency dependent parameters:

voltage gain, input resistance, output voltage swing, input noise voltage
and noise current, CMRR

Temperature dependent parameters:

Absolute maximum power dissipation, input bias current, input offset
current power consumption, input resistance, output short circuit
current transient response and gain bandwidth product

An Ideal Op-Amp
1.
2.
3.
4.
5.
6.
7.

Infinite Voltage gain (A)

Infinite input resistance (Ri)
Zero output resistance(Ro)
Zero Vo when Vi = 0 V
Infinite Bandwidth
Infinite Common Mode Rejection Ration
Infinite Slew Rate