Power 7 Technical Excellence

IBM Power SystemsTM
IBM Systems & Technology Group
POWER7 Technical Excellence
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2010 IBM Corporation
IBM Power Systems
IBMs 2009 Patent Total: 17 yrs of Leadership

IBM
4,914
Samsung
3,611
Microsoft
2,906
Canon
2,206
Matsushita
1,829
Toshiba
1,696
Sony
1,680
Intel
1,537
Seiko Epson
1,330
HP
1,273
SUN
562
Apple
289
EMC
250
Oracle
208
Source: IFI Patent Intelligence
IBM Austin: 880 Patents
#1 IBM location for 7th year
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IBM Power Systems
Watson
IBM Research is building a computer system able to compete with humans at

the game of Jeopardy: Human vs. Machine contest.
Code-named Watson, Computer is designed to rival the human mind
Answering questions in the Jeopardy! format poses a grand challenge in
computer science:
Broad range of topics , such as history, literature, politics, popular culture and science
Nature of the clues, requires analyzing subtle meaning, irony, riddles and other complexities
Based on the science of Question Answering (QA), differs from conventional

search
Critical for implementing useful business applications such as:
Customer relationship management

Regulatory compliance
Help desk support
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IBM Power Systems
Agenda.
POWER7 Processor
POWER7 Servers
Power 750
Power 755
Power 770
Power 780
Power Blades
Gee Whiz Peak
Active Memory Expansion

Upgrades
I/O Update
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IBM Power Systems
POWER7 System Highlights

Balance System Design
Cache, Memory, and IO

POWER7 Processor Technology
6th Implementation of multi-core design

On chip L2 & L3 caches
POWER7 System Architecture
Blades to High End offerings

Enhances memory implementation
PCIe, SAS / SATA
Built in Virtualization
Memory Expansion
VM Control
Green Technologies
Processor Nap & Sleep Mode

Memory Power Down support
Aggressive Power Save / Capping Modes
Availability
Processor Instruction Retry

Alternate Process Recovery
Concurrent Add & Services
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IBM Power Systems
Power Systems Portfolio (Feb 2010)

Major Features:
Modular systems with linear scalability

PowerVM Virtualization
Physical and Virtual Management
Roadmap to Continuous Availability
Binary Compatibility
Energy / Thermal Management
595
Power 780
Power 770
Power 750
520
575
Operating Systems
BladeCenter
JS12 / JS22
JS23 / JS43
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Power 755
IBM Power Systems
POWER7 Systems Technology Value

Technology
Roadmap
Processor
Instruction Retry
Green Technology built in
Common architecture from Blades to High-end
Performance
Power
Systems scalability from blades to high end systems

Performance leadership in a variety of workloads
Best Performance per core
Memory and IO bandwidth
Virtualization
Consolidate
to higher levels
Virtualize Processors, Memory, and I/O
Dynamic movement of Partitions and Applications
Reduce infrastructure costs
Virt I/O Server

Shared I/O
Hypervisor
Single SMP Hardware System
RAS
Power
Systems mainframe inspired RAS features

Hot Add support / Concurrent Maintenance
Alternate Process Recovery
Operating Systems Availability Leadership
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IBM Power Systems
POWER7 Processor
POWER7
Processor
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IBM Power Systems
Processor Technology Roadmap
POWER7
POWER8
45 nm
POWER6
65 nm
POWER5
130 nm
POWER4
180 nm
Dual Core
Chip Multi Processing
Distributed Switch
Shared L2
Dynamic LPARs (32)
Dual Core
Enhanced Scaling
SMT
Distributed Switch +
Core Parallelism +
FP Performance +
Memory bandwidth +
Virtualization
2001
2004
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Dual Core
High Frequencies
Virtualization +
Memory Subsystem +
Altivec
Instruction Retry
Dyn Energy Mgmt
SMT +
Protection Keys
2007
Multi Core
On-Chip eDRAM
Power Optimized Cores
Mem Subsystem ++
SMT++
Reliability +
VSM & VSX (AltiVec)
Protection Keys+
Concept Phase
2010
IBM Power Systems
Processor Designs
POWER5
POWER5+
POWER6
POWER7
Technology
130 nm
90 nm
60 nm
45 nm
Size
389 mm2
245 mm2
341 mm2
567 mm2
Transistors
276 M
276 M
790 M
1.2 B
Cores
4/6/8
Frequencies
1.65 GHz
1.9 GHz
3-5 GHz
3-4 GHz
L2 Cache
1.9 MB Shared 1.9 MB Shared 4 MB / Core
256 KB / Core
L3 Cache
36 MB
36 MB
32 MB
4 MB / Core
Memory
Cntrl
2/1
LPAR
10 / Core
10 / Core
10 / Core
10 / Core
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IBM Power Systems
POWER7 Processor Chip

Cores : 8 ( 4 / 6 core options )
Local SMP Links
POWER7
CORE
L2 Cache
F
A
S
T
567mm2 Technology:
POWER7
CORE
POWER7
CORE
POWER7
CORE
L2 Cache
L2 Cache
L2 Cache
MC1
L3 Cache and
Chip Interconnect
L2 Cache
L2 Cache
L2 Cache
POWER7
CORE
POWER7
CORE
POWER7
CORE
POWER7
CORE
Remote SMP & I/O Links
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12 execution units per core

4 Way SMT per core up to 4 threads per core
32 Threads per chip
L1: 32 KB I Cache / 32 KB D Cache
L2: 256 KB per core
L3: Shared 32MB on chip eDRAM
Dual DDR3 Memory Controllers
Binary Compatibility with

POWER6
Equivalent function of 2.7B

eDRAM efficiency
Eight processor cores
L2 Cache
45nm lithography, Cu, SOI, eDRAM
Transistors: 1.2 B
L3 REGION
MC0
90 GB/s Memory bandwidth per chip
Scalability up to 32 Sockets
360 GB/s SMP bandwidth/chip

20,000 coherent operations in flight
IBM Power Systems
eDRAM technology
IBMs eDRAM technology benefits: Greater density, Less power
requirements, Fewer soft errors, and Better performance
Enables POWER7 to provide 32MB of internal L3 Cache
EDRAM Cell
L3 Cache critical to balanced design / performance:
6:1 Latency improvement for L3 accesses vs external L3
2X Bandwidth improvement with on chip interconnect. 32B busses
to and from each core
No off chip driver or receivers in L3 access path.
eDRAM is nearly as fast as conventional SRAM but requires far less

space
1/3 the space of conventional 6T SRAM implementation
1/5 the standby power
Soft Error Rate 250x lower than SRAM ( Better availability )
1.5 Billion reduction in transistors
IBM is effectively doubling microprocessor performance beyond what
DT
classical scaling alone can achieve, said Dr. Subramanian
Iyer, DE
(Distinguished Engineer)
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IBM Power Systems
POWER7 Core
64-bit PowerPC architecture v2.07
Execution Units
2 Fixed Point Units
2 Load Store Units
4 Double Precision Floating Point Units
1 Branch
1 Condition Register
1 Vector Unit
1 Decimal Floating Point Unit
6 Wide Dispatch
Units include distributed Recovery Function
VSX
FPU
DFU
ISU
FXU
IFU
CRU/BRU
Out of Order Execution
LSU
L2 Cache
Modes: POWER6, POWER6+ and POWER7

POWER7 continues to support VMX / Extends SIMD support with VSX
2 VSX units that can each handle 2 Double-Precision FP instructions

8 FLOPS per cycles
VSX units can also handle 4 Single Precision instructions per cycle
VSX instruction set support for vector and scalar instructions
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IBM Power Systems
POWER7 Modes: IBM i and AIX
IBM i
Release
Max Cores
& Threads Supported
POWER6
Mode
POWER7
Mode
IBM i 6.1
32 / 64
32 / 128
Special
Support
64/128
32 / 128
IBM i 7.1
32 / 64
Special
Support
64/128
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AIX
Release/TL
Max Cores
& Threads Supported
POWER6
Mode
POWER7
Mode
AIX 5.3
(All TLs
Supported
64 / 128
N/A
AIX 6.1 TL2,

TL3
64 / 128
N/A
32 / 128
AIX 6.1 TL4
64 / 128
64 / 256
64 / 256
AIX 6.1 TL5
64 / 128
64 / 256
AIX 7.1
64 / 128
256 / 1024
IBM Power Systems
POWER7 Modes: Linux

Linux
15
Max Processors
& Threads Supported
POWER6 Mode
POWER7 Mode
RHEL 5 ( Updates newer than U4)
64 / 128
N/A
SLES 10 SP# and newer
64 / 128
N/A
SLES 11 ( All Service Packs)
64 / 128
256 / 1024
RHEL 6 (Next major RHEL version)
64 / 128
256 / 1024
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IBM Power Systems
POWER7 Design
Physical Design:
8 cores with integrated cache and
memory controllers
4 / 6 / 8 Core options
45nm technology
Features:
4th Generation SMP Fabric Bus
3rd Generation Multi-Threading
New Power Bus
Energy Optimized Design
Multiple Memory Controllers
DDR3 memory support
Enhanced GX System Buses
On-Chip L2/L3 Cache
eDRAM L3 Cache
Industry Standard IO
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P
O
W
E
R
Core
Core
Core
Core
L2
L2
L2
L2
G
X
B
U
S
L3 Cache
L2
L2
L2
L2
Core
Core
Core
Core
S
M
P
F
A
B
R
I
C
Memory Interface
IBM Power Systems
Transition from POWER6

POWER6
L3
Ctrl
Core Vec
4 MB
L2
4 MB
L2
Memory
Cntrl
L3
Alti
Core
Fabric Bus
Controller
GX Bus Cntrl
L3
Ctrl
Memory
Cntrl
Alti
Vec
POWER7
Power your planet
Core
Core
Core
Core
L2
L2
L2
L2
G
X
B
U
S
L3 Cache
L2
L2
L2
L2
Core
Core
Core
Core
S
M
P
F
A
B
R
I
C
Memory Interface
GX+
Bridge
Memory+
L3
P
O
W
E
R
Memory+
Memory++
IBM Power Systems
Memory Channel Bandwidth Evolution

POWER5
POWER6
POWER7
Memory Performance:
2x DIMM
Memory Performance:
4x DIMM
Memory Performance:
6x DIMM
D
D
R
3
DDR2 @ 553 MHz

Effective Bandwidth:
1.1 GB/s
Power your planet
DDR2 @ 553 / 667 MHz

2.6 GB/sec
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
DDR3 @ 1066 MHz

6.4 GB/sec
IBM Power Systems
Multi-threading Evolution
Single thread Out of Order
S80 Hardware Multi-thread

FX0
FX1
FP0
FP1
LS0
LS1
BRX
CRL
FX0
FX1
FP0
FP1
LS0
LS1
BRX
CRL
POWER5 2 Way SMT
POWER7 4 Way SMT
FX0
FX1
FP0
FP1
LS0
LS1
BRX
CRL
FX0
FX1
FP0
FP1
LS0
LS1
BRX
CRL
No Thread Executing
Thread 2
Executing
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Thread 0
Executing
Thread 3
Thread 1
Executing
Executing
IBM Power Systems
POWER7 TurboCore Mode

TurboCore Chips: 4 available cores
Power POWER7
780 TurboCore
Chip Chip
Aggregation of L3 Caches of unused cores.

TurboCore chips have a 2X the L3 Cache
per Chip available

4 TurboCore Chips
L3 = 32 MB
Performance gain over POWER6.

Provides up to 1.5X per core to core
Chips run at higher frequency:
Power
reduction of unused cores.
With Reboot, System can be reconfigured

to 8 core mode.
ASM Menus
P
O
W
E
R
Core
Core
Core
Core
L2
L2
L2
L2
32 MB
L3 Cache
G
X
B
U
S
L2
L2
L2
L2
Core
Core
Core
Core
S
M
P
F
A
B
R
I
C
Memory Interface
TurboCores
Power your planet
Unused
Core
IBM Power Systems
POWER7 Core / Cache options

6-Core Chip
P
O
W
E
R
Core
Core
Core
Core
L2
L2
L2
L2
G
X
B
U
S
24 MB L3 Cache
L2
L2
L2
L2
Core
Core
Core
Core
S
M
P
F
A
B
R
I
C
Memory Interface
Power 750 & Power 770

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IBM Power Systems
POWER7 SMT4
Requires POWER7 Mode
POWER6 Mode supports SMT1 and SMT2
Standard Cache Option

All cores active
Operating System Support
AIX 6.1 and AIX 7.1

IBM i 6.1 and 7.1
Linux
Dynamic Runtime SMT scheduling
Spread work among cores to execute in

appropriate threaded mode
Can dynamical shift between modes as
required: SMT1 / SMT2 / SMT4
LPAR-wide SMT controls
ST, SMT2, SMT4 modes

smtctl / mpstat commands
Mixed SMT modes supported within same

LPAR
Requires use of Resource Groups
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IBM Power Systems
IBM Confidential
POWER7 Multi-threading Options

TurboCore option
50% of the cores active
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MaxCore option
All cores active
Based of rPerf workload

IBM Power Systems
Fully Optimized POWER7 Module Packaging

2/4s Blades and Racks
Single Chip Organic
Distributed Enterprise/SMB, Infrastructure Consolidation
High-End and Mid-Range

Single Chip Glass Ceramic
Large Scale Enterprise and Server Consolidation
Compute Intensive
Quad-chip MCM
Glass ceramic targets leadership performance, scalability and reliability

Designed for enterprise database, ERP, CRM and decision support
Ideal for mission-critical and highly virtualized environments
Supports scalability up to 32 sockets
Massive Scale-Out
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Low-cost organic module designed for 2/4 socket platforms

Targets infrastructure consolidation, distributed enterprise and SMB
Targets sweet spot of performance, scalability and reliability
High-density, low-power options
Quad-chip MCM targets high octane MFLOP engines

Targets unparalleled capacity for modeling complex systems and computeintensive research
Scales up to 256 w eight-core processors per server and networked clusters
of thousands of servers driving >PFLOP capability
IBM Power Systems
POWER7 Offerings
Power 780
Power 750
Power 755
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Power 770
IBM Power Systems
High-End / Mid-Range Packaging
High-End and Mid-Range

Single Chip Glass Ceramic (61mm)
3363 Pins
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IBM Power Systems
POWER7
Core Offerings
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IBM Power Systems
Processor Offerings for Blades / Rack / HPC

Cores / Socket
PS700 / 701 / 702
POWER7 Processor Offerings

4
6
Yes
Yes
Power 750
Yes
Yes (3)
Power 755
Yes
Sockets
Configuration Options
2
6 Core Chips
6 Cores
12 Cores
18 Cores
24 Cores
8 Core Chips
8 Cores
16 Cores
24 Cores
32 Cores
1-4 Socket System
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IBM Power Systems
Processor Offerings for Modular Systems

POWER7 TurboCore / CoD Processor Offerings
Cores /
Socket
4 TurboCore
8 Base
8 Enhanced
Power 770
Yes
Yes
Power 780
Yes
Yes
Enclosures
Configuration Options
1
2
4 Core Chips
8 Cores
16 Cores
24 Cores
32 Cores
6 Core Chips
12 Cores
24 Cores
36 Cores
48 Cores
8 Core Chips
16 Cores
32 Cores
48 Cores
64 Cores
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IBM Power Systems
Energy
Management
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IBM Power Systems
EnergyScale
EnergyScale is IBM Trademark. It consists of a built-in Thermal Power Management
Device (TPMD) card and Power Executive software.
IBM Systems Director is also required to manage Energy-Scale functions.
EnergyScale is used to dynamically optimizes the processor performance versus
processor power and system workload.
IBM Systems Director is also required to manage AEM functions and supports the
following functions:
Power Trending
Thermal Reporting
Static Energy Saver Mode
Dynamic Energy Saver Mode
Energy Capping
Soft Energy Capping
Processor Nap
Energy Optimized Fan Control
Altitude Input
Processor Folding
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31
IBM Power Systems
Definition of Terms
Energy Trending
EnergyScale provides continuous collection of real-time server
energy consumption. This energy usage data may be displayed or
exported by IBM Systems Director Active Energy Manager.
Administrators may use such information to predict data center

energy consumption at various times of the day, week, or month.
Thermal Reporting
A measured ambient temperature and a calculated exhaust heat
index temperature can be displayed from Active Energy Manager.
This information can help identify data center hot-spots that need
attention.
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32
IBM Power Systems
Definition of Terms
StaticEnergy Saver Mode
Static Energy Saver lowers the processor frequency and voltage on
an Power 750 a fixed amount, reducing the energy consumption of
the system while still delivering predictable performance.
This percentage is predetermined to be within a safe operating limit

and is not user configurable.
Active Energy Manager is the recommended user interface to

enable/disable Energy Saver mode.
Energy Saver could be enabled based on regular variations in

workloads, such as predictable dips in utilization over night, or over
weekends.
Energy Saver can be used to reduce peak energy consumption,

which can lower the cost of all power used.
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33
IBM Power Systems
Definition of Terms continued

Dynamic Energy Saver Mode
Dynamic
Energy Saver varies processor frequency and voltage based on the utilization of the
Power 750 POWER7 processors.
The
user must configure this setting from Active Energy Manager.
Processor
frequency and utilization are inversely proportional for most workloads, implying that as
the frequency of a processor increases, its utilization decreases, given a constant workload.
Dynamic
Energy Saver takes advantage of this relationship to detect opportunities to save power,
based on measured real-time system utilization.
When
a system is idle, the system firmware will lower the frequency and voltage to Static Energy
Saver values.
When
fully utilized, the maximum frequency will vary, depending on whether the user favors
power savings or system performance.
If an administrator prefers energy savings and a system is fully-utilized, the system will reduce
the maximum frequency to 95% of nominal values.
If performance is favored over energy consumption, the maximum frequency will be at least
100% of nominal.
Dynamic Energy Saver is mutually exclusive with Static Power Saver mode.
Only one of these modes may be enabled at a given time.
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34
IBM Power Systems

Energy Capping
Power Capping enforces a user specified limit on energy
consumption.
The user must set and enable an energy cap from the Active Energy
Manager user interface.
In most data centers and other installations, when a machine is

installed, a certain amount of energy is allocated to it.
Generally, the amount is what is considered to be a safe value, and

it typically has a large margin of reserved, extra energy that is never
used. This is called the margined power.
The main purpose of the energy cap is not to save energy but rather
to allow a data center operator the ability to reallocate energy from
current systems to new systems by reducing the margin assigned to
the existing machines.
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35
IBM Power Systems

Soft Energy Capping
There are two power ranges into which the power cap may be set .
When
a power cap is set in the guaranteed range (described above),

the system is guaranteed to use less energy than the cap setting.
Setting
a energy cap in this region allows for the recovery of the

margined power, but in many cases cannot be used to save energy.
Soft
power capping extends the allowed energy capping range further,

beyond a region that can be guaranteed in all configurations and
conditions.
If
the energy management goal is to meet a particular energy

consumption limit, then soft energy capping is the mechanism to use.
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36
IBM Power Systems

Processor Nap
The IBM POWER7 processor uses a low-power mode called Nap
that stops processor execution when there is no work to do on that
processor core.
The
latency of exiting Nap falls within a partition dispatch (context

switch) such that the Hypervisor firmware can use it as a general
purpose idle state.
When
the Operating System detects that a processor thread is idle,

it yields control of a hardware thread to the Hypervisor.
The
Hypervisor immediately puts the thread into Nap.
When
the operating system yields control of the second thread and

the processor core belongs to a dedicated processor partition, the
second thread enters Nap mode
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37
IBM Power Systems

Processor Nap
If the processor core is in a shared processor pool (the set of cores
being used for micro-partition dispatching) and there is no micropartition to dispatch, the Hypervisor puts the second thread into
Nap mode.
By
entering Nap mode, it allows the hardware to clock off most of

the circuits inside the processor core.
Reducing active energy consumption by turning off the clocks
allows the temperature to fall, which further reduces leakage
(static) power of the circuits causing a cumulative effect.
Unlicensed
cores are kept in core Nap until they are licensed and
return to core Nap whenever they are unlicensed again.
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38
IBM Power Systems

Energy-Optimized Fan Control and Altitude Input
On the Power 750, firmware will dynamically adjust fan speed based on
energy consumption, altitude, ambient temperature, & energy savings
modes.
Systems
are designed to operate in worst-case environments, in hot

ambient temperatures, at high altitudes, & with high power components.
In
a typical case, one or more of these constraints are not valid.
When
no power savings setting is enabled, fan speed is based on ambient

temperature, and assumes a high-altitude environment.
When
a power savings setting is enforced (either Static Energy Saver or

Dynamic Energy Saver) fan speed will vary based on power consumption,
ambient temperature, & altitude (if available).
System
altitude may be set (Active Energy Manager). If no altitude is set,

system will assume a default value of 350 meters above sea level.
Power your planet
39
IBM Power Systems

Processor Folding
Processor Folding is a consolidation technique that dynamically
adjusts, over the short-term, the number of processors available for
dispatch to match the number of processors demanded by the
workload.
As
the workload increases, the number of processors made

available increases; as the workload decreases, the number of
processors made available decreases.
Processor
Folding increases energy savings during periods of low

to moderate workload because unavailable processors remain in
low-power idle states longer.
Power your planet
40
IBM Power Systems
POWER7
TPMD
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IBM Power Systems
TPMD: Thermal Power Management Device
TPMD card is part of the base hardware configuration.

Residing on the processor planar
TPMD function is comprised of a risk processor and data acquisition
TPMD monitor power usage and temperatures in real time
Responsible for thermal protection of the processor cards
Can adjust the processor power and performance in real time.
If the temperature exceeds an upper (functional) threshold, TPMD
actively reduces power consumption by reducing processor voltage
and frequency or throttling memory as needed.
If the temperature is lower than upper (functional) threshold, TPMD
will allows POWER7 cores to Over clock if workloads demands are
present.
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IBM Power Systems
POWER7 Over Clock Uplift
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IBM Power Systems
Active Energy Manager Benefits:

Monitor energy consumption to allow better utilization of available energy resources.
Can trend actual energy consumption and corresponding thermal loading of IBM
Systems running in their environment with their applications. :
Allocate
less power and cooling infrastructure to IBM servers

Lower power usage on select IBM servers
Plan for the future by viewing trends of power usage over time
Determine power usage for all components of a rack
Retrieve temperature and power information via wireless sensors
Collect alerts and events from facility providers related to power and cooling equipment
Better understand energy usage across your data center.

Identify
energy usage
Measure cooling costs accurately
Monitor IT costs across components
Manage by department and/or user
Active Energy Manager also provides a source of energy management data that can be
exploited by Tivoli enterprise solutions such as IBM Tivoli Monitoring and IBM Tivoli
Usage and Accounting Manager.
Power your planet
44
IBM Power Systems
POWER7
Model 750
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IBM Power Systems
Power 750 Product Features

Features of the Power 750:8233-E8B
POWER7
processor with multiple cores

32-ways (8 cores/processor card x 4 processor cards)
Industry Standard RDIMM, DDR3 1066 Mbps with enhanced memory RAS features including
64-byte marking ECC code, and ChipKill detection and correction.
512 GB maximum (16GB/DIMM x 8 DIMMs/processor card x 4 processor cards)
8 hot plug and front access SFF SAS DASD.
1 slim media bay for DVD.
1 half high bay for tape drive.
Hot plug 3 PCIe slots and two PCIX slots with Enhanced Error Handling.
One GX+ slot and one GX++ slot (not hot pluggable)
Hot plug and redundant power.
Hot plug and redundant cooling.
Support for Logical Partitioning (LPAR) and Dynamic LPAR (DLPAR).
Embedded SAS and SATA
Embedded four 1 Gigabit Ethernet devices or two 10 Gigabit Ethernet devices
Embedded USB
Service Processor FSP-1 for enhanced reliability and remote system management
Rack mountable drawer
Power your planet
46
IBM Power Systems
Power 750 System

8233-E8B
4U
Depth: 28.8
Power your planet
POWER7 Architecture
6 Cores @ 3.3 GHz

8 Cores @ 3. 0, 3.3, 3.55 GHz
Max: 4 Sockets
DDR3 Memory
Up to 512 GB
System Unit SAS SFF Bays
Up to 8 Drives (HDD or SSD)

73 / 146 / 300GB @ 15k (2.4 TB)
(Opt: cache & RAID-5/6)
System Unit
IO Expansion Slots
PCIe x8: 3 Slots (2 shared)

PCI-X DDR: 2 Slots
1 GX+ & Opt 1 GX++ 12X cards
Integrated SAS / SATA
Yes
System Unit
Integrated Ports
3 USB, 2 Serial, 2 HMC
Integrated Virtual Ethernet
Quad 10/100/1000
Optional: Dual 10 Gb
System Unit Media Bays
1 Slim-line DVD & 1 Half Height
IO Drawers w/ PCI slots
PCIe = 4 Max: PCI-X = 8 MAX
Cluster
12X SDR / DDR (IB technology)
Redundant Power and

Cooling
Yes (AC or DC Power)

Single phase 240 VAC or -48 VDC
Certification (SoD)
NEBS / ETSI for harsh environments
EnergyScale
Active Thermal Power Management

Dynamic Energy Save & Capping
IBM Power Systems
Power 750 System Overview

TPMD
3 PCIe & 2 PCI-X

Slots
Dual Power
Supplies
Half-High Bay
(tape or removable disk
Up to 4
Processor / Memory
Cards
DVD
Fans
8 SFF Bays
(Disk or SSD)
Power your planet
IBM Power Systems
Power 750 Front View

Operator Panel
Tape Drive
Remove DASD Bay
DVD Drive
Power
Supplies
Power your planet
8 SFF DASD / SSD
49
IBM Power Systems
Power 750 Rear View

SAS Port
IVE
Ethernet
PCIe
Slot 2
or
GX+ Slot
PCIX
Slot 4
SPCN
System
Port 1
System
Port 2
USB
Ports
Power your planet
HMC
Ports
PCIe
Slot 1
or
GX++ Slot
PCIe
Slot 3
PCIX
Slot 5
50
IBM Power Systems
Processor Card
Processor
VRM
4 DIMM Slots
POWER7
chip
Enhanced Buffer controller
4 DIMM Slots
Memory VRM
Processor Cards
6-core 3.3 GHz
#8335 1 to 4 per
server
8-core 3.0 GHz
#8332 1 to 4 per
server
8-core 3.3 GHz
#8334 1 to 4 per
All processor cards on the same server must be identical feature code
server
8-core
#8336 4 per server
Power your
planet3.55 GHz
51
IBM Power Systems
Power 750 System Layout
Power
Supply 1
Power
Supply 2
Anchor Card
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
SN
SN
SN
POWER7
Chip
POWER7
Chip
POWER7
Chip
POWER7
Chip
SN
SPCN1
SPCN2
HMC1
HMC2
S1
S2
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
GX++ Slot
TPMD
FSP
GX+ Slot
MUX
Tape Drive
SLIM
DVD
8 SFF / SSD
DASD
Op-Panel
Ext SAS
2nd Proc / Memory

Card required for
GX++ Bus
DASD
&
Media
Back
Plane
Cache RAID Card (opt)
USB
PCI-X S5
PCI-X S4
PCIe S3
PCIe S2
PCIe S1
SAS
Controller
IO Controller
USB
USB
USB
ENET
PHY
RJ45
RJ45
ENET
PHY
RJ45
RJ45
Aux Write Cache (opt)
Power your planet
52
IBM Power Systems
Memory Options for Power 750 / 755

Power 750
Feature
Size (2 DIMM)
DIMM
Size
Memory
Speed
750 Max
Memory
8 GB
4 GB
1066 MHz
128 GB
16 GB
8 GB
1066 MHz
256 GB
32 GB
16 GB
1066 MHz
512 GB
Power 755
Feature
Size (2 DIMM)
DIMM
Size
Memory
Speed
750 Max
Memory
8 GB
4 GB
1066 MHz
128 GB
16 GB
8 GB
1066 MHz
256 GB
Power your planet
IBM Power Systems
Power 750 Memory

8 DDR3 DIMM slots per processor card
# Proc card
DIMM slots
16
24
32
8 / 256
8 / 384
8 / 512
Min/Max GB 8 / 128
DIMMS: 4GB, 8GB and 16GB

Plugged in pairs. 1 feature code = 1 pair
Min = 1 feature per SERVER, but min 1 feat per Proc card recommended
Can NOT mix different size DIMMs on same processor card
Can have different size DIMMs on same server.
The following is for ONE processor card in the Power 750
One proc card GB memory capacity with
1 Pair
2 Pair
3 Pair
4 Pair
Feature
Code
4 GB
16
24
32
#4526
16
8 GB
16
32
48
64
#4527
32
16 GB
32
64
96
128
#4528
64
DIMM size
Power your planet
Feature
GB
IBM Power Systems
POWER7 Memory Bandwidth (750 / 755 / Blades )

POWER7
Nova
Nova
Mem
Cntrl
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
Nova
Nova
Each Nova Chip

(Read/Write Buffer)
supports two DIMMS
Chip Bandwidth
Max Read Bandwidth:
51.168 GB/sec
Max Write Bandwidth:
25.584 GB/sec
Max Combined Bandwidth: 68.224 GB/sec
Power your planet
IBM Power Systems
Power 750 Bandwidth @ 3.55 GHz

Memory
Bandwidth
L1 ( Data )
170.4 GB/sec
L2
170.4 GB/sec
L3
113.6 GB/sec
Memory
68.224 GB/sec per Socket

272.896 GB/sec per System
Intra-Node
Buses
6.4 GB/sec
20 GB/sec
10 GB/sec ( Shared )
GX++ Bus (12X DDR)

GX+ Bus (12X SDR)
20 GB/sec
5** GB/sec
5** GB/sec
30 GB/sec
GX Bus Slot 1
GX Bus Slot 2
Internal IO Slots
Total IO Bandwidth
** Pass thru bus
Power your planet
IBM Power Systems
Power 750 PCIe and PCI-X Slots

Speed
Peak
Bandwidth
GX+
Internal
Slots
1.25 GHz
5.0 GB/s simplex

10.0 GB/s duplex
PCIe x8
2.5 GHz
2 GB/s simplex
4 GB/s duplex
GX++
(12X DDR)
2.5 GHz
PCIe x8
2.5 GHz
GX+
(Pass-Thru)
PCIe x8
Slot # Description
N/A
Card Size
Concurrent
Maintenance
Connector
N/A
Standard PCI
Short card
Hot Plug
PCIe x8
Short card
No Hot Plug
GX++ Bus
2 GB/s simplex
4 GB/s duplex
Standard PCI
Short card
Hot Plug
PCIe x8
625 MHz
2.5 GB/s simplex

5.0 GB/s duplex
Short card
No Hot Plug
GX+ Bus
2.5 GHz
2 GB/s simplex
4 GB/s duplex
Standard PCI
Long card
Hot Plug
PCIe x8
Slot 4 PCI-X DDR
266 MHz
2.13 GB/s
Standard PCI
Long card
Hot Plug
PCI-X 64b
Slot 5 PCI-X DDR
266 MHz
2.13 GB/s
Standard PCI
Long card
Hot Plug
PCI-X 64b
Slot 1
Slot 2
Slot 3
10 GB/s simplex
20 GB/s duplex
All PCIe or PCI-X slots are hot-pluggable

All PCIe or PCI-X slots Enhanced Error Handling (EEH)
Power your planet
IBM Power Systems
Power 750 IO and Storage Drawers

FC
Order #
Max
Number
Description
Status
FC 5796
PCI-X I/O Drwr
Available
12X
FC 5802
PCIe I/O Drwr

(Disk Bays)
Available
12X
FC 5877
PCIe I/O Drwr

(No Disk Bays)
Available
12X
FC 5886
Exp 12S SAS Disk Drwr
Available
12X
48
7314-G30
Interface
PCI-X I/O Drwr
Supported 12X
FC 5786
EXP24 SCSI Disk Drwr
Supported SCSI
24
FC 5787
(Power 750)
EXP24 SCSI Disk Tower
Supported SCSI
24
7031-D24
7031-T24
EXP24 SAS Disk Drwr

EXP24 SAS Disk Tower
Supported
24
Power your planet
SCSI
IBM Power Systems
POWER7 750 PCIe IO Drawer configurations

750
750
20
GB
PCIe
20
GB
One PCIe IO Drawer
20
GB
750
5**
GB
PCIe
Two PCIe IO Drawers
Recommend: use GX++ (12X DDR) 1st

Power your planet
PCIe
PCIe
PCIe
Three PCIe IO Drawers
PCIe
750
5**
GB
20
GB
PCIe
PCIe
PCIe
PCIe
Four PCIe IO Drawers

IBM Power Systems
POWER7 750 Mixed IO Drawer Examples

750
PCI-X
+
+
PCI-X
750
PCIe
+
+
Two IO Drawers
Recommendations
PCIe drawers (12X DDR) on
GX++ (12X DDR)
PCI-X drawers (12X SDR) on
GX+ (12X SDR)
Rules:
Can not mix PCI-X and PCIe
drawers on the same 12X loop
GX+ or GX++ can attach either
PCIe or PCI-X drawers
Power your planet
PCIe
PCIe
Three IO Drawers
PCI-X
PCI-X
750
PCI-X
+
+
PCIe
PCIe
Five IO Drawers
IBM Power Systems
Split DASD Backplane Feature

FC 3669 internal SAS cable for Split DASD mode is used to put Lahaina in Split DASD mode.
Where 4 SFF DASD on left (from front view) are assigned to the integrated SAS controller, and 4 SFF
DASD on right are assigned to the external rear SAS port.
A PCIe or PCI-X SAS adapter (such as FC 5900 or FC 5901) can access the right 4 SFF
DASD via an external SAS cable as shown on a picture below.
Note that the internal Split DASD Mode SAS cable FC 3669 replaces the internal SAS cable
FC 3668.
These four (D3-D6) are assigned

to SAS controller
These four (D7-D10) are

assigned to external rear
SAS port.
Front View of Storage Bay
Power your planet
61
IBM Power Systems
Power 750 Internal USB Removable Disk Drive

Alternative to DLT, VXA, DAT72 or 8mm tape drives
Faster
than tape / 20MB/s Sustained Transfer Rate
Lower
total cost of ownership
USB drives have longer life than tape cartridges

No cleaning cartridges
Inexpensive docking stations
AIX and Linux support

Capacities: 160GB and 500GB
USB 2.0
Designed for BACKUP and RESTORE type processes ONLY.
NOT designed to be used as a regular disk drive.
No compression, Data can be compressed by operating system and passed
to the USB RDD
Power your planet
62
IBM Power Systems
Power 750 Information.

Physical Specifications:
Width:
440 mm (17.3 in)

Depth: 730.8 mm (28.8 in)
Height: 175 mm (6.89 in)
Weight: 54.4 kg (120 lb)
Operating voltage:
200 to 240 V
Operating Frequency: 50/60 Hz
Power Consumption: 1950 watts (maximum)
Power Factor: 0.97
Thermal Output: 4778 Btu/hour (maximum)
Power-source Loading
1.443 KVA (maximum configuration)
Noise Level and Sound
Rack-mount drawer: 7.0 Bels operating
Power your planet
IBM Power Systems
Functional Differences
Power 550
Power 750
Up to 8 Cores (4 sockets)
Up to 32 Cores (4 sockets)
Up to 256 GB Memory
32 DIMM slots
Up to 512 GB Memory
32 DIMM slots
DDR2 DIMMS
DDR3 DIMMs
6 3.5 in or 8 SFF SAS disk/SSD
8 SFF SAS disk/SSD
3 PCIe & 2 PCI-X slots
3 PCIe & 2 PCI-X slots
Commercial focus
Commercial & HPC focus
GX Bus & GX Passthru Slots
GX Bus & GX Passthru Slots
IVE: Dual Gb
Optional: Quad Gb, or 10 Gb
IVE: Quad Gb
Optional: Dual 10 Gb
TPMD
Enhanced TPMD
Guiding Light
Light Path
Power your planet
IBM Power Systems
Power 750 Express IBM Editions

Minimum hardware definition
No free processor activations
1 proc card, SFF backplane, DVD-RAM, 1 memory feature, 2 power
supplies, operator panel, IVE daughter card, and 1 or 2 disk/SSD
unless using SAN, 2 power cords
750 rule: 100% processor activations, no CUoD/CoD
IBM Edition (generic to AIX, IBM i, Linux)

Minimum edition definition entitles client to the processor cores
activated at no charge
Available at initial purchase only (later activations chargeable)
Edition memory minimum = 4 GB per core (or more)
Edition I/O minimum = 2 disk or 2 SSD or 2 FC or 2 FCoE (or more)
Do not need licensing for unused cores
Power your planet
IBM Power Systems
Comparative Information.
Power your planet
IBM Power Systems
Bandwidth Properties
Power your planet
IBM Power Systems
POWER7 / POWER6 Comparison
Power 750: 32 Cores
Power your planet
Power 550: 8 Cores
Power 560: 16 Cores Active

IBM Power Systems
Power 750 CPW Performance
Power 550
8 Core
@ 5GHz
Power your planet
Power 560
16 Core
@ 3.6GHz
Power 750
32 Core
@ 3.55GHz
IBM Power Systems
Power 750 vs Power 550 / 560

Performance* / KW
Performance* / K BTU
* Calculated on rPerf, CPW results siimilar
Power your planet
IBM Power Systems
POWER7
Model 755
Power your planet
IBM Power Systems
Power 755 HPC: 8236-E8C

Power 755 / Power 750 Differences:
1.Only an 8-core 3.3GHz will be offered
2.Valid configuration is 32-core 3.3GHz (i.e. 4 processor cards).
3.No 16GB DIMM - Maximum memory is 256GB.
4.No IBM i O/S support
5.No PowerVM features (i.e. no LPAR or DLPAR)
6.No RAID feature (CCIN 57B7 & 57B8)
7.No Split Disk feature
8.No tape drive
9.No external I/O Drawers (e.g. Tres 19 Drawers)
10.No IB 12x SDR adapter (CCIN 1817)
Power your planet
73
IBM Power Systems
Power 755
4-Socket HPC System

8236-E8C
POWER7 Architecture
4 Processor Sockets = 32 Cores

8 Core @ 3.3 GHz
DDR3 Memory
128 GB / 256 GB, 32 DIMM Slots
System Unit
SAS SFF Bays
Up to 8 disk or SSD
73 / 146 / 300GB @ 15K (up to 2.4TB)
System Unit
Expansion
PCIe x8: 3 Slots (1 shared)

PCI-X DDR: 2 Slots
GX++ Bus
Integrated Ports
3 USB, 2 Serial, 2 HMC
Integrated Ethernet
Quad 1Gb Copper

(Opt: Dual 10Gb Copper or Fiber)
System Unit Media Bay
1 DVD-RAM ( No supported tape bay )
Cluster
Up to 64 nodes
Ethernet or IB-DDR
Redundant Power
Yes (AC or DC Power)

Single phase 240vac or -48 VDC
Certifications (SoD)
NEBS / ETSI for harsh environments
EnergyScale
Active Thermal Power Management

Dynamic Energy Save & Capping
4U x 28.8 depth
Up to 8.4 TFlops per Rack
( 10 nodes per Rack )
5.3 / 6.1
RHEL / SLES
Power your planet
IBM Power Systems
Power 755 System Layout
Power
Supply 1
Power
Supply 2
Anchor Card
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
SN
SN
SN
POWER7
Core
POWER7
Chip
POWER7
Chip
POWER7
Chip
SN
SPCN1
SPCN2
HMC1
HMC2
S1
S2
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
GX++ Slot
TPMD
FSP
MUX
SLIM
DVD
8 SFF / SSD
DASD
Op-Panel
Ext SAS
DASD
&
Media
Back
Plane
USB
PCI-X S5
PCI-X S4
PCIe S3
PCIe S2
PCIe S1
SAS
Controller
Power your planet
IO Controller
USB
USB
USB
ENET
PHY
RJ45
RJ45
ENET
PHY
RJ45
RJ45
75
IBM Power Systems
Power 755 HPC Cluster Node

1H / 2010
IB-DDR
Interconnect
Data Center in a Rack

Up to 10 Nodes per Rack
Air cooled
Power your planet
Scaling
64 nodes (32 Cores/node)

54 TFlops
Operating
Systems
AIX 6.1 TL 04 / 05
Linux
HPC Stack
Levels
xCAT v2.3.x
GPFS v3.3.x
PESSL v3.3.x
LL v4.1.x
PE v5.2.x
ESSL
Beta (GA 06/2010)

ESSL v5.1
Compilers
GA Levels
XLF v13.1
VAC/C++ v11.1
IBM Power Systems
Power 755 Memory
Latency (cycles/ns)
Bus
Memory Controllers
per chip
Peak Bandwidth
per chip
DRAM Technology
Power your planet
POWER5+ 575
(1.9GHz)
Power 575
(4.7GHz)
Power 755
(3.3GHz)
220 cycles / 110ns
420 cycles / 90ns
336 cycles / 102ns
2 X DRAM Freq
4 X DRAM Freq
6 X DRAM Freq
1 per chip
1 (2 in HE)
25GB/s
34GB/s
68 GB/s
DDR2
DDR2
DDR3
IBM Power Systems
Power 755 vs Power 575

Power 755
Power 575
Cores/chip
Total cores
32
32
Frequency
3.3 GHz
4.7 GHz
Memory (max)
256 GB
256 GB
Performance /
TFlops
.84
.6
Cooling
Air
Water
Cores/rack
Rack type
320
19
448
24
Power (Watts)
(Linpack)
1650
5400
755 offers the same core count per node

40% better performance per node
1/3 the power per node
37% less floor space for a 64 node configuration.
Power your planet
IBM Power Systems
Power 755 vs. 750 Offering Structures

Feature
750
755
Processors
32-core @ 3.3 GHz
32-core @ 3.55 GHz

6 / 12 / 18 / 24-core @ 3.3 GHz
8 / 16 / 24 / 32-core @ 3.0 GHz
Memory
128GB OR 256GB
4GB & 8GB DIMMS
512GB Max.
4GB, 8GB, 16GB DIMMS
GX slot support
Yes IB clustering
Yes
I/O Drawer support
No
Yes
DASD Backplane
No Split Backplane
Split Backplane support
Integrated Ethernet
Quad GbE or Dual 10GbE
Quad GbE or Dual 10GbE
Virtualization
No PowerVM support
PowerVM Std and Ent
DASD / Bays
8 SFF SAS HDD / SDD

10k and 15K SFF drives
8 SFF SAS HDD / SDD

10k and 15K SFF drives
Optional RAID
Internal Tape
No
Yes
Performance Metric
TFLOPS
rPerf
Misc.
No IBM i Support
No H/W Raid Cards
IBM i Support
H/W Raid Cards
Power your planet
IBM Power Systems
Power 750 MES Upgrade

Upgrades consist of a box of parts and may be installed by the customer if they
so choose.
Other upgrades require an IBM CE or IBM Business Partner to install them
depending upon complexity.
MES
Processor
Memory DIMMs
PCI Adapters
GX Adapters
HEA Cards
Disks
DVD Device
Tape Drive
RAID Cards
I/O Drawer
I/O Drawer
Power your planet
Add or Replace
Both
Both
Both
Both
Replace
Both
Replace
Add
Add
Add
Add
Concurrent
Upgrade
No
No
Yes
No
No
Yes
Yes
No
No
Yes
Yes
Customer
Installable
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
80
IBM Power Systems
POWER7
Model 770
Model 780
Power your planet
IBM Power Systems
Power 770
Power 770
Processor Technology
6 Cores @ 3.55 GHz

8 Cores @ 3.1 GHz
L3 Cache
4U x 32 inches Depth
Redundant Power & Cooling
Yes
Redundant Server Processor
Yes / Two Enclosure minimum
Redundant Clock
Concurrent Add Support
Yes
Concurrent Service
Yes
System Unit
Single Enclosure
4 Enclosures
Processors
Up to 2 Sockets
8 Sockets
Up to 512 GB
Up to 2 TB
24
DDR3 Memory (Buffered)

SAS/SSD SFF Bays
DVD-RAM Media Bays
1 Slim-line
4 Slim-line
SAS / SATA Controller
2/1
8/4
6 PCIe
24 PCIe
PCIe bays
GX++ Slots (12X DDR)
Maint Coverage: 9 x 5
Integrated Ethernet
USB
12X I/O Drawers w/ PCI slots
Power your planet
On Chip
Std: Quad 1Gb

Opt: Dual 10Gb +
Dual 1 Gb
3
Max: 4 PCIe, 8 PCI-X
Std: Four Quad 1Gb

Opt: Four x Dual 10Gb +
Dual 1 Gb
12
IBM Power Systems
Power 780
Power 780
Processor Technology
4 Cores @ 4.1 GHz

8 Cores @ 3.8 GHz
L3 Cache
Yes
Redundant Server Processor
Redundant Clock
Concurrent Add Support
Yes
Concurrent Service
Yes
System Unit
Single Enclosure
4 Enclosures
Processors
2 Sockets
8 Sockets
Up to 512 GB
Up to 2 TB
24
SAS/SSD SFF Bays (CEC)
PowerCare Support
DVD-RAM Media Bays
1 Slim-line
4 Slim-line
SAS / SATA Controller
2/1
8/4
6 PCIe
24 PCIe
PCIe (CEC)
GX++ Slots (12X DDR)
Integrated Ethernet
USB
12X I/O Drawers w/ PCI slots
Power your planet
On Chip
Redundant Power & Cooling
DDR3 Memory (Buffered)
Maint Coverage
24 X 7
TurboCore
Std: Quad 1Gb

Opt: Dual 10Gb +
Dual 1 Gb
3
Std: Four Quad 1Gb

Opt: Four x Dual 10Gb +
Dual 1 Gb
12
IBM Power Systems
POWER7 Modular Layout
GX
Slots
PCIe
Slots
POWER7
Processor
Chip
16 DIMM slots
TPMD
6 SFF
Bays
FSP
POWER7
Processor
Chip
Interconnect
Power your planet
IBM Power Systems
POWER7 Modular Front View

Fans
Fabric
Interconnects
DVD
6 SFF Bays
Power your planet
Op Panel
IBM Power Systems
POWER7 Modular Rear View

FSP
Connectors
Two GX++ Bays
HMC
HMC
Ports
Ports
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
Two Power
Supplies
SPCN
Ports
IVE
Ports
Power your planet
USB
Ports
Serial
Port
IBM Power Systems
POWER7 Modular System View

SFF
Fan
Memory DIMMs
Qty: 4
GX++ (12X)
Power
Socket
Fan
PCIe Slot
Fan
Regulator
Memory DIMMs
Qty: 8
PCIe Slot
PCIe Slot
Fan
PCIe Slot
TPMD
Socket
Fan
Memory DIMMs
Qty: 4
PCIe Slot
PCIe Slot
FSP & Clock

16 DIMM cards
Power your planet
IBM Power Systems
Power 770 and Power 780 Processor Options

Memory
Socket
Memory
Socket
Memory
Power 770 Processor Options (2 Sockets per enclosure )

12-core 3.5 GHz #4980 1 to 4 per server
Power 780 Processor Options (2 Sockets per enclosure )
8-core 4.14 GHz #4982 1 to 4 per server - Turbo Core
Power your planet
IBM Power Systems
Modular Block Diagram..

DRAM
DRAM
DRAM
DRAM
8 SN
Dimms
A/B Buses
A/B Buses
DRAM
DRAM
DRAM
DRAM
SN
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
PWR7
DRAM
DRAM
PWR7
DRAM
DRAM
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
PSI
TPMD
GX++
Busses
PSI
GX++
Busses
I/O
Backplane
IOC2
PCI-X
IVE
PCIe
Buses
P
C
I
e
P
C
I
e
GX++
GX++
Write Cache
SAS
EXP
SAS
EXP
Write Cache
PCIe Buses
P
C
I
e
DRAM
DRAM
PCI-X
P
C
I
e
DRAM
DRAM
IOC2
2 x HMC
DRAM
8 SN
Dimms
SN
CPU CARD
FSP
Card
X Bus
Y Bus
Z Bus
DRAM
P
C
I
e
P
C
I
e
IVE
USB
SATA
Media
DASD Backplane
Serial
Anchor
Card
Ext
SAS
IVE
RAID
RAID
Battery Battery
USB Serial
4 x 1Gb Eth
Power your planet
IBM Power Systems
Cooling Domains
Fans (5)
Air Flow Domain 1
Air Flow Domain 2
Front
Power Supply Fans

(built-in)
Rear
POWER7 Modular supports Hot-Plug and Redundant cooling.

There are five fans across the front of the box drawing in room air and is the primary cooling domain.
Cool the processors, memory and I/O sub-system.
TPMD controls this domain through the FSP.
Control algorithm uses the processor, memory and I/O subsystem temperatures as input for fan control.
Second cooling domain, that uses fans inside of each power supply
Cools the power supplies and DASD.
SPCN controls the fan speed on the power supplies.
If the DASD/SSD cage is not installed, SPCN relinquishes control of the fans to the power supplies.
Power supplies control fan speed based on internal power supply temperatures.
Fan redundancy is limited to 1 fan fault per domain.
More than one failing fan in each domain will force a drawer shutdown.
Power your planet
IBM Power Systems
DDR3
DDR3 DDR3 DDR3 DDR3
DDR3 DDR3 DDR3 DDR3
Super
Nova
DDR3 DDR3 DDR3 DDR3
DDR3 DDR3 DDR3 DDR3
DDR3
DDR3
DDR3
DDR3 DDR3 DDR3 DDR3
DDR3 DDR3 DDR3 DDR3
Feature
Size (4 DIMM card)
4Q10 planned
DDR3
DDR3 DDR3 DDR3 DDR3
DIMM
Size
DDR3 DDR3 DDR3 DDR3
Memory
Speed
DDR3
DDR3
DDR3
POWER7 Modular Memory Card Options
Max
Memory
32 GB
8 GB
1066 MHz
512 GB
64 GB
16 GB
1066 MHz
1 TB
128 GB
32 GB
800 MHz
2 TB
Power your planet
IBM Power Systems
POWER7 Modular Memory Layout
POWER7
Chip
A
Mem B
Ctrl 1 C
D
D
Mem C
Ctrl 0 B
A
Power your planet
DIMM 1
SN
DIMM 2
SN
DIMM 3
SN
DIMM 4
SN
DIMM 5
SN
DIMM 6
SN
DIMM 7
SN
DIMM 8
SN
IBM Power Systems
POWER7 Modular Memory Bandwidth

Nova
Mem
Nova
Cntrl
Nova
DRAMs
DRAMs
Nova
Cntrl
Nova
Nova
DDR3
Mem
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3
Nova
DDR3
POWER7
DDR3
Nova
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
Super
Nova
DDR3 DDR3
DDR3
DDR3
DDR3 DDR3
Power your planet
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3
Max Read Bandwidth:

102.336 GB/sec
Max Write Bandwidth:
51.168 GB/sec
Max Combined Bandwidth: 136.448 GB/sec
DDR3
DDR3 DDR3
IBM Power Systems
CEC I/O Ports

Serial Port
Power
770 & Power 780 support one serial port in the rear of the system.
Connector is a standard 9-pin male D-shell & it supports RS232 interface.
Power 770 & Power 780 is a HMC managed system, this serial port is always
OS controlled and therefore available in any system configuration.
It is support any serial device that has an OS Device Driver.
The FSP virtual console will be on the HMC
AIX and Linux use only, No IBM i
USB Controller
USB
controller is used to provide 3 USB ports.

One on the operator panel in front and two in the rear.
A stacked USB connector is used.
There is no sharing of these USB ports with the FSP.
The FSP has its own USB port located on the FSP card itself.
AIX and Linux use only,
Power your planet
IBM Power Systems
CEC I/O SFF / Media Options

15K SAS SFF (AIX / Linux )
FC #1883 - 73.4 GB SAS SFF Disk Drive
FC #1886 146 GB SAS SFF Disk Drive
15K SAS SFF (IBM i )
FC #1884 - 73.4 GB SAS SFF Disk Drive
FC #1888 139.5 GB SAS SFF Disk Drive
SDD
FC #1890 69 GB SFF SAS Solid State Drive AIX / Linux
FC #1909 69 GB SFF SAS Solid State Drive IBM i
Media
FC #5762 DVD-RAM
(DVD-ROM not supported in System Unit)
Power your planet
IBM Power Systems
CEC I/O - Integrated Virtual Ethernet Support

Three options
FC
#1803
4x 1Gb Ports
FC #1804
2x 10Gb + 2x 1Gb (RJ-45)
Optical Transceiver ports
FC # 1813
2x 10Gb + 2x 1Gb (RJ-45)
Copper Twinax (Not AS/400 5250 twinax)
New 10Gb offering for Power 770 & Power 780:

FC
1804 & 1813 provides 4 ports

2 x 10Gb PLUS 2 x 1Gb
Power 750 / 755 provides 2 x 10Gb ports only
OS Support
AIX,
IBM i, and Linux
Power your planet
IBM Power Systems
Two Enclosure Fabric Topology
1
FC #3711
Power your planet
2
FC #3712
IBM Power Systems
Three Enclosure Fabric Topology
2
FC #3712
FC #3713
Two cables
Power your planet
IBM Power Systems
Four Enclosure Fabric Topology

3
2
FC #3712
FC #3713
Two cables
FC #3714
Three cables
Power your planet
IBM Power Systems
FSP Cabling Configuration ( Logical View )

FSP/ Clock
CEC Enclosure 1
Drw to Drw
Connection
Point to Point Cabling

Three cables
FSP/ Clock
CEC Enclosure 2
Hot Drawer Add Support

Add cables to live systems
No disruptions
Drw to Drw
Connection
Drw to Drw
Connection
Hot Failover support

FSP
Clock
CEC Enclosure 3
Concurrent Service Support

Drw to Drw
Connection
CEC Enclosure 4
Rear
Power your planet
Front
IBM Power Systems
FSP 4 Enclosure Configuration
Enclosure 1
Cable 1
Enclosure 2
Enclosure 3
Cable 2
Enclosure 4
Cable 3
Power your planet
IBM Power Systems
19-inch Rack Considerations

Multi-enclosure configurations
supported in IBM Enterprise
racks:
IBM 7014-T00, -T42, #0551, #0553

No problemS with a front door
(regular or acoustic), but if use
rack trim, need new #6247 trim kit
Cables wider than CEC
For a Power 780 door with the pretty 780 label, order as feat code of 7014-T42 rack.
Power your planet
IBM Power Systems
POWER7 Modular CEC Disk/SSD Options

Base: Dual Split Backplane
2 SAS controllers built in
JBOD or RAID10
(AIX/Linux support)
Optional: Triple Split Backplane

Add #5901 PCIe SAS adapter
Add #1815 cable assembly
JBOD or RAID10
(AIX/Linux support)
Optional: No Split Backplane
#5662 175MB write cache Dual Controller
Adds Option of RAID-5/6
AIX/ IBM i /Linux support
Power your planet
SAS
SAS
SAS
SAS
PCIe SAS
SAS / SAS
+ cache
IBM Power Systems
SSD / DASD Support

Dual Split Backplane Mode
SSDs
supported
No mixing of SSDs and HDDs with a split domain
No mirroring between SSD drives and HDD drives
Triple Split Backplane Mode

SSDs
supported
No mixing of SSDs and HDDs with a split domain
No mirroring between SSD drives and HDD drives
RAID Internal Drives

SSDs
supported
Can install both SSD and HDD in internal bays
No mixing within a RAID array.
RAID Internal & #5886 EXP12S Disk Drawer

Support
only for HDD in this mode / No SSD support

No support for RAID of external SSD drives using FC 1819 to connect to
the external DASD drawer.
Power your planet
IBM Power Systems
Power 770 & 780 IO and Storage Drawers

FC
Order #
Status
FC 5796
PCI-X I/O Drwr
Available
12X
32
FC 5802
PCIe I/O Drwr

(Disk Bays)
Available
12X
16
FC 5877
PCIe I/O Drwr

(No Disk Bays)
Available
12X
16
FC 5886
Exp 12S SAS Disk Drwr
Available
12X
110
7314-G30
Interface
Max
Number
Description
PCI-X I/O Drwr
Supported 12X
32
FC 5786
EXP24 SCSI Disk Drwr
Supported SCSI
60
7031-D24
7031-T24
EXP24 SAS Disk Drwr

EXP24 SAS Disk Tower
Supported
60
Power your planet
SCSI
IBM Power Systems
POWER7 770 Bandwidth @ 3.1 GHz

Memory
Bandwidth
L1 ( Data )
148.8 GB/sec
L2
148.8 GB/sec
L3
99.2 GB/sec
Memory
4 Nodes
136.448 GB/sec per socket

1091.584 GB/sec
Inter-Node
Buses (4 Nodes)
158.016 GB/sec
Intra-Node
Buses (4 Nodes)
415.744 GB/sec
Int GX Bus 1 & 2

4 Enclosures
19.712 GB/sec
78.848 GB/sec
Ext GX Bus 1 & 2

4 Enclosures
39.424 GB/sec
157.696 GB/sec
Total IO
( 4 Enclosures )
236.544 GB /sec
Power your planet
IBM Power Systems

Memory
Bandwidth
L1 ( Data )
185.28 GB/sec
L2
185.28GB/sec
L3
123.52 GB/sec
Memory
4 Nodes

1091.584 GB/sec
Inter-Node
Buses (4 Nodes)
158.016 GB/sec
Intra-Node
Buses (4 Nodes)
415.744 GB/sec
Int GX Bus 1 & 2

4 Enclosures
19.712 GB/sec
78.848 GB/sec
Ext GX Bus 1 & 2

4 Enclosures
39.424 GB/sec
157.696 GB/sec
Total IO
( 4 Enclosures )
236.544 GB /sec
Power your planet
IBM Power Systems

Memory
Bandwidth
L1 ( Data )
198.72 GB/sec
L2
198.72 GB/sec
L3
132.48 GB/sec
Memory
4 Nodes

1091.584 GB/sec
Inter-Node
Buses (4 Nodes)
158.016 GB/sec
Intra-Node
Buses (4 Nodes)
415.744 GB/sec
Int GX Bus 1 & 2

4 Enclosures
19.712 GB/sec
78.848 GB/sec
Ext GX Bus 1 & 2

4 Enclosures
39.424 GB/sec
157.696 GB/sec
Total IO
( 4 Enclosures )
236.544 GB /sec
Power your planet
IBM Power Systems
POWER7 Modular PCIe IO Drawer configurations

770
780
PCIe
770
780
770
780
PCIe
PCIe
770
780
PCIe
One PCIe IO Drawer
770
780
770
780
Two PCIe IO Drawers
Three PCIe IO Drawers
PCIe
770
780
PCIe
770
780
PCIe
PCIe
PCIe
PCIe
Four PCIe IO Drawers
Multiple GX++ cards (12X)

Use as many as possible
Power your planet
IBM Power Systems
POWER7 Modular Information.

Physical Specifications (4 EIA units)
Width: 483 mm (19.0 in.)
Depth: 863 mm (32.0 in.)
Height: 174 mm (6.85 in)
Weight: 70.3 kg (155 lb)
Operating voltage:
200 to 240 V
Operating Frequency: 50/60 Hz
Power Consumption: 1600 watts (maximum)
Per enclosure with 16 cores active
Power Factor: 0.97
Thermal Output: 5461 Btu/hour (maximum)
Per enclosure with 16 cores active
Power-source Loading
1.649 kva (maximum configuration)
Noise Level and Sound
One enclosure with 16 active cores:
6.8 bels / 6.3 bels with acoustic rack doors (operating/idle)
Four enclosures with 64 active cores:
7.4 bels / 6.9 Bels with acoustic rack doors (operating/idle)
Power your planet
IBM Power Systems
Power 770 & 780 vs Power 570 Differences

Power 570
Power 770 & 780
Up to 8 sockets, Up to 32 Cores
Up to 8 Sockets, Up to 64 cores
Up to 768 GB Memory
Up to 2 TB Memory ( Initial GA will be 1 TB)
DDR2 DIMMS
DDR3 DIMMS
Six 3.5 SAS Bays / Enclosure
Six SFF SAS Bays / Enclosure
4 PCIe & 2 PCI-X slots per Enclosure
6 PCIe slots per Enclosure
No write cache or RAID-5/6 support
Write cache & RAID-5/6 support
Single integrated DASD / Media Cntlr
Three integrated DASD / Media Controllers
Optional Split Backplane

No Power & Management Thermal
Clock Cold Failover
No Concurrent Maintenance of FSP/Clock
Concurrent Drawer Maint restrictions
Concurrent Drawer Add cable restrictions
Power your planet
Standard Split backplane

Optional Tri-Split Backplane
Power & Thermal management
TPMD support
Clock Hot Failover
Planned Concurrent Maintenance
No Restrictions ( 4Q / 2010 )
No Restrictions
IBM Power Systems
Comparative Information.
Power your planet
IBM Power Systems
Power 570/32 vs 770 Bandwidth Properties
Power your planet
IBM Power Systems
POWER7 / POWER6 Enclosure Comparison
POWER7: 16 Cores active / POWER6: 8 Cores Active
Power your planet
IBM Power Systems
Power 780/770 vs Power 570/32

rPerf / KW
Power your planet
rPerf / KBTU
IBM Power Systems
rPerf Performance
Power your planet
IBM Power Systems
Power 780 CPW Performance
Estimated CPW values, not final. Final numbers will be available with announcement.
Power your planet
IBM Power Systems
IBM Power 770 / 780 Positioning

770
780
595
POWER6
Processors
12 - 48 / 16 - 64
8 32 / 16 - 64
8 64
( Upgradeable to 256 Cores)
Frequency
3.1 GHz
3.5 GHz ( 6 Core )
3.55 GHz
4.14 Core ( 4 Core )
4.2 GHz
5.0 GHz
21 / 16 GB
32 / 16 GB
64 GB
Nodes
Memory / core
rPerf
493.37 / 579.39
418.64 / 685.09
553
Memory
Bandwidth
1088 GB/sec
1088 GB/sec
1376 GB / sec
IO Bandwidth
236 GB /sec
236 GB/sec
640 GB/sec
9x5
24 x 7
24 x 7
No
Yes
Yes
Warranty
PowerCare
Power your planet
IBM Power Systems
POWER7
Performance
Power your planet
IBM Power Systems
Note:
Go to system sales or PartnerInfo and
download esbmi and select the charts that
are most appropriate for your use.
Due to the constantly changing nature of
benchmark standings, those charts are kept
separate & updated the 2nd of every month.
Power your planet
IBM Power Systems
Power Systems rPerf Performance
Power your planet
IBM Power Systems
Performance per Watt
POWER4 POWER4+
p670
p670
1.5 GHz
1.1 GHz
rPerf: 24.46 rPerf: 46.79
KWatts: 6.71 KWatts: 6.71
6.97
3.64
Power your planet
POWER5 POWER5+ POWER6 POWER6 POWER7

p570
p5-570
Power 570
Power 570
Power 780
1.9 GHz
1.65 GHz
4.7 GHz
4.2 GHz
3.8 GHz
rPerf: 85.20 rPerf: 134.35 rPerf: 193.25 rPerf: 685.09
rPerf: 68.4
KWatts: 5.2 KWatts: 5.2 KWatts: 5.6 KWatts: 5.6 KWatts: 6.4
16.38
13.15
23.99
34.56
107.04
IBM Power Systems
POWER7
Odds and Ends
Power your planet
IBM Power Systems
POWER7 Virtualization Support

Maintain 1 to 10 ratio for Physical cores to LPARs.
Power
750:
Power 755
Power 770 / 780:
PS700
PS701
PS702
Up to 160 (320) LPARS

Not Supported
Up to 160 (640) LPARs
Up to 40 LPARS
Up to 80 LPARs
Up to 160 LPARs

Active
Memory Expansion compresses in-memory data to fit more data

into memory
Increases the effective amount of memory capacity
Managed by the OS and hypervisor
OS compresses and decompress data based on memory accesses
Is transparent to applications
Power your planet
IBM Power Systems
HMC Support
HMC V7 R710 is the minimum level for POWER7 support
HMC used to manage any POWER7 processor based server, must
be a CR3 or later model rack-mount HMC or C05 or later deskside
HMC.
If IBM Systems Director is used to manage an HMC or if the HMC

manages more than 254 partitions, the HMC should have 3GB of
RAM minimum and be a CR3 model or later rack-mount, or C06 or
later deskside.
Power your planet
IBM Power Systems
POWER7
OS Support
Power your planet
IBM Power Systems
POWER7 OS Software Support

AIX 5.3 with the 5300-11 Technology Level and SP2, or later
AIX 6.1 with the 6100-04 Technology Level and SP3, or later
IBM i 6.1 with 6.1.1 machine code, or later
SUSE Linux Enterprise Server 10 with SP3 for POWER
SUSE Linux Enterprise Server 11 for POWER, or later
RHEL SoD
VIOS 2.1.2.12 with Fix Pack 22.1 and Service Pack 2, or later
Power your planet
IBM Power Systems
2009 2011 AIX TL Roadmap

10/2009
04/2010
AIX 5.3
10/2010
04/2011
10/2011
POWER7 Hardware Support
TL8
TL9
TL10
SP
SP
TL11
TL11 SP
TL12
AIX 6.1
TL1
TL2
TL3
SP
SP
TL4
TL4
SP
TL5
TL6
TL7
SP
Service Pack
POWER7 Support
TL8
TL0
AIX 7.1
Power your planet
TL1
TL2
IBM Power Systems
Partition Mobility
POWER6
POWER6+
POWER7
Binary Compatibility between POWER6 and POWER7

Leverage POWER6 / POWER6+ Compatibility Mode
Migrate partitions between POWER6 and POWER7 Servers
Forward and Backward
Power your planet
IBM Power Systems
POWER7 Processor
POWER7
Active Memory
Expansion
Power your planet
IBM Power Systems

True
Memory
True
Memory
True
Memory
Expanded
Memory
Expanded
Memory
Expanded
Memory
True
Memory
True
Memory
True
Memory
Expanded
Memory
Expanded
Memory
Expanded
Memory
Effectively up
to 100% more
memory
POWER7 Advantage
Expand memory beyond physical limits
More effective server consolidation
Run more application workload / users per partition
Run more partitions and more workload per server
Power your planet
IBM Power Systems
Active Memory Expansion & Active Memory Sharing

Effectively gives more memory
capacity to the partition using
compression / decompression of
the contents in true memory
AIX partitions only
Active Memory Sharing

Moves memory from one partition
to another
Best fit when one partition is not
busy when another partition is
busy
AXI, IBM i, and Linux partitions
Active Memory Sharing
Supported, potentially a very nice option

Considerations
Only AIX partitions using Active Memory Expansion
Active Memory Expansion value is dependent upon compressibility of data
and available CPU resource
Power your planet
IBM Power Systems

Innovative POWER7 technology
For AIX 6.1 or later
For POWER7 servers
Uses compression/decompression to effectively expand the true

physical memory available for client workloads
Often a small amount of processor resource provides a significant
increase in the effective memory maximum
Processor resource part of AIX partitions resource and licensing
Actual expansion results dependent upon how compressible the data

being used in the application
A SAP ERP sample workload shows up to 100% expansion,
Your results will vary
Estimator tool and free trial available
Power your planet
IBM Power Systems
Active Memory Expansion Client Deployment

2
60-Day Trial
Planning Tool
A. Part of AIX 6.1 TL4
B. Calculates data
compressibility &
estimates CPU
overhead due to Active
Memory Expansion
C. Provides initial
recommendations
3
Deploy into Production
A. One-time, temporarily
enablement
B. Config LPAR based
on planning tool
C. Use AIX tools to
monitor Act Mem Exp
environment
D. Tune based on actual
results
A. Permanently enable
Active Memory
Expansion
B. Deploy workload
into production
C. Continue to monitor
workload using AIX
performance tools
Memory Expansion
Performance
App. Performance
Estimated Results
CPU Utilization
CPU Utilization
Actual Results
Memory Expansion
Time
Memory Expansion
Power your planet
IBM Power Systems
Active Memory Expansion - Planning Tool

ut
p
t
u
le o
p
m
Sa CPU Usage
Memory
Active Memory Expansion Modeled Statistics:

----------------------Modeled Expanded Memory Size :
8.00 GB
Expansion
Factor
--------1.21
1.31
1.41
True Memory
Modeled Size
-------------6.75 GB
6.25 GB
5.75 GB
Modeled
Gain
----------------1.25 GB [ 19%]
1.75 GB [ 28%]
2.25 GB [ 39%]
Estimate
----------0.00
0.20
0.35
1.51
5.50 GB
2.50 GB[ 45%]
0.58
1.61
5.00 GB
3.00 GB [ 60%]
1.46
Active Memory Expansion Recommendation:

--------------------The recommended AME configuration for this workload is to configure
the LPAR with a memory size of 5.50 GB and to configure a memory
expansion factor of 1.51. This will result in a memory expansion of
45% from the LPAR's current memory size. With this configuration,
the estimated CPU usage due to Active Memory Expansion is
approximately 0.58 physical processors, and the estimated overall
peak CPU resource required for the LPAR is 3.72 physical processors.
This sample partition

has fairly good
expansion potential
A nice sweet spot for
this partition appears
to be 45% expansion
2.5 GB gained memory
Using about 0.58 cores
additional CPU
resource
Tool included in AIX 6.1 TL4 SP2

Run tool in the partition of interest for memory expansion.
Input desired expanded memory size. Tool outputs different real memory and
CPU resource combinations to achieve the desired effective memory.
Power your planet
IBM Power Systems
Active Memory Expansion: Partition On / Off

With HMC, check Active Memory
Expansion box and enter
True and max memory
Memory expansion factor
To turn off expansion, unclick box
Partition IPL required to turn on or off
Active Memory Expansion Modeled Statistics:

----------------------Modeled Expanded Memory Size :
8.00 GB
Expansion
Factor
--------1.21
1.31
1.41
1.51
1.61
True Memory
Modeled Size
-------------6.75 GB
6.25 GB
5.75 GB
5.50 GB
5.00 GB
output
ample
S
Memory
CPU Usage
Modeled
Gain
----------------1.25 GB [ 19%]
1.75 GB [ 28%]
2.25 GB [ 39%]
2.50 GB [ 45%]
3.00 GB [ 60%]
5.5 true
8.0 max
Estimate
----------0.00
0.20
0.35
0.58
1.46
Active Memory Expansion Recommendation:

--------------------The recommended AME configuration for this workload is to configure
the LPAR with a memory size of 5.50 GB and to configure a memory
expansion factor of 1.51. This will result in a memory expansion of
45% from the LPAR's current memory size. With this configuration,
the estimated CPU usage due to Active Memory Expansion is
approximately 0.58 physical processors, and the estimated overall
peak CPU resource required for the LPAR is 3.72 physical processors.
Power your planet
IBM Power Systems
POWER7 Processor
Upgrades
Power your planet
IBM Power Systems
POWER7 System Upgrades

Upgrades from POWER6 and POWER6+
All existing POWER6 570 systems can upgrade to POWER7
POWER6+ 570/32
4.2 GHz
Power 780
3.8 GHz / 4.1 GHz
POWER6+ 570
9179-MHB
4.4, 5.0 GHz
POWER6 570
3.5, 4,2, 4.7 GHz
9117-MMA
Power 770
3.5 GHz
9117-MMB
POWER6 upgrades to POWER7

POWER6+ upgrades to POWER7
Power 570/32 upgrades to POWER7
Power your planet
IBM Power Systems
Power 770 and Power 780 Upgrades

No direct POWER5 upgrades to
POWER7. Use 2-step upgrade, first to
POWER6 then to POWER7.
Upgrades to POWER6 570 available as
long as new box sales of POWER6 570
available
Withdrawal planned end 2010
POWER6+ 570/32
9117-MMA 4.2 GHz
POWER7 780
9179-MHB 3.8 / 4.1 GHz
POWER7 770
9117-MMB 3.5 GHz
POWER6+ 570
9117-MMA 4.4, 5.0 GHz
POWER7 770
POWER6 570
9117-MMB 3.1 GHz
9117-MMA 3.5, 4.2, 4.7 GHz
POWER6 570
9406-MMA 4.7 GHz
Power your planet
IBM Power Systems
I/O Upgrade Considerations

All the newer IBM I/O drawers, disk, SSD and PCI adapters used on
POWER6 supported on POWER7 servers
May need to move 3.5-inch SAS drives and PCI-X adapters
Older I/O on POWER6 servers, but not on POWER7 servers
RIO / RIO2 / HSL I/O drawers

SCSI disk smaller than 69GB or SCSI drives slower than 15k rpm
QIC tape drives
IOPs and IOP-based PCI adapters (IBM i)
2749, 5702, 5712, 2757, 5581, 5591, 2790, 5580, 5590, 5704, 5761, 2787,
5760, 4801, 4805, 3709, 4746, 4812, 4813
Older LAN adapters: #5707, 1984, 5718, 1981, 5719, 1982
Older SCSI adapters: #5776, 5583, 5777
Telephony adapter: #6412
See planning web page www.ibm.com/systems/power/hardware/sod2.html
Power your planet
IBM Power Systems
Power 520 SoD for Upgrade

SoD provided in February
For Power 520 (8203-E4A) 2-core or 4-core servers
Upgrade to a POWER7 product preserving the serial number
Power your planet
IBM Power Systems
POWER7 Processor
RAS
Power your planet
IBM Power Systems
Power Systems: Hardware & OS RAS Leadership
Ref: ITIC 2009 Global Server Hardware and Server OS Reliability Survey
Power your planet
IBM Power Systems
Availability / Reliability by Design for POWER7

Operating System
Hot patch Kernel
Storage Keys
Hot Plug / Removal
Fans & Power Supplies
Hot Plug / Removal
PCI-X & PCIe Adapters
IO Drawers
Hot Plug / Removal
Disks
Hot Add
I/O racks
Memory
Chip Kill technology with
Bit-steering
Power your planet
Dual Clocks
770/780
Concurrent Add: 770/780
Eliminates Upgrade outages
Concurrent Service{ 770/780
Eliminates Repair Outages
Passive backplane
No active components
First Failure Data Capture
Help eliminates intermittent failures
Processors
Dynamic De-Allocation
Packaging
Instruction Retry
Alternate Processor Recovery
Hypervisor
Mainframe technology
Mobility
Partition Mobility
WPAR Mobility
IBM Power Systems
POWER7 Instruction Retry

Recovery Capability
Array error
Error correction (ECC)
Arrays with parity
o Processor restarts
Instruction flow and Data flow Error
Processor restarts
Control Error
Processor restarts
Core
Instruction Fetch
Decode
Execution Units
Core error collection
Load/
Store
System Resiliency
Recovery
Unit
Core restart
Processor states are check pointed and protected with ECC

Processor states can be moved from one processor to another
upon unsuccessful recovery restart (CP Sparing)
Power your planet
IBM Power Systems
POWER7 770/780: RAS Features

Dynamic Oscillator
Failover
Concurrent Repair
OSC0
OSC1
Fabric Interface
Core Recovery
Leverage speculative execution resources to
enable recovery
Error detected in GPRs FPRs VSR, flushed &
retried
Stacked latches to improve SER
Alternate Processor Recovery
Partition isolation for core checkstops
BUF
BUF
BUF
BUF
X8Dimms
Advanced 64 Byte ECC on Memory

Multiple chip chipkill detections and
sparings
HW assisted scrubbing
SUE handling
CRC with retry and
Dynamic data bit-line sparing on channel
interface
IO Hub
PCI
Bridge
PCI Adapter
Power your planet
Fabric Bus Interface to other Chips and Nodes

ECC protected
Node hot add /repair
L3 eDRAM
ECC protected
SUE handling
Purge and Line delete
Spare rows and columns
GX IO Bus
ECC protected
Concurrent add/repair
InfiniBand Interface
Redundant paths
Retry/Freeze behavior options for
Internal I/O Hub Faults
PHB Errors
IBM Power Systems
Power 750 / 755 Memory RAS Features

Memory RAS
Power 750 supports memory Scrubbing, 64-byte Marking ECC and Chipkill. Memory errors
are usually classified as either soft or hard.
Hard errors can be caused by defects within the DRAM

package among other reasons (e.g. defect in the silicon),
and are usually permanent once they occur.
Soft errors are caused by charged particles or radiation, and are usually transient.
Memory scrubbing corrects soft single bit errors in background while memory is idle
preventing multiple bit errors.
Memory ECC is able to detect and correct single bit memory errors, which make up the
majority of memory errors. It can also isolate a single Chipkill to a bad DRAM chip.
Memory Chipkill has the ability to correct the single bit errors that standard ECC memory
can correct but also multi-bit (2, 3, 4 bits) memory errors and by doing so it increases server
availability/reliability even further.
Selective Memory Mirroring is where an amount of memory is reserved and sections of the
memory to select for mirroring in the reserved memory are dynamically determined. The
selected sections of the memory contain critical areas. The selected sections of the memory
are mirrored in the reserved memory.
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147
IBM Power Systems
Guiding Light vs. Light Path

User interface and repair action simplification
POWER6
Guiding light: Console Monitored System

Used in POWER6 systems
Technician used the HMC or ASMI to see what happened and what to replace
FRUs and their locations are found in the error log
Used HMC or ASMI to enter location code to activate identify LEDs from console to
verify where FRUs are
Exchange FRUs (CM or dedicated) per procedure instructions
System Attention LED is persistent after power cycle until cleared by technician.
POWER7
Light Path: Console-less HW service simplicity (fast and easy)

Used in POWER7 systems
No need to view logs, just replace the FRUs with their LED on
o LEDs are activated automatically when error is detected.
Friendly, color coded labels on Power 750 cover show how to pull and plug parts
External LED indicates a failure inside the unit
Internal LEDs per FRU indicate what to replace
o FRUs are either Hot Plug or system has to be powered off
o Gold cap powers fault LEDs when system power is removed
Replacing a FRU automatically resets the fault LEDs
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148
IBM Power Systems
POWER7 Processor
I/O
Power your planet
IBM Power Systems
Integrated Virtual Ethernet (IVE) Adapter

Standard set of features offered on Power 750 / 755 / 770 / 780 servers.
Integrated Virtual Ethernet (IVE) adapter can connect to external networks and
share this connectivity to all virtualized logical ports without using the Virtual
I/O Server, with less complexity, thus contributing to a better system
optimization and better overall system performance.
POWER Hypervisor provides integrated high-speed Ethernet adapter ports with
hardware assisted virtualization capabilities.
IVE was developed to meet general market requirements for better performance
and better virtualization for Ethernet. It offers:
Either four 1 Gbps ports or two 10 Gbps ports

Provides external network connectivity for LPARs using dedicated ports without
the need of a Virtual I/O Server
Industry standard hardware acceleration, loaded with flexible configuration
possibilities.
The speed and performance of the GX+ bus and faster than PCIe x16.
IVE is designed to provide great improvement of latency for short packets.
Power your planet
150
IBM Power Systems
Five Power Systems SSD White Papers

IBM Power SSD vs Consumer SSD
(posted Nov 2009)
Advantages of True Enterprise Solid State Drives (SSDs) in Enterprise Systems
AIX-specific
(posted Apr 2009)
Driving Business Value on Power Systems with Solid State Drives
IBM i-specific
(posted May 2009)
Performance Value of Solid State Drives using IBM i
First published May 2009
More SSD technology specific AIX/IBM i/Linux appropriate (posted Jun 2009)
Performance Impacts of Flash SSDs Upon IBM Power Systems
Above papers in Power Systems web site under Resources/Literature
http://www.ibm.com/common/ssi/apilite?infotype=SA&infosubt=WH&lastdays
=1825&hitlimit=200&ctvwcode=US&pubno=POW*USEN&appname=
STGE_PO_PO_USEN_WH&additional=summary&contents=keeponlit
5th paper for an SAP environment
http://www.sdn.sap.com/irj/sdn/db4?rid=/library/uuid/90a1637e-065f-2c10-3ab7bea9375fc88d
Power your planet
IBM Power Systems

POWER6 I/O adapters
not supported
POWER7
POWER6
PCIand
& devices
Devices
NotonSupported
on POWER7
Feature
2749
2757
2780
5580
5581
5583
5590
5591
5702
5712
5776
5777
5778
5806
5911
2787
5704
5760
5761
4812
4813
1981
5718
1982
5719
1984
5707
3709
2844
2847
3705
6312
4801
4805
4746
Name
Storage controllers
PCI Ultra Mag Media Controller
PCI-X Ultra RAID Disk Controller
PCI-X Ultra4 RAID Disk Controller
2780 Controller w/ Aux Write Cache
PCI-X Ultra Tape Controller
PCI-X Dual Channel Ultra320 SCSI Adapter
PCI-X Disk Controller-90MB No IOP
PCI-X Disk Controller-1.5GB No IOP
PCI-X EXP24 Ctl-1.5GB No IOP
PCI-X DDR Dual Channel Ultra320 SCSI Adapter
SAS adapter for internal Split DASD option
Fibre Channel controllers
PCI-X Fibre Chan Disk Controller
PCI-X Fibre Channel Tape Controller
PCI-X Fibre Chan Disk Controller
PCI-X Fibre Chan Tape Controller
IXS
PCI Integ xSeries Server
PCI Integ xSeries Server
Ethernet controllers
2749
2757
2780
2780/5708
2757/5708
571E/574F
2780/574F
2757/574F
5702
5702
571B
571E
571F
571A
57BA
2787
5704
280E
280D
Feature code Replacement

PCI-X SCSI - 5736
SCSI - 5782 / SAS SCSI - 5782 / SAS SCSI - 5782 / SAS SCSI - 5782 / SAS SCSI - 5782 / SAS SCSI - 5782 / SAS SCSI - 5782 / SAS PCI-X SCSI - 5736
PCI-X SCSI - 5736
SCSI - 5782 / SAS SCSI - 5782 / SAS SCSI - 5782 / SAS PCI-X SCSI - 5736
None
PCIe
PCIe
PCIe
PCIe
4Gb
4Gb
4Gb
4Gb
5774
5774
5774
5774
/
/
/
/
4812-001
4812-001
iSCSI attach - 5713

iSCSI attach - 5713
10 Gigabit Ethernet -SR PCI-X Adapter
1981/5718
PCIe - 5769
IBM 10 Gigabit Ethernet-LR PCI-X Adapter
1982/5719
PCIe - 5772
IBM 2-Port Gigabit Ethernet-SX PCI-X Adapter

PCI 100/ 10Mbps Ethernet IOA (#2748 on System i)
IOPs
PCI IOP
PCI IOP for SAN Load Source
PCI IOP (System i #2843)
DTTA
Quad Digital Trunk Telephony PCI Adapter
Crypto
PCI Crypto Coprocessor
PCI Crypto Accelerator
Twinax
PCI Twinaxial Workstn IOA
1984/5707
2849
PCIe - 5768
None
Power your planet
3273
4319
CCIN
2844
2847
2843
None
None
None
6312
None
4758-023
2058-001
2746
5903,
5903,
5903,
5903,
5903,
5903,
5903,
5908
5908
5908
5908
5908
5908
5908
5903, 5908
5903, 5908
5903, 5908
8Gb
8Gb
8Gb
8Gb
5735
5735
5735
5735
AIX/Lx - 4807, IBM i - 4764 til 10/10

AIX/Lx - 4807, IBM i - 4764 til 10/10
None
6312
IBM
Power Systems
4801
4805
POWER6 PCI & Devices Not Supported on POWER7

4746
3273
4319
4326
3277
1968
3274
1969
3275
1973
3578
3706
4430
4630
4633
5756
5757
3707
3708
4487
5907
2591
Hard Disk Devices

36.4 GB 10,000 RPM Ultra320 SCSI Disk Drive Assembly
35.16GB 10k rpm Disk Unit
1967
4319
SAS SFF - 1881

SAS SFF - 1881
35.16GB 15k rpm Disk Unit

4326
1970
SAS SFF - 1883

SAS SFF - 1883
1968
SAS SFF - 1881
1969
SAS SFF - 1882
300 GB 10,000 RPM Ultra320 SCSI Disk Drive Assembly

Optical Devices
DVD-ROM (System i #4631)
3578
SAS SFF - 1885
6336
DVD RAM - 5762
6330-002
6333
6337-002
6337-003
6331-002
DVD RAM - 5762

DVD RAM - 5762
No record
DAT - 5907, 5619 LTO - 5746
63A0
N/A
DAT - 5907, 5619 LTO - 5746

DAT - 5907, 5619
DVD-RAM
DVD-RAM
IDE Slimline DVD-ROM Drive
IBM 4.7 GB IDE Slimline DVD-RAM Drive
Tape Devices
30GB 1/ 4-Inch Cartridge Tape (System i #4684)
50GB 1/ 4-Inch Cartridge Tape (System i #4687)
36/ 72GB 4mm DAT72 SAS Tape Drive
Diskette Devices
External USB 1.44 MB Diskette Drive
Displays
Power your planet
N/A
DVD RAM - 5762

DVD RAM - 5762
None
IBM Power Systems
Summary
POWER7 Processor
POWER7 Servers
Power
Power
Power
Power
Power
750
755
770
780
Blades

I/O
Upgrades
Power your planet
IBM Power Systems
Special notices
This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other
countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings
available in your area.
Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on
the capabilities of non-IBM products should be addressed to the suppliers of those products.
IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any
license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785
USA.
All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.
The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees
either expressed or implied.
All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results
that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and
conditions.
IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to
qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options,
and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice.
IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies.
All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary.
IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.
Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent
on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may
have been made on development-level systems. There is no guarantee these measurements will be the same on generally-available systems. Some
measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for
their specific environment.
Current: 1Q 2010
Power your planet
IBM Power Systems
Special notices (cont.)

IBM, the IBM logo, ibm.com AIX, AIX (logo), AIX 6 (logo), AS/400, Active Memory, BladeCenter, Blue Gene, CacheFlow, ClusterProven, DB2, ESCON,
i5/OS, i5/OS (logo), IBM Business Partner (logo), IntelliStation, LoadLeveler, Lotus, Lotus Notes, Notes, Operating System/400, OS/400, PartnerLink,
PartnerWorld, PowerPC, pSeries, Rational, RISC System/6000, RS/6000, THINK, Tivoli, Tivoli (logo), Tivoli Management Environment, WebSphere,
xSeries, z/OS, zSeries, AIX 5L, Chiphopper, Chipkill, Cloudscape, DB2 Universal Database, DS4000, DS6000, DS8000, EnergyScale, Enterprise
Workload Manager, General Purpose File System, , GPFS, HACMP, HACMP/6000, HASM, IBM Systems Director Active Energy Manager, iSeries, MicroPartitioning, POWER, PowerExecutive, PowerVM, PowerVM (logo), PowerHA, Power Architecture, Power Everywhere, Power Family, POWER
Hypervisor, Power Systems, Power Systems (logo), Power Systems Software, Power Systems Software (logo), POWER2, POWER3, POWER4,
POWER4+, POWER5, POWER5+, POWER6, POWER7, pureScale, System i, System p, System p5, System Storage, System z, Tivoli Enterprise, TME
10, TurboCore, Workload Partitions Manager and X-Architecture are trademarks or registered trademarks of International Business Machines Corporation
in the United States, other countries, or both. If these and other IBM trademarked terms are marked on their first occurrence in this information with a
trademark symbol ( or ), these symbols indicate U.S. registered or common law trademarks owned by IBM at the time this information was published.
Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the Web at
"Copyright and trademark information" at www.ibm.com/legal/copytrade.shtml
The Power Architecture and Power.org wordmarks and the Power and Power.org logos and related marks are trademarks and service marks licensed by
Power.org.
UNIX is a registered trademark of The Open Group in the United States, other countries or both.
Linux is a registered trademark of Linus Torvalds in the United States, other countries or both.
Microsoft, Windows and the Windows logo are registered trademarks of Microsoft Corporation in the United States, other countries or both.
Intel, Itanium, Pentium are registered trademarks and Xeon is a trademark of Intel Corporation or its subsidiaries in the United States, other countries or
both.
AMD Opteron is a trademark of Advanced Micro Devices, Inc.
Java and all Java-based trademarks and logos are trademarks of Sun Microsystems, Inc. in the United States, other countries or both.
TPC-C and TPC-H are trademarks of the Transaction Performance Processing Council (TPPC).
SPECint, SPECfp, SPECjbb, SPECweb, SPECjAppServer, SPEC OMP, SPECviewperf, SPECapc, SPEChpc, SPECjvm, SPECmail, SPECimap and
SPECsfs are trademarks of the Standard Performance Evaluation Corp (SPEC).
NetBench is a registered trademark of Ziff Davis Media in the United States, other countries or both.
AltiVec is a trademark of Freescale Semiconductor, Inc.
Cell Broadband Engine is a trademark of Sony Computer Entertainment Inc.
InfiniBand, InfiniBand Trade Association and the InfiniBand design marks are trademarks and/or service marks of the InfiniBand Trade Association.
Other company, product and service names may be trademarks or service marks of others.
Current: 1Q 2010
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Notes on benchmarks and values

The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems.
Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting
application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized
reseller or access the Web site of the benchmark consortium or benchmark vendor.
IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html .
All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded
systems, AIX Version 4.3, AIX 5L or AIX 6 were used. All other systems used previous versions of AIX. The SPEC CPU2006, SPEC2000, LINPACK, and
Technical Computing benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and
upgraded systems, the latest versions of these compilers were used: XL C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL
FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux, and XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC
CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck & Associates and VAST-2 v4.01X8 from PacificSierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM ESSL for AIX, MASS for AIX and
Kazushige Gotos BLAS Library for Linux were also used in some benchmarks.
For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor.
TPC
http://www.tpc.org
SPEC
http://www.spec.org
LINPACK
http://www.netlib.org/benchmark/performance.pdf
Pro/E
http://www.proe.com
GPC
http://www.spec.org/gpc
VolanoMark
http://www.volano.com
STREAM
http://www.cs.virginia.edu/stream/
SAP
http://www.sap.com/benchmark/
Oracle Applications
http://www.oracle.com/apps_benchmark/
PeopleSoft - To get information on PeopleSoft benchmarks, contact PeopleSoft directly
Siebel
http://www.siebel.com/crm/performance_benchmark/index.shtm
Baan
http://www.ssaglobal.com
Fluent
http://www.fluent.com/software/fluent/index.htm
TOP500 Supercomputers
http://www.top500.org/
Ideas International
http://www.ideasinternational.com/benchmark/bench.html
Storage Performance Council
http://www.storageperformance.org/results
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Current: 1Q 2010
IBM Power Systems
Notes on HPC benchmarks and values

The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should
consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For
additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark
consortium or benchmark vendor.
IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html .
All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded systems, AIX
Version 4.3 or AIX 5L were used. All other systems used previous versions of AIX. The SPEC CPU2000, LINPACK, and Technical Computing benchmarks were compiled
using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and upgraded systems, the latest versions of these compilers were used:
XL C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux,
and XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck &
Associates and VAST-2 v4.01X8 from Pacific-Sierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM
ESSL for AIX, MASS for AIX and Kazushige Gotos BLAS Library for Linux were also used in some benchmarks.
For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor.
SPEC
http://www.spec.org
LINPACK
http://www.netlib.org/benchmark/performance.pdf
Pro/E
http://www.proe.com
GPC
http://www.spec.org/gpc
STREAM
http://www.cs.virginia.edu/stream/
Fluent
http://www.fluent.com/software/fluent/index.htm
TOP500 Supercomputers
http://www.top500.org/
AMBER
http://amber.scripps.edu/
FLUENT
http://www.fluent.com/software/fluent/fl5bench/index.htm
GAMESS
http://www.msg.chem.iastate.edu/gamess
GAUSSIAN
http://www.gaussian.com
ANSYS
http://www.ansys.com/services/hardware-support-db.htm
Click on the "Benchmarks" icon on the left hand side frame to expand. Click on "Benchmark Results in a Table" icon for benchmark
results.
ABAQUS
http://www.simulia.com/support/v68/v68_performance.php
ECLIPSE
http://www.sis.slb.com/content/software/simulation/index.asp?seg=geoquest&
MM5
http://www.mmm.ucar.edu/mm5/
MSC.NASTRAN
http://www.mscsoftware.com/support/prod%5Fsupport/nastran/performance/v04_sngl.cfm
STAR-CD
www.cd-adapco.com/products/STAR-CD/performance/320/index/html
NAMD
http://www.ks.uiuc.edu/Research/namd
HMMER
http://hmmer.janelia.org/
http://powerdev.osuosl.org/project/hmmerAltivecGen2mod
Current: 1Q 2010
Power your planet
IBM Power Systems
Notes on performance estimates

rPerf for AIX
rPerf (Relative Performance) is an estimate of commercial processing performance relative to other IBM UNIX
systems. It is derived from an IBM analytical model which uses characteristics from IBM internal workloads, TPC
and SPEC benchmarks. The rPerf model is not intended to represent any specific public benchmark results and
should not be reasonably used in that way. The model simulates some of the system operations such as CPU,
cache and memory. However, the model does not simulate disk or network I/O operations.
rPerf estimates are calculated based on systems with the latest levels of AIX and other pertinent software at the time
of system announcement. Actual performance will vary based on application and configuration specifics. The IBM
eServer pSeries 640 is the baseline reference system and has a value of 1.0. Although rPerf may be used to
approximate relative IBM UNIX commercial processing performance, actual system performance may vary and is
dependent upon many factors including system hardware configuration and software design and configuration.
Note that the rPerf methodology used for the POWER6 systems is identical to that used for the POWER5
systems. Variations in incremental system performance may be observed in commercial workloads due to
changes in the underlying system architecture.
All performance estimates are provided "AS IS" and no warranties or guarantees are expressed or implied by IBM.
Buyers should consult other sources of information, including system benchmarks, and application sizing guides to
evaluate the performance of a system they are considering buying. For additional information about rPerf, contact
your local IBM office or IBM authorized reseller.
========================================================================
CPW for IBM i
Commercial Processing Workload (CPW) is a relative measure of performance of processors running the IBM i
operating system. Performance in customer environments may vary. The value is based on maximum
configurations. More performance information is available in the Performance Capabilities Reference at:
www.ibm.com/systems/i/solutions/perfmgmt/resource.html
Current: 1Q 2010
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IBMs 2009 Patent Total: 17 yrs of Leadership

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IBM Research is building a computer system able to compete with humans at

Based on the science of Question Answering (QA), differs from conventional

Customer relationship management

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Active Memory Expansion

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POWER7 System Highlights

Cache, Memory, and IO

6th Implementation of multi-core design

POWER7 System Architecture

Blades to High End offerings

Processor Nap & Sleep Mode

Processor Instruction Retry

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Power Systems Portfolio (Feb 2010)

Modular systems with linear scalability

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POWER7 Systems Technology Value

Systems scalability from blades to high end systems

Virt I/O Server

Systems mainframe inspired RAS features

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Processor Technology Roadmap

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1.9 MB Shared 1.9 MB Shared 4 MB / Core

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POWER7 Processor Chip

Remote SMP & I/O Links

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12 execution units per core

Dual DDR3 Memory Controllers

Binary Compatibility with

Equivalent function of 2.7B

Eight processor cores

45nm lithography, Cu, SOI, eDRAM

90 GB/s Memory bandwidth per chip

360 GB/s SMP bandwidth/chip

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eDRAM is nearly as fast as conventional SRAM but requires far less

2010 IBM Corporation

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