Microelectromechanical Systems

Microelectromechanical systems
(MEMS)
An Introduction
Shivam Vishwanath
Centre For Nanotechnology
Central University
of Jharkhand
shivamvishwanath174@gm
ail.com
Outline
Introduction
Fabrication
Applications
Challenges
Biblography
shivamvishwanath174@gmail.com
What are MEMS?

(Micro-electromechanical Systems)
miniaturized mechanical and electro-mechanical
elements.
fabricated using micromachining technology.
usually integrated with electronic circuitry for
control and/or information processing.
Components of MEMS
Microsensors
Microactuators
Microelectronics
Microstructures
Microsensors
Converts a measured mechanical signal into an electrical
signal.
every possible sensing modality including pressure , inertial
forces , temperature , magnetic field , radiation , etc.
micromachinedversion of pressuretransducer outperforms a
pressure sensormadeusingthemostprecisemacroscalelevel
machining techniques.
stellardeviceperformance.
relativelylowcostlevel.
Microactuators
Microscopic mechanism that supplies and
transmits a measured amount of energy for the
operation system of another system.
A number of microactuators includes:
microvalvesforcontrolofgasandliquidfluids.
micropumpstodeveloppositivefluidpressures.
microflapstomodulateairstreamsonairfoils.
Microelectronic
miniaturizedsensors,actuators,and structures
mergedonto a common silicon substrate.
themicromechanicalcomponentsarefabricated
using
compatible"micromachining"processesthatsel
ectively etch
awaypartsofthesiliconwaferoraddnew
structural layers to
formthemechanicalandelectromechanicaldevi
Vision of MEMS
microsensors,microactuatorsandmicroelectronicsand
other technologies,canbeintegratedontoasingle
microchip.
sensorsgatherinformationfromtheenvironment.
electronicsthenprocesstheinformation derivedfromthe
sensors.
decision making capability direct the actuators to respond.
MEMSisrevolutionizingmany
productcategoriesbyenablingcompletesystems-on-achip.
Fabricating
MEMS
Bulk Micromachining
selective removal of the substrate material in order to realize
miniaturized mechanical components. A widely used bulk
micromachining technique is chemical wet etching.
Two types ofchemicalwetetchinginbulkmicromachining
a) isotropic wet etching - the etch rate is independent of the
crystallographic orientation of the substrate.
b) anisotropicwetetching - the etch rate is dependent of the
crystallographic orientation of the substrate.
SEMSofa<100>orientedsiliconsubstrateafterimmersioninanan
isotropicwet
etchant.
Illustrationofshapeoftheetchprofilesofa<100>orientedsilicon
substrateafter
immersioninananisotropicwetetchantsolution.
Surface Micromachining
Steps of surface micromachining
a) temporary mechanical layer.
b) structural layer.
c) removal of the temporary layer.
d) release of mechanical structure layer from constraint.
Itprovidesforprecisedimensional controlinthevertical
direction.
usedtofabricatetheAnalogDevicesintegrated MEMS
accelerometer deviceshivamvishwanath174@gmail.com
used for crash airbag deployment.
Illustrationofasurfacemicromachiningprocess.
Polysiliconresonatorstructurefabricatedusingasurfacemicromachiningprocess.
Polysiliconmicromotorfabricatedusingasurfacemicromachi
ningprocess.
LIGA
Non-silicon based technology.
useofsynchrotrongeneratedx-rayradiation.
The basic process are
1.castofanx-rayradiationsensitivePMMAontoasuitable substrate.
2.maskisusedfortheselectiveexposureofthePMMAlayer.
3.PMMAisthendeveloped, with extremely smooth and vertical wall.
4. thepatternedPMMAactsasapolymermoldand plated into bath.
5. Nickelis
platedintotheopenareasofthePMMA.
6. PMMAisthenremoved.
7. leavingthemetallicmicrostructure.
LIGA is relativelyexpensive.
Thedimensionalcontrolofthisprocessisquite
good.
AnillustrationofthestepsinvolvedintheLIGAprocesstofabricatehighaspectratioMEMSdevic
es.
Atall,highaspectratiogearmadeusingLIGAtechnology.
Hot Embossing
The basic process of hot embossing process are:
1.Amoldinsertismadeusinganappropriate fabrication
method havingtheinversepattern.
2. Themoldinsertisplacedintoahotembossingsystem.
3.
Thesubstrateandpolymerareheatedtoabovetheglasstransi
tiontemperature Tg.
4.The
polymermaterialandthemoldinsertispressedintothepolyme
rsubstrate.
5. The substratesarecooledandforceisappliedtodeshivamvishwanath174@gmail.com
embossthe substrates.
Thisprocesscanmakeimprintsintoapolymer
hundredsofmicronsdeep
withverygooddimensionalcontrol.
Theadvantageofthisprocessisthatthecostof
theindividual polymerpartsisverylow.
Producingmicrofluidiccomponentsformedical
application.
Illustrationofthehotembossingprocesstocreatemicrodevices.(CourtesyoftheMNXa
tCNRI).
Photographofahotembossingplatformduringuse.
(CourtesyoftheMNXatCNRI).
SEMofavarietyofsmallteststructuresmadeinaplasticsubstrateusinghotembossing
technologyattheMNX.Theheightoftheplasticmicrostructuresisnearly300umand
thesmallestfeatureshaveadiameterofabout25um.(CourtesyoftheMNXatCNRI).
Applications
Biotechnology: discoveries such as PolymeraseChain Reaction (PCR)
microsystemsforDNAamplificationandidentification, enzyme
linkedimmunosorbentassay(ELISA), biochips for detection of hazardous
chemical and biological agents.
Medicine: MEMS pressure sensor is widely used
a) disposable sensorusedtomonitorbloodpressure.
b) monitor the patients breathing.
c)analysisofconcentrationsofO 2,CO2,glucose in blood.
d)kidneydialysistomonitortheinletandoutletpressures of blood.
Communications: High frequency circuits and mechanical

switches are much advanced RF-MEMS technology. Another
successfulapplicationofRF-MEMSisinresonatorsas
mechanical filters for communication circuits.
Inertial Sensing : MEMS inertial sensors, specifically
accelerometers and gyroscopes, are completely accepted.
MEMS accelerometers is used for crash air-bag deployment
systems in automobiles.
MEMSgyroscopes(i.e.,ratesensor)
havebeendevelopedforbothautomobileand consumer
electronics applications.
Challenges
Access to Fabrication: Only few organizations build
their own facilities.
Packaging:
Manyofthesedevicesneedtobesimultaneouslyin
contactwiththeirenvironmentas
wellasprotectedfromtheenvironment.
Fabrication Knowledge Required: Withoutexpertise
and knowledge, at best device development projects
can cost far and take much longer. At worst, they can
result in failure.
Biblography
MarcMadou,Fundamentals of Microfabrication,CRCPress1997,ISBN0-8493-9451-1
JulianW.Gardner,Microsensors: Principles and Applications,Wiley1994,ISBN0-47194135-2
GregoryKovacs,Micromachined Transducers Sourcebook,McGraw-Hill1998,ISBN0-07290722-3
HctorJ.DeLosSantos,Introduction to Microelectromechanical (MEM) Microwave Systems, ArtechHouse1999,ISBN08900-6282-x
SergeyEdwardLyshevski,Nano- and Microelectromechanical Systems,CRCPress2000, ISBN0-8493-0916-6
MohamedGad-el-Hak,ed.,The MEMS Handbook,CRCPress2011,ISBN0-8493-0077-0
P.Rai-Choudhury,ed.,MEMS and MOEMS: Technology and Applications,SPIEPress Monograph2000,ISBN0-8194-3716-6
JulianW.Gardner,andVijayK.Varadan,andOsamaO.Awadelkarim,Microsensors, MEMS and Smart
Devices,Wiley2001,ISBN0-4718-6109-X
NadimMaluf,An Introduction to Microelectromechanical Systems Engineering,ArtechHouse 1999,ISBN0-8900-6581-0
RandyFrank,Understanding Smart Sensors, 2nd ed.,ArtechHouse2010,ISBN0-89006311-7
LjubisaRistic,ed.,Sensor Technology and Devices,ArtechHouse1994,ISBN0-89006532-2
VijayVaradan,XiaoningJiang,andVasundaraVaradan,Microstereolithography and other Fabrication Techniques for 3D
MEMS,Wiley2001,ISBN0-4715-2185-X
Tai-RanHsu,MEMS and Microsystems: Design and Manufacture,McGraw-Hill2011,ISBN 0-0723-9391-2
GabrielM.Rebeiz,RF MEMS: Theory, Design, and
Technology,2001
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YOU

Microelectromechanical Systems

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What are MEMS?

Communications: High frequency circuits and mechanical

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