3-D IC Fabrication and Devices

Abstract:
3-D integrated circuits have unique fabrication designs that makes it inexpensive,
compact, and more efficient than planar circuits. The components are integrated
vertically and horizontally using less material.

Mai Chery Vue and Dylan Scheunemann

Wednesday April 23, 2014

Outline
Fabrication
Types
Monolithic
Wafer-on-Wafer
Die-on-Wafer
Die-on-Die
Wafer-on-Wafer Steps
Advantages/Disadvantages
Applications

Introduction to 3-D ICs

A Single Circuit with two or more layers of
active components.
Components can be integrated both
vertically and horizontally.

3-D IC Stacked
Problem with stacking is heat dissipation.

Types of Fabrication
Monolithic
Built on single wafer.
Diced into 3-D ICs.
Wafer-on-Wafer
Built on two or more wafers.
Aligned, bonded, and diced into 3-D ICs.
Die-On-Wafer
Components built on two wafers.
One wafer diced and aligned on the second wafer.
Die-On-Die
Components built on multiple dice.
Aligned and bonded into 3-D ICs.

Types of Fabrication
Chip means Die

Fabrication (Wafer-on-Wafer)
Components are built on two or more wafers
Alignment of wafers
Machine checks for alignment mark
Temporarily brought into contact
Inspected for correct alignment
Bonding of wafers
Then bonded together using the method best suited for
that wafer
Such as Direct, Adhesive, or Thermocompression
bonding

Fabrication (Wafer-on-Wafer)
Thinning of wafers
Can be thinned before or after bonding
Dicing Before Grinding
Saws the front before thinning from the
back
Dicing By Thinning
Applies a trench-etching process
Reduces Damage

Fabrication (Wafer-on-Wafer)
Dicing of wafers

Scribe and Break

Mechanical Sawing
Laser Cutting

Advantages
Chip Performance
Higher Bandwidth
Reduced Power Consumption
Functionality
Circuit Security
Device Packing Density
Fits into a small space
Shorter Interconnects
Cheaper fabrication costs

Disadvantages
Heat due to stacking
Testing methods
Interconnect design
CAD algorithms and tools

Applications
Monolithic IC 3D (Company in California)

FPGA, Gate Array

DRAM
NAND Flash Memory
Image Sensors
Microdisplays

Summary
3-D integrated circuits have layered active components that are vertically and
horizontally integrated. With these designs, theres about four different
fabrication types: monolithic, wafer-on-wafer, die-on-wafer, and die-on-die.
These new fabrication designs provide for better chip performance, circuit
security, smaller interconnects, and inexpensive circuits.

References
Pictures:
1. http://esl.epfl.ch/page-42448-en.html
http://domino.research.ibm.com/tchjr/journalindex.nsf/9f
2. http://lsi.epfl.ch/page-13135-en.html
e6a820aae67ad785256547004d8af0/2f263eb510ba6030852571c50 3. http://www.intechopen.com/books/metallurgy0032694!OpenDocument
advances-in-materials-and-processes/low-tem
http://en.wikipedia.org/wiki/Three-dimensional_integrated_circui
perature-wafer-level-metal-thermo-compressi
t
on-bonding-technology-for-3d-integration
4. http://www.tezzaron.com/technology/FaStack
http://homepages.rpi.edu/~luj/Papers/Luj4.pdf
.htm
http://www.wiley-vch.de/publish/dt/books/newTitles201201/3-5
27-32646-4/?sID=p2qlnooj68su7htl8qrrc2qjt3
http://electroiq.com/blog/2003/03/wafer-thinning-techniques-for-u
ltra-thin-wafers/
https://www.coherent.com/Applications/index.cfm?fuseaction
=Forms.page&PageID=273
http://www.monolithic3d.com/applications.html

Information:
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Three-Dimensional Integrated Circuit Design by Vasilis F.

Pavlidis & Eby G. Friedman

Five Key Concepts

A 3-D circuit is a Single Circuit with two or more layers
of active components.
4 Types of Fabrications
Monolithic, Wafer-on-Wafer, Die-on-Wafer, Die-onDie
Wafer-on-Wafer Fabrication
Align, Bond, Thin, Dice
Disadvantage: Heat from stacking
Applications: NAND Flash Memory, and Micro Displays