INPLANT TRAINING OVERVIEW

Submitted By:
Name: Shubham Sharma
UPT No.: EEE/085
College: SRM University

Under the Guidance of:

Name: Mr. K.Srivastava
Desig.: Sr. Engineer
Department: HRD

Introduction
BEL-

Established in 1954

Public Sector Enterprise under the

administrative control of Ministry of Defense

Manufactures

all the electronic components

and Defense Equipments

Won

on a number of national and

international awards for Import Substitution,
Productivity, Quality, Safety Standardization

Production Units
Serial No.

Year of
Establishment

Location

1.

1954

Banglore

2.

1972

Ghaziabad

3.

1979

Pune

4.

1979

Taloja(Mahrashtra)

5.

1984

Hyderabad

6.

1984

Panchkula(Haryana)

7.

1985

Chennai

8.

1985

Machilipatnam(A.P)

9.

1986

Kotdwar(U.K)

BEL Kotdwar
Established
Second

in 1986

largest unit

Provides

comunication system to Defense

forces & Microwave communication Links

Products-

Static & Mobile Radar,

Professional Grade Antennae &
Microwave euqipments

General Manager(Unit
Head)
Manufacturing
Divisions
RADAR
Communications

Supporting
Divisions
Antennae

Microwave
Components
Quality
Assurance

Marketing &
Customer
CoPersonnel &
ordination
Administration

Finance &
Accounts

Material
Managemen
t

Management
Services

Production Control
Goals:
To improve the profits of the company by better
resource management
To ensure on-time delivery products
To improve the quality of product
To reduce the capital investment
To reduce working capital needs by better
inventory management

PCB Fabrication
Abbreviated

as Printed Circuit

Board
Built on Glass Epoxy Board
Wide Application

Types of PCB
Single

Sided
Double-Sided
Multi-Layered
BEL, Ghaziabad unitmanufactures Single Sided and
Double sided PCBs

Fabrication of Single Sided

PCBs
1. Copper clad sheet is cleaned
and scrubbed

2.

Print the pattern and paste it on

the copper sheet and laminate it
with photosensitive material

3.

Positive photo paint of the

required circuit is placed over the
laminated sheet and it is
subjected to the UV light. As a
result the transparent plate gets
polymerized and the opaque part
remains unpolymerized.

4.

Plate is polymerized into the

solution where non-polymerized
part gets dissolved

4.

Tin plating is done on tracks

obtained

4.

Lamination of the plate is

removed

5.

Unwanted copper is removed by

dipping it into the solution. Only
Tin plated tracks are left

6.

Minor Drillings are done on the

tracks where components are to
be mounted and fabricated

Surface Mounting Technology

 Surface-mount technology (SMT) is a

method for producing electronic circuits in
which the components are mounted or
placed directly onto the surface of
printed circuit boards (PCBs).
An electronic device so made is called a
surface-mount device (SMD). In the
industry it has largely replaced the
through-hole technology construction
method of fitting components with wire leads
into holes in the circuit board.
Both technologies can be used on the same
board, with the through-hole technology
used for components not suitable for surface
mounting such as large transformers and
heat-sinked power semiconductors.
An SMT component is usually smaller than
its through-hole counterpart because it has

Surface mount assembly process steps:

Solder paste printing or dispensing
Component placement
Reflow
Inspection
Rework/backload
Cleaning

RADAR(INDRA II)

Working Principle of
RADAR

Central Acquisition RADAR

1.

Multi-Beam Antennae System

360 deg coverage

Prescribed coverage in elevation
Antennae will have a wide beam
in transmit mode and 8 narrow
beams in recieve mode

2. Transmitter
Amplify pulsed RF signal from few
watts to high power signal
Maintaining minimum Noise

3. Reciever
Recieves reflected signal from the
target
Signal amplified by Low Noise
Amplifier

4. Signal Processor
5. Data Centre
Performs basic function like viewing
of air picture, remote operation of
radar & radio communication
Provides shelter for operators
Level of comfort & protected against
heat, rain & dust

6. Power Source
Main Supply to RADAR & Data
Centre for electronic & mechanical
units of RADAR including AC units

7. Identification Friend or Foe(IFF)

The transponder provides an
identifying code to the secondary
radar that uses the code
Code looks up for aircraft origin &
destination, flight no., aircraft type
and even the no. of people aboard

INSTANT FIRE DETECTION & SUPPRESSION SYSTEM

(IFDSS)

 Instant Fire Detection and Suppression System (IFDSS) is

a micro controller based fire detection and suppression
system for vehicle/Tanks.
The detector unit have IR sensors and detects the fire in
crew compartment and send the confirmation signal of
fire to Main Control Unit (MCU) over Control Area Network
protocol. The Main Control Unit (MCU) takes the
necessary action to activate the fire Extinguishers.
A Fire-Wire is a flexible heat detecting wire, having one
or more elements joined in series by means of various
connector accessories. It is simply a linear Thermal
Detector, which is directly interfaced with the Main
Control Unit. Its logic is designed for detection Over
Heat, Fire, Open Circuit and Short Circuit
conditions.
The system has feature of continuous health monitoring
of Detector Units, Alarm and Flasher unit, Fire wire and
Fire Extinguishers. The system also has the features like
Built in Test facility (BITE) and Audio-Visual indication of
Over Heat and Fire conditions in Engine

SALIENT FEATURES
Built in Test facility (BITE)
Monitoring of Detector units, Fire Wire,
Alarm & Flasher unit and Fire
Extinguishers
Simple Man-Machine interface (MMI)
Environmental specification as per JSS
55555
Easy maintenance and repair
Low Power Consumption
False Free Operation
Auto cut off voltage below 18 V and
above 32 V
Electromagnetic Compatibility as per
MIL Std 461C.
Audio and visual indication of Over
Heat and Fireconditions in Engine

Quality Assurance
Ensures

quality of product produced before

delivery
Raw

materials & components purchased

are inspected according to the
specifications by the IG depart.

Ensures

the fabrication is done acc,. To the

drawing
Products

are inspected carefully & makes

the changes required

Fabrication

inspection
Checks all the fabricated parts
and ensures that these are made
as per the part drawing

Assembly

Inspection
Inspects all the assembled parts
such as PCB, cable assembly,
cable form, modules, racks and
shelters as per latest documents
and BEL standards.

Mistakes

in PCB

1. D&E Mistake
2. Shop Mistake
3. Inspection Mistake
Actions

takes after mistake is

detected

1.
2.
3.
4.
5.

Observation is made.
Object code is given.
Division code is given.
Change code is prepared.
Recommended action is taken.

THANK YOU