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A p r o to ty p ic a l s e n s o r s y s te m w a s d e v e lo p e d b a s e d o n th e 3 D g a m in g c o n s o le s e n s o r K in e c t
Current methods:
(M ic ro s o ft C o rp o ra tio n , R e d m o n d , W A , U S A ). T h e K in e c t is a 3 D im a g e a c q u is itio n s e n s o r w h ic h is
a v a ila b le fo r le s s th a n 1 0 0 a n d fo r w h ic h w e ll-d e v e lo p e d s o ftw a re is fre e ly a v a ila b le . B y m e a n s o f
1. Impedance
plethysmography (IPG)
th e K in e c ts in te g ra te d c o lo u r- a n d d e p th -c a m e ra s , im a g e s o f s u b je c ts s ta n d in g o n a b o d y w e ig h t s c a le s
2.
3.
w e re ta k e n . T h e s e n s o r w a s c o n n e c te d to a s ta n d a rd p e rs o n a l c o m p u te r th a t trig g e re d im a g e re c o rd in g
Measure
small changes in electrical resistance
a n d s to re d 3 D d a ta o f th e s u b je c ts le g s a s w e ll a s c o lo u r in fo rm a tio n o f th e im a g e . S in c e th e g e o m e tric
a d ju s tm e n t o f c a m e ra , b o d y w e ig h t s c a le s a n d le g s (s ta n d in g o n th e s c a le s ) w a s fix e d fo r a ll
3D imaging
methods
re c o rd in g s , th e re c o rd in g d e p th w in d o w w a s c o n s tric te d to th e re g io n o f th e s c a le s . A n illu s tra tio n o f
th e s e n s o r s y s te m is p r o v id e d in F ig u re 4 .
Direct volume
measurement using strain sensors
F ig u r e 4 . I llu s tr a tio n o f th e s e n s o r s y s te m , c o n s is tin g o f a 3 D c a m e r a in c o m b in a tio n w ith
a b o d y w e ig h t s c a le s , a n d o f th e fiv e p o s itio n s u s e d fo r m e a s u r in g th e le g c ir c u m fe re n c e .
E d e m a P a r a m e te r D e te r m in a tio n
I m a g e a n a ly s is w a s d o n e u s in g B le n d e r 2 .4 9 b ( B le n d e r F o u n d a tio n , A m s te r d a m , T h e N e th e r la n d s ) .
3 D im a g e a n d c o lo u r in fo rm a tio n w e re o v e rla id a n d th e re fe re n c e p o in ts A to K w e re s e le c te d m a n u a lly
1
J LE J LI dV
Change of impedance: Z
1
1
J
J
dV
J LE J LI dV
LE
LI
VV
V
Z is the impedance (/m3), V is the test volume (m3), is the conductivity (S/m).
Drawbacks (Contd)
2.
Strain sensors
Multi-point impedance sensor (12 test points)
Accelerometer, gyroscope, and temperature sensor
Data mining and machine learning algorithms
Flexible PCB controller board with wireless data transmitter
1.
Current
input
Strain sensors
2.
Microcontroller
with wireless
communication unit
Voltage
test points
Environmental sensors
3.
Accelerometer
Gyroscope
Temperature sensor
Strain
(L)
Temp
(T)
Motion
(, a)
Onboard
microcontroller
Data process
unit
Smartphone/iPad
Cloud
Data mining
Machine learning
Results
Project Plan
Sensor unit design
???
Funding Opportunity