Documente Academic
Documente Profesional
Documente Cultură
ELECTRONIC SKIN
JAYALEKSHMI S
13148
INTRODUCTION
Electronic skin has gained attention for its unique capability of detecting
subtle pressure changes
Important for safe robotic interaction
An electronic skin should have distributed sensors and should have
distributed to process the distributed sensory data.
Electronic skin is defined as set of multiple electronic and sensing
components such as touch and temperature sensors,displays,energy
scvengers and electronics etc integrated on a flexible or bendable substrates.
Various approaches:
a)Electronic skin using off the shelf electronics and sensing
components
Off the shelf electronics and sensing components are soldered to bendable
printed circuit board route
These solutions are akin to having mechanically integrated but otherwise
distinct and stiff subcircuit islands of off the shelf electronic components,
connected to one another by metallic interconnects.
The semi rigid flexible pcb based skin patches conform to surface with large
curvature.
Fabrication steps:
The wafer is first thinned by back-side chemical etching, and
adhered to a carrier substrate, which in present case is PDMS film
present on another wafer.
The wafer is then diced and bulk silicon is removed, leaving
behind only the membranes on PDMS.
The membranes are transferred to the polyimide (PI) foil
present on yet another wafer. After transferring the membranes to the PI,
the left over PDMS is removed and finally, the PI foil with membranes is
released from the wafer.
APPLICATIONS
The E-Skin Sensors Can Be Fixed to the Skin Like Temporary Tattoos
Health monitoring(EEG,ECG)
TRADITIONAL APPROACH
ADVANTAGES
Reduses wires
DISADVANTAGES
Cost is high
Single use
FUTURE SCOPE
CONCLUSION
This work presented the complementary research towards highperformance flexible electronic, especially towards obtaining electronic
skin.
The e-skin approaches presented here are based on:
a) soldering the off-the shelf electronic and sensing components on
flexible PCBs
b) printing of passive components directly on flexible substrates
c) ultra-thin silicon chips (flexchips).
These approaches are used to develop various components of e-skin and
ultimately the e-skin will be obtained by using a mix of these approaches
References
http://www.npr.org/2011/08/12/139579614/electro nic- skin-monitors-brain-heartactivity
http://tuberose.com/Electromagnetic_Fields.html
http://news.discovery.com/tech/ultrathin-device- detects-brain-signals110811.html
http://sciencefriday.com/
http://www.voanews.com/english/news/health/El ectronic-Skin-Monitors-HeartBrain-Function- 127726623.html
sensor technology and devices by Ljubisa Ristic