ME 189

Design and Manufacture of Microsystems

Instructor:

Tai-Ran Hsu
Room 117A, Engineering Building

Course code: 21775, Spring 2010

Class room: Room 117, Engineering Building
Class hours: Mondays and Wednesdays: 10:30-11:45 AM

Pre-requisites: MatE 25, ME 106 and ME 154, or with consent of the Instructor

Office hours: Mondays: 01:00 PM 04:00 PM

or by appointment via E-mail: tai-ran.hsu@sjsu.edu
 Course Goals

To learn about electromechanical design, manufacture and packaging

of micro devices and systems.

To learn of the basic design principles for MEMS and Microsystems.

To learn of the basic principles of fabrication techniques used in

microdevices and microsystems, as well as integrated circuits.

To learn of the basic principles involved in microsystems packaging.

To learn the basic principle of nanotechnology and nano-scale

engineering.
 Student Learning Objectives

To be able to explain what MEMS, Microsystems and Nanotechnology are.

To explain the working principles of many MEMS and microsystems in

the marketplace.
To understand the engineering science topics relevant to MEMS ,microsystems
and nanotechnology.
To be able to distinguish the design, manufacture and packaging techniques
applicable to microsystems from those for microelectronics.
To know the materials, in particular, silicon and its compounds for MEMS.

To be able to explain the basic and relevant design principles of MEMS and
microsystems.
To learn the scaling laws for miniaturization.
To be able to identify the optimum microfabrication and packaging techniques
for microdevices and systems.

To be able to handle mechanical systems engineering design of micro-

scale devices.
To learn the fundamentals of nanotechnology, and its differences from micro-
scale engineering.
 Course Content

Overview of design and manufacture of micro devices and systems

including MEMS

Engineering physics and mechanics,

Scaling laws for miniaturization,

Microfabrication techniques,

Materials for MEMS and microsystems,

Microsystems design methodologies using engineering mechanics

and thermofluid engineering,
Microsystems assembly and packaging, and

Introduction to nanotechnology and nanoscale engineering.

Textbook

MEMS & Microsystems Design, Manufacture,

and Nanoscale Engineering, 2nd Edition

Author: Tai-Ran Hsu

John Wiley & Sons, Inc., Hoboken, New Jersey
March 2008 (ISBN 978-0-470-08301-7
Reference Books

MEMS Packaging
Editor and author: Tai-Ran Hsu
Institute of Electrical Engineers, United Kingdom
2004 (ISBN 0-86341-335-8)

Fundamentals of Microfabrications
Author: Marc Madou, CRC Press, 2001

Micromachined Transducers Sourcebook

Author: Greg Kovacs, McGraw-Hill, 1998

Microchip Fabrication, 3rd edition

Author: Peter van Zant, McGraw-Hill, 1997.
 Grading Scheme
Mid-Term Quiz: 25% (March 17, 2010 regular class time)

Self-Study Project: 25% (Due on the same day of the final exam)
(See 2005 projects for examples)

Final Examination: 50% (Friday, May 21, 2010

09:45 AM 12:00 Noon)

Letter grades will be assigned using the following scheme:

90 100% = A+ 85 - 89% = A 80 84% = A-

75 79% = B+ 70 74% = B 65 69% = B-

60 64% = C 55 59% = C- 50 54% = D

50% and less = F

NOTE: There will be no make-up quiz or exam except serious
medical reasons with MDs certificate.
 Instruction Schedule

Week 1: Overview of MEMS and microsystems

Week 2: Overview of MEMS and microsystems and working principles of
microsystems
Week 3: Working principles of microsystems and engineering science for
microsystems design and fabrication
Week 4, 5: Engineering mechanics for microsystems design
Week 6, 7: Thermofluid engineering and microsystems design
Week 8: Scaling laws in miniaturization and materials for MEMS
Week 9: Materials for MEMS and microsystems
Week 10: Spring break
Week 11,12: Microsystems fabrication processes
Week 13: Overview of micromanufacturing
Week 14: Microsystems design and assembly
Week 15: Microsystems packaging and testing
Week 16: Introduction to nanotechnology and nanoscale engineering
 Self-Study Projects

Objective:

To conduct in-depth studies on topics or device design, fabrication and

packaging using micro- and nanotechnologies, or

To construct models for enhancing learning the design and packaging of

micro- and nanoscale engineering

Project Teams:

Consists no more than two students in the team

Deliverables:

Project report in approximately six pages, or prototype of specific devices

 ME 189 Microsystems Design and Manufacture
Typical Research Study Projects (2005)
1. Micro molded polymer for microfluidics structure (Srikanth Racherlar and Dennis Lingad)
(John Lee, SJSU and Trevor Niblock, CTO, Analatom, Inc. Sunnyvale, CA)
2. Concept and feasibility for measuring micro force contact with a nanoindenter
(John Lee) (Van To and Jerry Tse)
3. Fabrication of high-aspect ratio micromolding master with SU-8 photopolymer
(John Lee) (Jimmy Chan and Terry Tam)

4. Micro robots for in-vivo diagnosis (Michelle Woodhouse)

5. Wireless control of microrobots (Salvador Tiscanero)

6 Automated wafer handling systems (300 mm diameter wafers) (Mohsiu Waqar)

7. Wafer slicing and dicing systems (Prikariti Lal)

8. Micro gyroscopes for stability control of moving vehicles (Matt McLellan)

9. Applications of microfluidics in biomedics (Hoang Pham)

10. Case study of heat conduction in sub-micrometer scale (Jeff Bull)

11. Micro heat pipes and their applications (Yong Chang Li)

12. Ion implantation-Mechanisms and models

(Projects 05. ME 189)
 Self-Study Projects in 2008

Polymer for MEMS and microfluidics (Fredrick Tai and Greg Barker)

Micro robots for in-vivo diagnosis (Kyle Chang, Alexandra Pham and Sang Nguyen)

Wireless power supply to microsystems (Nick Pham)

Application of micro gyroscopes for stability control of moving vehicles

(Andrew Day, Brent Miller and Nicole Sampson)

Applications of microfluidics in biomedics (Jing-Keat Goh and Howlit Chng)

Design of Masks for photolithographic process (Kuldeep Narwat and Deval Shah)

Complete airbag system for automobile safety (Harish Penmethsa and Pavan Murukatla)
 Self-Study Projects in 2009

1. Design and packaging of any of the following microdevices:

A. Biomedical devices
B. Mobile telecommunication equipment
C. Wireless sensors including GPS

2. Class demonstration models for instruction of MEMS, microsystems,

and nanoscale engineering systems:

A. Working principles of micrsensors

B. Microactuation techniques
C. New concepts of molecular electronics, e.g. gates, relays, etc.