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Solid State Devices

Electrical Classification of Materials


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Electrical Classification of Materials

• Conductor
• Insulator
• Semiconductor

Conductor
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Conductor

• A material with LESS THAN 4


VALENCE ELECTRONS.

Insulator
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Insulator

• A material with MORE THAN 4


VALENCE ELECTRONS.

Semiconductor
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Semiconductor
• A material with EXACTLY 4 VALENCE
ELECTRONS.
• Semiconductors have electrical
characteristics in between conductors and
insulators.
• SILICON and GERMANIUM are examples of
semiconductor materials.

Energy Gap (Eg) Comparison


Energy Gap (Eg) Comparison
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Bonding of Atoms
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Bonding of Atoms
• Ionic Bond
• Metallic Bond
• Covalent Bond

Ionic Bond
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Ionic Bond

• Results from attractive forces


between positive and negative
ions or between pairs of
oppositely charged ions.

Metallic Bond
Metallic Bond
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• Results from attractive forces


between a group of positive
ions and a sea of electrons that
are free to move about among
its ions.

Covalent Bonding
Covalent Bonding
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• Results when atoms


SHARE THEIR
VALENCE ELECTRONS
with other atoms .
• The shared electrons
are attracted
simultaneously to two
atoms resulting in a
force that holds them
together.

Conduction in Semiconductors
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Conduction in Semiconductors

• Electron current flow


• Hole current flow

Electron Flow
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Electron Flow

Hole Flow
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Hole Flow

Analogy of Hole Flow


Analogy of Hole Flow 15

Types of Semiconductor Materials


Types of Semiconductor Materials 16

• Intrinsic Material
• A Semiconductor that is FREE FROM
IMPURITIES, such as Silicon or Germanium.

• Extrinsic Materials
• Semiconductor materials with SOME IMPURITIES
ADDED to change its electrical properties.
• The process of adding impurities is called DOPING.

Type of Extrinsic Materials


Type of Extrinsic Materials 17

• N-TYPE SEMICONDUCTORS
• An extrinsic semiconductor material formed by adding DONOR
impurities, such as as PENTAVALENT atoms.
• Majority carriers are ELECTRONS
• Minority carriers are HOLES

Type of Extrinsic Material


Type of Extrinsic Material 18

• P-TYPE SEMICONDUCTORS
• An extrinsic semiconductor material formed by adding
ACCEPTOR impurities, such as TRIVALENT atoms.
• Majority carriers are HOLES
• Minority carriers are ELECTRONS

Types of Dopes
Types of Dopes 19

• DONOR or PENTAVALENT ATOMS


• N-TYPE
• PHOSPOROUS
• ANTIMONY
• ARSENIC

• ACCEPTOR or TRIVALENT ATOMS


• P-TYPE
• GALLIUM • ALUMINUM
• BORON • INDIUM

Semiconductor Diodes
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Semiconductor Diodes

The PN Junction
The PN Junction 21

• When the P-TYPE material and N-TYPE material


are BROUGHT TOGETHER, they form a so-called
PN JUNCTION.

Formation of Depletion Region


Formation of Depletion Region 22

• The region created by


the PN junction
forming a barrier
potential.
• The DEPLETION refers
to the fact that the
region near the PN
junction is DEPLETED
of CHARGED
CARRIERS due to
diffusion across the
junction.

Barrier Potential
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Barrier Potential
• The POTENTIAL
DIFFERENCE of the
electric field across the
depletion region is the
AMOUNT OF VOLTAGE
required to move
electrons through the
electric field.
• 0.7V for Silicon
• 0.3 for Germanium
• Barrier potential
DECREASES as
temperature INCREASES

Biasing the Diode


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Biasing the Diode


• BIAS refers to the use of a dc
voltage to establish a certain
operating condition for an electronic
device.
• Types:
• Forward Bias
• Reverse Bias

Forward Bias
Forward Bias
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• Is the condition
that ALLOWS
CURRENT
THROUGH THE PN
JUNCTION to flow
when a dc voltage
is applied to a PN
junction

Reverse Bias
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Reverse Bias
• Is the condition that
ESSENTIALLY PREVENTS
CURRENT through the
diode. When a dc voltage
is applied to a PN
junction.
• MINORITY CARRIERS
• The EXTREMELY SMALL
CURRENT THAT EXIST IN
THE REVERSE BIAS
condition.

Breakdown Voltage
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Breakdown Voltage
• The MAXIMUM VOLTAGE the junction
diode can handle when reverse
biased.
• Also known as PEAK REVERSE
VOLTAGE (PRV) OR PEAK INVERSE
VOLTAGE (PIV)

Voltage-Current Characteristic of Diode


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Voltage-Current Characteristic of Diode

Diode Equivalent Circuit


Diode Equivalent Circuit 29

• Ideal Diode Model


• Simplified Diode Model
• Linear Diode Model

Ideal Diode Model


Ideal Diode Model 30

• The diode is
assumed to a ZERO
THRESHOLD
VOLTAGE and has
NO RESISTANCE
when FORWARD
BIAS.

Simplified Diode Model


Simplified Diode Model 31

The diode is
assumed to have
a threshold
voltage but NO
RESISTANCE.

Linear Diode Model


Linear Diode Model 32

• The diode has THRESHOLD VOLTAGE,


Vth and FORWARD RESISTANCE.

Diode Resistance
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Diode Resistance

• DC or Static Resistance
• AC or Dynamic Resistance
• Average AC Resistance

DC or Static Resistance
DC or Static Resistance 34

• DC or Static Resistance is the


FORWARD RESISTANCE of the diode
when in DC circuit analysis.

AC or Dynamic Resistance
AC or Dynamic Resistance
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• AC or Dynamic Resistance of the


diode when in AC circuit analysis.

Average AC Resistance
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Average AC Resistance

• Average AC Resistance is the forward


resistance of the diode in AC circuit
analysis.

Elect par rectifier Diodes


Electrical Characteristics for Rectifier Diodes
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• DC BLOCKING VOLTAGE [VR]


• the maximum reverse dc voltage that will not cause
breakdown.
• AVERAGE FORWARD VOLTAGE DROP [VF(AV)]
• the average forward voltage drop across the rectifier
given at a specified forward current and temperature.
• AVERAGE RECTIFIER FORWARD CURRENT [IF(AV)]
• the average rectified forward current at a specified
temperature, usually at 60 Hz with a resistive load.
• AVERAGE REVERSE CURRENT [IR(AV)]
• the average reverse current at a specified
temperature, usually at 60 Hz.
• PEAK SURGE CURRENT [ISURGE]
• the peak current specified for a given number of
cycles or portion of a cycle.

signal Diodes
Electrical Characteristics for Signal Diodes
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• PEAK REVERSE VOLTAGE [PRV]


• the maximum reverse voltage that can be applied
before reaching the breakdown point. (PRV also
applies to the rectifier diode.)
• REVERSE CURRENT [IR]
• the small value of direct current that flows when a
semiconductor diode has reverse bias.
• MAXIMUM FORWARD VOLTAGE DROP AT
INDICATED FORWARD CURRENT [V F@IF]
• the maximum forward voltage drop across the
diode at the indicated forward current.
• REVERSE RECOVERY TIME [trr]
• the maximum time taken for the forward-bias diode
to recover its reverse bias.
Special-Purpose Diodes
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Special-Purpose Diodes

Zener Diodes
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Zener Diodes
• Zener Diode is a silicon
PN junction device that
differs from rectifier
diodes because it is
DESIGNED FOR
OPERATION IN THE
REVERSE-BREAKDOWN
REGION.

Zener Breakdown
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Zener Breakdown
• ZENER BREAKDOWN occurs in Zener
diodes at low reverse voltage.
• The Zener diode is heavily doped to reduce
the breakdown voltage.
• Types of reverse breakdown
• Zener Breakdown
• Avalanche Breakdown

Zener Breakdown
Zener Breakdown
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• Breakdown voltage < 5V

Avalanche Breakdown
Avalanche Breakdown 43

• Breakdown voltage > 5V

Zener Diode Application


Zener Diode Application 44

• Zener Diodes are often used as a type of of


VOLTAGE REGULATOR for providing stable
reference voltages.

Tunnel Diode
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Tunnel Diode
• A tunnel diode is biased to operate in the
negative resistance region.
• It can be used as an oscillator or an
amplifier.
• Tunnel diodes are also used extensively in
highspeed switching circuits because of
the speed of the tunneling action.

Varactor/ 1:10M—1000:10M
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Varactor
• Voltage-Variable Capacitor is a
device that utilizes the variation
of the PN junction capacitance
when biased diffently.

Light-Emitting Diode (LED)


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Light-Emitting Diode (LED)


• A type of PN junction that emits light
when forward bias.
• The large exposed surface area on
one layer of the semiconductive
material permits the photons to be
emitted as visible light.
• The process is called
ELECTROLUMINESCENCE.
Photodiode
Photodiode
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• Photodiode is a device that operates


in REVERSE BIAS.
• A Photodiode current increases as
light strikes into its opening.
• The photodiode has a small
transparent window that allows light
to strike the PN junction.

DIODE MAINTENANCE
DIODE MAINTENANCE 49

• Diodes are rugged and efficient.


• One of the greatest dangers to the
diode is heat.
• THERMAL RUNAWAY
• A conduction that exists when heat
causes more electron-hole pairs to b
generated; which, in turn, causes more
heat and may eventually cause diode
destruction.

Transistors
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Transistors

Bipolar Junction Transistors (BJT)


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Bipolar Junction Transistors (BJT)

• BJT is constructed with three doped


semiconductor regions separated by
two PN junctions.
• BIPOLAR refers to TWO CHARGED
CARRIERS: Electrons and Holes.
• The Three Terminals: Emitter, Base
and Collector

Types of BJT
Types of BJT
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Transistor Operation
Transistor Operation 53

Reverse bias
junction

Forward bias
junction

Biasing and Operations


Biasing and Operations
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Characteristic Curve
Characteristic Curve 55

Transistor configuration
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Transistor Configurations

• Common Base
• Common Emitter
• Common Collector

Common Base
Common Base
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Alpha
Alpha 58

• Common Base Amplification Factor.


• It is the ratio of the collector current
change to the change in emitter current.
• Ranges from 0.9 to 0.999

Common Emitter
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Common Emitter

Beta
Beta 60

• Common Emitter Forward Current Amplification


Factor
• It is the ratio of change in collector current to
the base current.
• Beta ranges from 20 to 600

Common Collector
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Common Collector

Gamma
Gamma
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• Common Collector Forward Current


Amplification Factor.
• It is the ratio of change in emitter
current to the base current.

Comparison of Transistor Configuration


Comparison of Transistor Configuration 63

Types of Biasing
Types of Biasing
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• Fixed-bias
• Emitter stabilized
• Voltage Feedback
• Voltage divider

Fixed Bias
Fixed Bias
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• Fixed bias has the


HIGHEST POWER
GAIN but the most
UNSTABLE
• Base current bias

Emitter Stabilized
Emitter Stabilized
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• Emitter is MORE
STABLE
COMPARED TO
FIXED BIAS but
with LESSER
GAIN.

Voltage feedback
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Voltage Feedback
• Almost the
same with
voltage divider
bias but with
LESS NUMBER
OF RESISTORS

Voltage divider
Voltage Divider Bias
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• Voltage Divider
Bias is
considered the
most stable but
relatively lower
in gain.

Field Effect Transistors (FET)


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Field Effect Transistors (FET)

• A unipolar, voltage-controlled
device where the voltage
between the two terminals,
gate and source controls the
current through the device.

Types of Jfet
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Types of FET
• Junction FET (JFET)
• Metal Oxide Semiconductor FET
(MOSFET)
• Depletion Type
• Enhancement Type

Junction FET (JFET)


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Junction FET (JFET)


• JFETs terminals:
• SOURCE(S)
• DRAIN(D)
• GATE(G).
• Two types:
• N-CHANNEL
• P-CHANNEL.

Construction of JFET
Construction of JFET 72

N-channel JFET
N-channel JFET 73

P-channel JFET
P-channel JFET 74

MOSFET
MOSFET
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• Has no PN junction
• Gate is insulated from the
channel by SiO2.
• TYPES
• Depletion
• Enhancement

MOSFET (Depletion Type)


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MOSFET (Depletion Type)

MOSFET (Depletion Type) Operation


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MOSFET (Depletion Type) Operation

MOSFET (Enhancement Type)


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MOSFET (Enhancement Type)

THE END
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