Shaswata Bose 17ME167 Dept. of Mechanical Engineering NITK Surathkal WHAT IS AN ACCELEROMETER?
• An accelerometer is a device used to sense the absolute or
relative acceleration of a device. • The fundamental concept behind the working of any MEMS accelerometer is based on the deflection of a certain body known as proof mass attached to a rigid body via springs under acceleration TYPES OF ACCELEROMETERS
• All accelerometers work on the same principle, but the process by
which deflection of the proof mass is converted into electric signal varies. • The different types of accelerometers I have found so far:- 1. Piezoresistive 2. Capacitive 3. Tunneling 4. Resonance BRIEF DESCRIPTION OF THE WORKING OF SOME TYPICAL MEMS ACCELEROMETERS PIEZORESISTIVE MEMS ACCELEROMETERS
• In Piezoresistive accelerometers, a piezoresistive piece is embedded
in the proof mass. • The motion of the proof mass under acceleration results in the motion of the embedded piezoresistor which causes a change in its resistance. • This change in resistance can be used to determine the acceleration acting on the setup A schematic representation of a piezoresistive MEMS accelerometer CAPACITIVE MEMS ACCELEROMETERS • In a capacitive MEMS accelerometer, the proof mass has tiny fingerlike potrusions that constitute the metal plates of capacitors attached to a fixed base • As the proof mass moves under acceleration, the gap between the capacitor plates changes, which results in a change of capacitance of the setup. • Using suitable electrical connections, the variation in gap between the plates will represent the acceleration acting on the setup • Plates like this can be arranged so that the accelerometer can read accelerations in all the 3 directions Schematic representation of a 3-Axis capacitive MEMS accelerometer Perspective view of the Z proof mass to show the Z acceleration sensing capacitors TUNNELING MEMS ACCELEROMETERS
• These accelerometers are used to detect minor acceleration acting
on a body • The setup consists of a proof mass and a tunneling tip close to the proof mass so as to allow electrons to tunnel through the air gap between the tip and the proof mass • When some acceleration acts on the proof mass, the tunneling gap increases. In order to maintain the tunneling current, some actuation mechanism can be used • The actuation can then be converted into acceleration readings Schematic representation of a tunneling accelerometer SEM picture of the tunneling tip used for micro and sub-micro g measurements RESONANCE MEMS ACCELEROMETERS
• In these type of accelerometers, the proof mass is anchored to a rigid
base via tuning fork-like resonators. The resonators are electrically actuated to vibrate at their resonant frequencies. • The acceleration acts axially on the setup. This results in a shift of the resonant frequency of the setup under axial accelerations • This frequency variation can be used to detect the acceleration acting on the body Schematic representation of a resonance MEMS accelerometer MANUFACTURING PROCESSES FOR MEMS
• Various micromachining methods are available which can be used to
fabricate these devices, namely:- 1. Bulk micromachining 2. Surface micromachining 3. Wafer bonding 4. Deep Reactive Ion Etching(DRIE) 5. LIGA 6. Hot Embossing BULK MICROMACHINING
• In this process, material is removed by chemical etchants.
• The region where the material is not to be removed is covered by a masking agent like silicon nitride • It is of two types:- isotropic and anisotropic etching • Difficult to control etch depth • Etch stops are thus used to control the depth of those etches • In the substrate SURFACE MICROMACHINING
• In this process, a sacrificial layer is applied on the substrate and the
pattern is etched on the layer using photolithography • The gaps are filled then filled using Si to form the structural layer • The rest of the sacrificial layer is removed to get the complete product DEEP REACTIVE ION ETCHING (DRIE)
• In this process, the unmasked region is alternately exposed to SF6 and
C4F8 which alternately etches and covers the etch with a protective layer. • The anisotropy of the etch removes the base faster than the sidewall. • Alternate etching and protective coating results in deep vertical cuts. • The sidewalls are not smoothed and are scalloped LIGA • Used to form deep, smooth and nearly vertical etches in PMMA molds, which can then be used to form the part • A special X-ray mask is needed for protecting the areas not to be etched • The process is very expensive as it requires a special X-ray mask and an X-ray synchrotron • Sometimes, the final product is used as as a tool insert to imprint the shape of the tool into a polymer layer. • Electroplating of metal in the mold is then done and the polymer mold is removed to obtain the final product HOT EMBOSSING
• In this method, a tool insert is fabricated using LIGA, which is then
heated along with the polymer substrate at a temperature higher than its glass transition temperature and the tool insert is embossed in the polymer substrate • The system is then allowed to cool down and the polymer substrate is then removed from the insert, which can then be used as the product • The process needs to be performed in complete vacuum in the absence of any impurities in order to ensure high dimensional accuracy THANK YOU!