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Ver 3.0 2012
 Structura si functionare componente PC
( III )

Procesoare si socluri Intel si AMD

(2008 -2012)
Ver 1.0

Aceasta prezentare reprezinta continuarea documentatiei video “Structura si functionare

componente PC”, partea a I-a si a II-a, dedicate arhitecturii PC bazate pe componente Intel si
AMD, existente deja pe Youtube. Primele doua parti le puteti acessa prin link-urile

http://youtu.be/x_xH4b5u4zk si http://youtu.be/EbxWY8YagKo
INTEL
Sockets
LGA 775 (Socket T)

LGA 775, also known as Socket T, is an Intel desktop CPU socket. LGA stands for land
grid array. Unlike earlier common CPU sockets, such as its predecessor Socket 478, the
LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact
points on the underside of the processor (CPU).

The CPU is pressed into place by a "load plate", rather than human fingers directly. The
installing technician lifts the hinged "weld plate", inserts the processor, closes the load
plate over the top of the processor, and pushes down a locking lever. The pressure of the
locking lever on the load plate clamps the processor's 775 copper contact points firmly
down onto the motherboard's 775 pins, ensuring a good connection. The load plate only
covers the edges of the top surface of the CPU (processor heatspreader). The center is
free to make contact with the cooling device placed on top of the CPU.
Type: LGA
Chip form factors: Flip-chip land grid array
The Prescott and Cedar Mill Pentium 4 cores, as well as the Smithfield and Presler Contacts: 775
Pentium D cores, used the LGA 775 socket. In July 2006, Intel released the desktop FSB protocol: AGTL+
version of the Core 2 Duo (codenamed Conroe), which also uses this socket, as does the FSB frequency: 133 MHz (533 MT/s)
subsequent Core 2 Quad. Intel changed from Socket 478 to LGA 775 because the new pin 200 MHz (800 MT/s)
type offers better power distribution to the processor, allowing the front-side bus to be 266 MHz (1066 MT/s)
raised to 1600 MT/s. The 'T' in Socket T was derived from the now cancelled Tejas core, 333 MHz (1333 MT/s)
which was to replace the Prescott core. Another advantage for Intel with this newer 400 MHz (1600 MT/s)
architecture is that it is now the motherboard which has the pins, rather than the CPU, Processor dimensions: 1.47 × 1.47 inches
transferring the risk of pins being bent from the CPU to the motherboard. Processors: Intel Pentium 4 (2.60 - 3.80 GHz)
Intel Celeron D (2.53 - 3.60 GHz )
Intel Pentium 4 Extreme Edition
All LGA 775 processors have the following mechanical maximum load limits which should (3.20 - 3.73 GHz)
not be exceeded during heat sink assembly, shipping conditions, or standard use. The Intel Pentium D (2.66 - 3.60 GHz)
transition to the LGA packaging has lowered those load limits, which are smaller than the Pentium Extreme Edition
load limits of Socket 478 processors but they are bigger than Socket 370, Socket 423 and (3.20 - 3.73 GHz)
Socket A processors, which were fragile. They are large enough to ensure that processors Pentium Dual-Core (1.40 -3.33 GHz)
will not crack. Intel Core 2 Duo (1.60 - 3.33 GHz)
Intel Core 2 Extreme (2.66-3.20 GHz)
Intel Core 2 Quad (2.33 - 3.00 GHz)
The socket has been superseded by the LGA 1156 (Socket H) and LGA 1366 (Socket B) Intel Xeon (1.86-3.40 GHz)
sockets. Intel Celeron (1.60 - 2.40 GHz
LGA 1156 (Socket H sau H1)

LGA 1156, also known as Socket H or H1, is an Intel desktop CPU socket. LGA stands for
land grid array. Its incompatible successor is LGA 1155.

LGA 1156, along with LGA 1366, were designed to replace LGA 775. Whereas LGA 775
processors connect to a northbridge using the Front Side Bus, LGA 1156 processors
integrate the features traditionally located on a northbridge on the processor itself. The
LGA 1156 socket allows the following connections to be made from the processor to the
rest of the system:

PCI-Express 2.0 ×16 for communication with a graphics card. Some processors allow this
connection to be divided into two ×8 lanes to connect two graphics cards. Some Type: LGA
motherboard manufacturers use Nvidia's NF200 chip to allow even more graphics cards to
Chip form factors: Flip-chip land grid array
be used.
Contacts: 1156
DMI for communication with the Platform Controller Hub (PCH). This consists of a PCI-
Express 2.0 ×4 connection. FSB protocol: PCIe 16× (video) + 4× (DMI) + 2
DP (FDI), 2 DDR3 channels
FDI for communication with the PCH. This consists of two DisplayPort connections.
Processor dimensions: 37.5 × 37.5 mm[1]
Two memory channels for communication with DDR3 SDRAM. The clock speed of the
memory that is supported will depend on the processor. Processors: I Intel Celeron
LGA 1156 socket and processors will be discontinued sometime in 2012, along with LGA Intel Core i3
1366.
Intel Core i5
All LGA 1156 processors and motherboards made to date are interoperable, making it
Intel Core i7
possible to switch between a Celeron, Pentium, Core i3 or Core i5 with integrated graphics
and a Core i5 or Core i7 without graphics. However, using a chip with integrated graphics Intel Pentium
on a P55 motherboard will (in addition to likely requiring a BIOS update) not allow use of
Intel Xeon
the on-board graphics processor, and likewise, using a chip without integrated graphics on
a H55, H57 or Q57 motherboard will not allow use of the motherboard's graphics ports
LGA 1155 (Socket H2)

LGA 1155, also called Socket H2, is an Intel microprocessor compatible socket which
supports Intel Sandy Bridge and Ivy Bridge microprocessors.

LGA 1155 is designed as a replacement for the LGA 1156 (known as Socket H). LGA 1155
has 1155 protruding pins to make contact with the pads on the processor. Processors of
LGA 1155 and LGA 1156 sockets are not compatible with each other since they have
different socket notches. However, cooling solutions are compatible between both LGA
1155 and LGA 1156 sockets, as the processor has the same dimensions, profile and
construction, and similar heat production.

Type: LGA
Integrated USB 3.0 is confirmed for the future Z77, Z75 and H77 chipsets intended for Ivy
Bridge CPUs. Contacts: 1155
Processor dimensions: 37.5mm × 37.5mm[1]

Sandy Bridge chipsets, except Q65, Q67 and B65, support both Sandy Bridge and Ivy Processors: Sandy Bridge, Ivy Bridge
Bridge CPUs though a BIOS upgrade is required.[3] Sandy Bridge based processors
officially support up to DDR3-1333 memory, however in practice speeds up to DDR3-2133
have been tested to work successfully.

All Ivy Bridge chipsets and motherboards support both Sandy Bridge and Ivy Bridge
CPUs. Ivy Bridge based processors will officially support up to DDR3-1600, up from DDR3-
1333 of Sandy Bridge. Consumer Ivy Bridge chipsets will also allow overclocking of K-
series processors.
LGA 1366 (Socket B)

LGA 1366 supersedes Intel's LGA 775 (Socket T) in the high-end and performance
desktop segments. It also replaces the server-oriented LGA 771 (Socket J) in the entry
level and is superseded itself by LGA 2011. LGA stands for land grid array. This socket has
1,366 protruding pins which touch contact points on the underside of the processor (CPU)
and accesses up to three channels of DDR3 memory via the processor's internal memory
controller.

Socket 1366 (Socket B) uses QPI to connect the CPU to a reduced-function northbridge
that serves mainly as a PCI-Express controller. A slower DMI is used to connect Intel's
most recent northbridge and southbridge components. By comparison, Intel's socket 1156
(Socket H) moves the QPI link and PCI-Express controller onto the processor itself, using
Type: LGA
DMI to interface a single-component "chipset" (now called PCH) that serves traditional
southbridge functions. The difference in pin number is mostly a reflection of the number of Chip form factors: Flip-chip land grid array
memory channels served.
Contacts: 1366
FSB protocol: Intel QuickPath Interconnect
In November 2008, Intel released Core i7, which was the first processor requiring this
FSB frequency: 1× to 2× QuickPath
socket. LGA 1366 was replaced by LGA 2011 on November 14, 2011, supporting Sandy
Bridge E-series processors. LGA 1366 socket and processors will officially be discontinued Processor dimensions: 1.77 × 1.67 inches
in 2012. (44.958mm x 42.418mm) [1]
Processors: Intel Core i7 (9xx series)
Socket B processors have the following mechanical maximum load limits which should not Intel Xeon (35xx, 36xx,
be exceeded during heatsink assembly, shipping conditions, or standard use. Load above
55xx, 56xx series)
those limits will crack the processor die and make it unusable.
Intel Celeron P1053

Processors using this socket have a lower static load limit than previous models using LGA
775.
The desktop chipset that supports LGA 1366 is Intel's X58.
LGA 2011 (Socket R)
LGA 2011, also called Socket R, is a CPU socket by Intel. It replaces Intel's LGA 1366
(Socket B) and LGA 1567 in the performance and high-end desktop and server
platforms.The socket has 2,011 protruding pins which touch contact points on the
underside of the processor.

Socket R uses QPI to connect the CPU to additional CPUs. DMI 2.0 is used to connect the
processor to the PCH. The memory controller and 40 PCIe lanes are integrated on the
CPU. On a secondary processor an extra x4 PCIe interface replaces the DMI interface. As
with its predecessor LGA1366 there is no provision for integrated graphics.

The socket was released on 14 November 2011, and supports Sandy Bridge E-series
processors with 4 memory channels of DDR3-1600,[2] as well as, 40× PCIe 2.0 or 3.0
lanes. The Extreme Edition processor supports six cores with 15 MB of shared L3 cache
on a ring bus and a quad-channel DDR3 memory controller. LGA 2011 motherboards have
Type: LGA
either 4 or 8 DIMM slots which allows for a maximum support of 32GB, 64GB or 128GB[ of
memory. Socket R also has to ensure platform scalability beyond eight cores and 20 MB of Chip form factors: Flip-chip land grid array
cache.
Contacts: 2011
FSB protocol: Intel QuickPath
LGA 2011 will also be compatible with future Ivy Bridge-E processors.
Interconnect DMI 2.0
FSB frequency: 1× to 2× QuickPath,
Information for the desktop LGA 2011 socket processors can be found in the table below.
DMI 2.0
Processors Core: i7 (3xxx series)
Sandy Bridge-E processors are not bundled with standard air cooled CPU-coolers. Intel is
Intel Xeon (E5 series)
offering a standard CPU-cooler, and a liquid-cooling CPU-cooler, which are both sold
separately. Ivy Bridge-E
Processors
One star performance
Celeron

Celeron is a brand name given by Intel Corp. to a number of different x86 computer microprocessor
models targeted at budget personal computers.

Celeron processors can run all IA-32 computer programs, but their performance is often significantly
lower when compared to similar CPUs with higher-priced Intel CPU brands. For example, the Celeron
brand will often have less cache memory, or have advanced features purposely disabled. These
missing features can have a variable impact on performance, but is often very substantial. While a few
of the Celeron designs have achieved surprising performance, most of the Celeron line has exhibited
noticeably degraded performance. This has been the primary justification for the higher cost of other
Intel CPU brands versus the Celeron range.

Introduced in April 1998 the first Celeron branded CPU was based on the Pentium II branded core.
Subsequent Celeron branded CPUs were based on the Pentium III, Pentium 4, Pentium M, and Intel
Core branded processors. The latest Celeron design (as of July 2011 is based on the second
generation Core i3/i5/i7 series (Sandy Bridge). This design features independent processing cores
(CPUs), but with only 66% as much cache memory as the comparable Core i3 offering.
Celeron
Produced From April 1998 to
present
Common Intel
manufacturer(s)
Max. CPU clock 266 MHz to
rate 3.6 GHz
FSB speeds 66 MHz to
1066 MT/s
Min. feature size 250 nm to 32 nm
Instruction set x86, x86-64
Microarchitecture P6, NetBurst, Core,
Nehalem, Sandy
Bridge
Socket(s) Slot 1
Socket 370
Socket 478
LGA 775
Socket M
Socket P
LGA 1156
LGA 1366
LGA 1155

Core name(s) Covington

Mendocino
Coppermine-128
Tualatin-256
Willamette-128
Northwood-128
Prescott-256
Two stars performance
Pentium

Pentium is a brand used for a series of x86-compatible microprocessors produced by Intel. In its most
current form, a Pentium processor is a consumer-level product with a two-star rating, above the low-
end Atom and Celeron products but below the faster Core i3, i5 and i7 lines as well as the high-end
Xeon processors.
The name Pentium is originally derived from the Greek word pente (πέντε), meaning 'five' (as the
series was Intel's 5th generation microarchitecture, the P5), and the Latin ending -ium. The current
Pentium processors only share the name but are in fact based on the same processor chips that are
used in the Intel Core but are typically used with a lower clock frequency, a partially disabled L3
cache and some of the advanced features such as Hyper-threading and Virtualization disabled.
Pentium

Produced From 1993 to

current
Common Intel
manufacturer(s)
Max. CPU clock 60 MHz to 3.8 GHz
rate
FSB speeds 60 MHz to
1333 MT/s
Min. feature size 0.8 µm to 32 nm
Instruction set x86, x86-64
Microarchitecture P5
P6
NetBurst
Core
Nehalem
Sandy Bridge
Cores 1-2
Predecessor Intel 80486
Socket(s) Various

Core name(s) Various

Pentium M

The Pentium M brand refers to a family of mobile single-core x86 microprocessors (with the
modified Intel P6 microarchitecture) introduced in March 2003 (during the heyday of the Pentium 4
desktop CPUs), and forming a part of the Intel Carmel notebook platform under the then new
Centrino brand.
The Pentium M processors had a maximum thermal design power (TDP) of 5–27 W depending on
the model, and were intended for use in laptops (thus the "M" suffix standing for mobile). They
evolved from the core of the last Pentium III–branded CPU by adding the front-side bus (FSB)
interface of Pentium 4, an improved instruction decoding and issuing front end, improved branch
prediction, SSE2 support, and a much larger cache.
The first Pentium M–branded CPU, code-named Banias, was followed by Dothan. The Pentium
M-branded processors were succeeded by the Core-branded dual-core mobile Yonah CPU with a
modified microarchitecture
Pentium M

Produced From 2003 to 2008

Common Intel
manufacturer(s)
Max. CPU clock 900 MHz to
rate 2.26 GHz
FSB speeds 400 MT/s to
533 MT/s
Min. feature size 0.13µm to 90nm
Instruction set MMX, SSE, SSE2
Microarchitecture P6 variant
Cores 1
Successor Intel Core
Socket(s) Socket 479

Core name(s) Banias

Dothan
Pentium D

The Pentium D brand refers to two series of desktop dual-core 64-bit x86-64 microprocessors
with the NetBurst microarchitecture manufactured by Intel.
Each CPU comprised two dies, each containing a single core, residing next to each other on a
multi-chip module package.
The brand's first processor, codenamed Smithfield, was released by Intel on May 25, 2005. Nine
months later, Intel introduced its successor, codenamed Presler,but without offering significant
upgrades in design, still resulting in relatively high power consumption.
By 2004, the NetBurst processors reached a clock speed barrier at 3.8 GHz due to a thermal
(and power) limit exemplified by the Presler's 130 watt thermal design power (a higher TDP
requires additional cooling that can be prohibitively noisy or expensive).
The future belonged to more energy efficient and slower clocked dual-core CPUs on a single die
instead of two.
The final shipment date of the dual die Presler chips was August 8, 2008,which marked the end
of the Pentium D brand and also the NetBurst microarchitecture.
Pentium D

Produced From 2005 to 2008

Common Intel
manufacturer(s)
Max. CPU clock 2.66 GHz to
rate 3.73 GHz
FSB speeds 533 MT/s to
1,066 MT/s
Min. feature size 90 nm to 65 nm
Instruction set MMX, SSE, SSE2,
SSE3, and x86-64
Microarchitecture NetBurst
Cores 2 (2×1)
Predecessor Pentium 4
Socket(s) LGA 775

Core name(s) Smithfield, Pr

 Intel Core, Core2, i3, i5, i7

Intel Core is a brand name used for various mid-range to high-end consumer and business
microprocessors made by Intel.
In general, processors sold as Core are more powerful variants of the same processors marketed
as entry-level Celeron and Pentium. Similarly, identically or more capable versions of Core
processors are also sold as Xeon processors for the server and workstation market.
The current lineup of Core processors includes the latest Intel Core i7, Intel Core i5 and Intel Core
i3, and the older Intel Core 2 Solo, Intel Core 2 Duo, Intel Core 2 Quad, and Intel Core 2.
 Desktop Laptop
Brand
Code-named Cores Fab Date released Code-named Cores Fab Date released
Core Solo Desktop version not available Yonah 1 65 nm January 2006
Core Duo Desktop version not available Yonah 2 65 nm January 2006
Merom-L 1 65 nm September 2007
Core 2 Solo Desktop version not available
Penryn-L 1 45 nm May 2008
Conroe 2 65 nm August 2006
Merom 2 65 nm July 2006
Core 2 Duo Allendale 2 65 nm January 2007
Penryn 2 45 nm January 2008
Wolfdale 2 45 nm January 2008
Kentsfield 4 65 nm January 2007
Core 2 Quad Penryn 4 45 nm August 2008
Yorkfield 4 45 nm March 2008
Conroe XE 2 65 nm July 2006 Merom XE 2 65 nm July 2007
Core 2 Extreme Kentsfield XE 4 65 nm November 2006 Penryn XE 2 45 nm January 2008
Yorkfield XE 4 45 nm November 2007 Penryn XE 4 45 nm August 2008
Clarkdale 2 32 nm January 2010 Arrandale 2 32 nm January 2010
Core i3
Sandy Bridge 2 32 nm February 2011 Sandy Bridge 2 32 nm February 2011
Lynnfield 4 45 nm September 2009
Clarkdale 2 32 nm January 2010 Arrandale 2 32 nm January 2010
Core i5
Sandy Bridge 4 32 nm January 2011 Sandy Bridge 2 32 nm February 2011
Sandy Bridge 2 32 nm February 2011
Bloomfield 4 45 nm November 2008 Clarksfield 4 45 nm September 2009
Lynnfield 4 45 nm September 2009 Arrandale 2 32 nm January 2010
Core i7
Gulftown 6 32 nm July 2010 Sandy Bridge 4 32 nm January 2011
Sandy Bridge 4 32 nm January 2011 Sandy Bridge 2 32 nm February 2011
Bloomfield 4 45 nm November 2008
Core i7 Clarksfield 4 45 nm September 2009
Gulftown 6 32 nm March 2010
Extreme Edition Sandy Bridge 4 32 nm January 2011
Sandy Bridge-E 6 32 nm November 2011
Intel Core Duo / Solo
Enhanced Pentium M based (Yonah)

The original Core brand refers to Intel's 32-bit mobile dual-core x86 CPUs that derived from the
Pentium M branded processors. The processor family used a more enhanced version of the Intel P6
microarchitecture. It emerged in parallel with the NetBurst microarchitecture (Intel P68) of the Pentium
4 brand, and was a precursor of the 64-bit Core microarchitecture of Core 2 branded CPUs. The
Core brand comprised two branches: the Duo (dual-core) and Solo (Duo with one disabled core,
which replaced the Pentium M brand of single-core mobile processor).
The Core brand was launched on January 6, 2006 by the release of the 32-bit Yonah CPU – Intel's
first dual-core mobile (low-power) processor. Its dual-core layout closely resembled two
interconnected Pentium M branded CPUs packaged as a single die (piece) silicon chip (IC). Hence,
the 32-bit microarchitecture of Core branded CPUs – contrary to its name – had more in common with
Pentium M branded CPUs than with the subsequent 64-bit Core microarchitecture of Core 2 branded
CPUs. Despite a major rebranding effort by Intel starting January 2006, some computers with the
Yonah core continued to be marked as Pentium M.
The Core series is also known for being the first Intel processor to be used as the main CPU for an
Apple Macintosh computer. The Core Duo was the CPU for the first generation MacBook Pro while
the Core Solo appeared in Apple's Mac mini line. Core Duo signified the beginning of Apple's shift to
Intel processors across their entire line.
In 2007, Intel began branding the Yonah core CPUs intended for mainstream mobile computers as
Pentium Dual-Core, not to be confused with the desktop 64-bit Core microarchitecture CPUs also
branded as Pentium Dual-Core.
September 2007 and January 4, 2008 mark the discontinuation of many Core branded CPUs.
Intel Core Duo (product code 80539) consists of two cores on one die, a 2 MB L2 cache shared by both
cores, and an arbiter bus that controls both L2 cache and FSB (front-side bus) access.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Core Duo T2xxx 31 W
Yonah Core Duo L2xxx 2 MB Socket M 15 W
Core Duo U2xxx 9W

Intel Core Solo (product code 80538) uses the same two-core die as the Core Duo, but features only one
active core.[citation needed] Depending on demand, Intel may also simply disable one of the cores to sell
the chip at the Core Solo price—this requires less effort than launching and maintaining a separate line of
CPUs that physically only have one core. Intel used the same strategy previously with the 486 CPU in
which early 486SX CPUs were in fact manufactured as 486DX CPUs but with the FPU disabled.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Core Solo T1xxx 27–31 W
Yonah 2 MB Socket M
Core Solo U1xxx 5.5–6 W
64-bit Core microarchitecture based

The successor to Core is the mobile version of the Intel Core 2 line of processors using cores
based upon the Intel Core microarchitecture, released on July 27, 2006. The release of the mobile
version of Intel Core 2 marks the reunification of Intel's desktop and mobile product lines as
Core 2 processors were released for desktops and notebooks, unlike the first Intel Core CPUs
that were targeted only for notebooks (although some small form factor and all-in-one desktops,
like the iMac and the Mac Mini, also used Core processors).
Unlike the Intel Core, Intel Core 2 is a 64-bit processor, supporting Intel 64. Another difference
between the original Core Duo and the new Core 2 Duo is an increase in the amount of Level 2
cache. The new Core 2 Duo has tripled the amount of on-board cache to 6 MB. Core 2 also
introduced a quad-core performance variant to the single- and dual-core chips, branded Core 2
Quad, as well as an enthusiast variant, Core 2 Extreme. All three chips are manufactured at a 65
nm lithography, and in 2008, a 45 nm lithography and support Front Side Bus speeds ranging from
533 MHz to 1600 MHz. In addition, the 45 nm die shrink of the Core microarchitecture adds
SSE4.1 support to all Core 2 microprocessors manufactured at a 45 nm lithography, therefore
increasing the calculation rate of the processors.
Intel Core 2
Core 2 Solo

The Core 2 Solo introduced in September 2007, is the successor to the Core Solo and is
available only as an ultra-low-power mobile processor with 5.5 Watt thermal design power. The
original U2xxx series "Merom-L" used a special version of the Merom chip with CPUID number
10661 (model 22, stepping A1) that only had a single core and was also used in some Celeron
processors. The later SU3xxx are part of Intel's CULV range of processors in a smaller µFC-
BGA 956 package but contain the same Penryn chip as the dual-core variants, with one of the
cores disabled during manufacturing.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Merom-L Mobile Core 2 Solo U2xxx 1 MB FCBGA 5.5 W
Penryn-L Mobile Core 2 Solo SU3xxx 3 MB BGA956 5.5 W
Core 2 Duo

The majority of the desktop and mobile Core 2 processor variants are Core 2 Duo[8][9] with two processor
cores on a single Merom, Conroe, Allendale, Penryn, or Wolfdale chip. These come in a wide range of
performance and power consumption, starting with the relatively slow ultra-low-power Uxxxx (10 W) and
low-power Lxxxx (17 W) versions, to the more performance oriented Pxxxx (25 W) and Txxxx (35 W)
mobile versions and the Exxxx (65 W) desktop models. The mobile Core 2 Duo processors with an 'S'
prefix in the name are produced in a smaller µFC-BGA 956 package, which allows building more compact
laptops.
Within each line, a higher number usually refers to a better performance, which depends largely on core
and front-side bus clock frequency and amount of second level cache, which are model-specific. Core 2
Duo processors typically use the full L2 cache of 2, 3, 4, or 6 MB available in the specific stepping of the
chip, while versions with the amount of cache reduced during manufacturing are sold for the low-end
consumer market as Celeron or Pentium Dual-Core processors. Like those processors, some low-end
Core 2 Duo models disable features such as Intel Virtualization Technology. Details can be found at the
list of Intel Core 2 microprocessors.
 Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Mobile Core 2 Duo U7xxx 2 MB 10 W
BGA479
Mobile Core 2 Duo L7xxx 4 MB 17 W
Merom
Mobile Core 2 Duo T5xxx 2 MB Socket M
Socket P 35 W
Mobile Core 2 Duo T7xxx 2–4 MB BGA479

Conroe and Core 2 Duo E4xxx 2 MB

LGA 775 65 W
Allendale Core 2 Duo E6xxx 2–4 MB
Mobile Core 2 Duo SU7xxx
3 MB 10W
Mobile Core 2 Duo SU9xxx
Mobile Core 2 Duo SL9xxx 25 W 17 W
6 MB
Mobile Core 2 Duo SP9xxx

Mobile Core 2 Duo P7xxx

Penryn 3 MB
Mobile Core 2 Duo P8xxx 25 W
Mobile Core 2 Duo P9xxx 6 MB Socket P
Mobile Core 2 Duo T6xxx 2 MB FCBGA6

Mobile Core 2 Duo T8xxx 3 MB 35 W

Mobile Core 2 Duo T9xxx 6 MB
Mobile Core 2 Duo E8xxx 6 MB Socket P 35-55 W
Core 2 Duo E7xxx 3 MB
Wolfdale LGA 775 65 W
Core 2 Duo E8xxx 6 MB
Core 2 Quad

Core 2 Quad processors are multi-chip modules consisting of two dies similar to those used in Core 2
Duo, forming a quad-core processor. This allows twice the performance of a dual-core processors at
the same clock frequency in ideal conditions.
Initially, all Core 2 Quad models were versions of Core 2 Duo desktop processors, Kentsfield derived
from Conroe and Yorkfield from Wolfdale, but later Penryn-QC was added as a high-end version of
the mobile dual-core Penryn.
The Xeon 32xx and 33xx processors are mostly identical versions of the desktop Core 2 Quad
processors and can be used interchangeably.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Kentsfield Core 2 Quad Q6xxx 2×4 MB 95–105 W
Core 2 Quad Q7xxx 2×1 MB 95 W
LGA 775
Yorkfield Core 2 Quad Q8xxx 2×2 MB
65–95 W
Core 2 Quad Q9xxx 2×3–2×6 MB
Penryn-QC Mobile Core 2 Quad Q9xxx 2×3–2×6 MB Socket P 45 W
Core 2 Extreme

Core 2 Extreme processors are enthusiast versions of Core 2 Duo and Core 2 Quad processors,
usually with a higher clock frequency and an unlocked clock multiplier, which makes them especially
attractive for overclocking. This is similar to earlier Pentium processors labeled as Extreme Edition.
Core 2 Extreme processors were released at a much higher price than their regular version, often
$999 or more.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Merom Mobile Core 2 Extreme X7xxx 4 MB Socket P 44 W
Conroe Core 2 Extreme X6xxx 4 MB LGA 775 75 W
Kentsfield Core 2 Extreme QX6xxx 2×4 MB LGA 775 130 W
Penryn Mobile Core 2 Extreme X9xxx 6 MB Socket P 44 W
Penryn-QC Mobile Core 2 Extreme QX9xxx 2×6 MB Socket P 45 W
Yorkfield Core 2 Extreme QX9xxx 2×6 MB LGA 775 / LGA 771 130–150 W
Nehalem microarchitecture based

With the release of the Nehalem microarchitecture in November 2008, Intel introduced a new
naming scheme for its Core processors. There are three variants, Core i3, Core i5, and Core i7, but
the names no longer correspond to specific technical features like the number of cores. Instead, the
brand is now divided from low-level (i3), through mid-range (i5) to high-end performance (i7), which
correspond to three to five stars in Intel's Intel Processor Rating as opposed to the entry-level
Celeron (one star) and Pentium (two stars) processors. Common features of all Nehalem based
processors include an integrated DDR3 memory controller as well as QuickPath Interconnect or PCI
Express and Direct Media Interface on the processor replacing the aging quad-pumped Front Side
Bus used in all earlier Core processors. Also, all these processors have 256 KB L2 cache per core,
plus up to 12 MB shared level 3 cache. Because of the new I/O interconnect, chipsets and
mainboards from previous generations can no longer be used with Nehalem based processors.
Three stars performance
Core i3

The Core i3 was intended to be the new low end of the performance processor line from Intel, following
the retirement of the Core 2 brand.
The first Core i3 processors were launched on January 7, 2010.
The first Nehalem based Core i3 was Clarkdale-based, with an integrated GPU and two cores. The same
processor is also available as Core i5 and Pentium, with slightly different configurations.
The Core i3-3xxM processors are based on Arrandale, the mobile version of the Clarkdale desktop
processor. They are similar to the Core i5-4xx series but running at lower clock speeds and without Turbo
Boost. According to an Intel FAQ they do not support Error Correction Code (ECC)

Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)
Clarkdale Core i3-5xx 4 MB LGA 1156 73 W Direct Media Interface,
Core i3-3xxM 3 MB rPGA-988A 35 W Integrated GPU
2
Arrandale
Core i3-3xxUM 3 MB BGA-1288 18 W
Four stars performance
Core i5

The first Core i5 using the Nehalem microarchitecture was introduced on September 8, 2009, as a
mainstream variant of the earlier Core i7, the Lynnfield core. Lynnfield Core i5 processors have an 8 MB
L3 cache, a DMI bus running at 2.5 GT/s and support for dual-channel DDR3-800/1066/1333 memory
and have Hyper-threading disabled. The same processors with different sets of features (Hyper-
Threading and other clock frequencies) enabled are sold as Core i7-8xx and Xeon 3400-series
processors, which should not be confused with high-end Core i7-9xx and Xeon 3500-series processors
based on Bloomfield.

The Core i5-5xx mobile processors are named Arrandale and based on the 32 nm Westmere shrink of
the Nehalem microarchitecture. Clarkdale, the desktop version of Arrandale, is sold as Core i5-6xx,
along with related Core i3 and Pentium brands. It has Hyper-Threading enabled and the full 4 MB L3
cache.

According to Intel "Core i5 desktop processors and desktop boards typically do not support ECC
memory“.

Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)
Core i5-7xx 95 W
Lynnfield 4 8 MB Direct Media Interface
Core i5-7xxS LGA 1156 82 W
Clarkdale Core i5-6xx 4 MB 73–87 W
Core i5-5xxM
rPGA-988A 35 W Direct Media Interface,
Core i5-4xxM 2
Arrandale 3 MB Integrated GPU
Core i5-5xxUM
BGA-1288 18 W
Core i5-4xxUM[32]
Five stars performance
Core i7

Intel Core i7 is an Intel brand name for several families of desktop and laptop 64-bit x86-64 processors
using the Nehalem, Westmere, and Sandy Bridge microarchitectures. The Core i7 brand is targeted at the
business and high-end consumer markets for both desktop and laptop computers, and is distinguished
from the Core i3 (entry-level consumer), Core i5 (mainstream consumer), and Xeon (server and
workstation) brands.

The Core i7 name was introduced with the Bloomfield Quad-core processor in late 2008. In 2009 new
Core i7 models based on the Lynnfield desktop quad-core processor and the Clarksfield quad-core
mobile were added, and models based on the Arrandale dual-core mobile processor were added in
January 2010. The first six-core processor in the Core lineup is the Gulftown, which was launched on
March 16, 2010. Both the regular Core i7 and the Extreme Edition are advertised as five stars in the Intel
Processor Rating.

In January 2011, Intel released the second generation of Core i7 processors. Both the first and second
generation of Intel Core i7 processors are rated as 5 stars in the Intel processor rating. The second
generation of Intel core processors are based on the "Sandy Bridge" core and are set to be updated in
January1 2012 with "Ivy Bridge".

In each of the first three microarchitecture generations of the brand, Core i7 has family members using
two distinct system-level architectures, and therefore two distinct sockets (for example, LGA 1156 and
LGA 1366 with Nehalem). In each generation, the highest-performing Core i7 processors use the same
socket and QPI-based architecture as the low-end Xeon processors of that generation, while lower-
performing Core i7 processors use the same socket and PCIe/DMI/FDI architecture as the Core i5.
"Core i7" is a successor to the Intel Core 2 brand
 Release
Code name Brand name Cores L3 Cache Socket TDP Process Busses
Date
Core i7-9xxX Extreme Edition Mar 2010
Gulftown 6 12 MB 32 nm
Core i7-9xx QPI, Jul 2010
LGA 1366 130 W
Core i7-9xx Extreme Edition 3 × DDR3
Bloomfield Nov 2008
Core i7-9xx
Core i7-8xx 95 W Sep 2009
Lynnfield 8 MB LGA 1156
Core i7-8xxS 4 82 W 45 nm Jan 2010
DMI,
Core i7-9xxXM Extreme Edition 55 W PCI-e,
2 × DDR3
Clarksfield Core i7-8xxQM Sep 2009
rPGA-988A 45 W
Core i7-7xxQM 6 MB
Core i7-6xxM 35 W DMI,
PCI-e,
Arrandale Core i7-6xxLM 2 4 MB 25 W 32 nm Jan 2010
BGA-1288 FDI,
Core i7-6xxUM 18 W 2 × DDR3
Sandy Bridge microarchitecture based
In early 2011, a new microarchitecture named Sandy Bridge microarchitecture was introduced by
Intel, which keeps all the existing brands from Nehalem including Core i3/i5/i7, but introduces new
model numbers. The initial set of Sandy Bridge processors includes dual- and quad-core variants, all
of which use a single 32 nm die for both the CPU and integrated GPU cores, unlike the earlier
microarchitectures. All Core i3/i5/i7 processors with the Sandy Bridge microarchitecture have a four-
digit model number. With the mobile version, the thermal design power can no longer be determined
from a one- or two-letter suffix but is encoded into the CPU number. Starting with Sandy Bridge, Intel
no longer distinguishes the code names of the processor based on number of cores, socket or
intended usage; they all use the same code name as the microarchitecture itself.
Core I3

Released on January 20, 2011, the Core i3-2xxx line of desktop and mobile processors is a direct
replacement of the 2010 "Clarkdale" Core i3-5xx and "Arrandale" Core i3-3xxM models, based on
the new microarchitecture. While they require new sockets and chipsets, the user-visible features of
the Core i3 are largely unchanged, including the lack of support for Turbo Boost and AES-NI. Unlike
the Sandy Bridge based Celeron and Pentium processors, the Core i3 line does support the new
Advanced Vector Extensions.

Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)
Direct Media Interface,
Core i3-21xx 2 3 MB LGA 1155 65 W
Integrated GPU
Sandy Bridge (Desktop)
Direct Media Interface,
Core i3-21xxT 2 3 MB LGA 1155 35 W
Integrated GPU
rPGA-988B Direct Media Interface,
Core i3-2xx0M 2 3 MB 35 W
BGA-1023 Integrated GPU
Sandy Bridge (Mobile)
Direct Media Interface,
Core i3-2xx7M 2 3 MB BGA-1023 17 W
Integrated GPU
Core i5
In January 2011, Intel released new quad-core Core i5 processors based on the "Sandy Bridge"
microarchitecture at CES 2011. New dual-core mobile processors and desktop processors arrived in
February 2011.
The Core i5-2xxx line of desktop processors are mostly quad-core chips, with the exception of the dual-
core Core i5-2390T, and include integrated graphics, combining the key features of the earlier Core i5-
6xx and Core i5-7xx lines. The suffix after the four-digit model number designates unlocked multiplier (K),
low-power (S) and ultra-low-power (T). The desktop CPUs now all have four non-SMT cores (like the i5-
750), with the exception of the i5-2390T. The DMI bus is running at 5 GT/s.
The mobile Core i5-2xxxM processors are all dual-core chips like the previous Core i5-5xxM series and
share most the features with that product line.

Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)
Core i5-2xxx Direct Media Interface,
LGA 1155 95 W
Core i5-2xxxK Integrated GPU
4
Direct Media Interface,
Sandy Bridge (Desktop) Core i5-2xxxS 6 MB 65 W
Integrated GPU
LGA 1155
Direct Media Interface,
Core i5-2xxxT 2-4 35-45 W
Integrated GPU
rPGA-988B Direct Media Interface,
Core i5-2xxxM 35 W
BGA-1023 Integrated GPU
Sandy Bridge (Mobile) 2 3 MB
Direct Media Interface,
Core i5-2xx7M BGA-1023 17 W
Integrated GPU
Core i7

The Core i7 brand remains the high-end for Intel's desktop and mobile processors, featuring the Sandy
Bridge models with the largest amount of L3 cache and the highest clock frequency. Most of these models
are very similar to their smaller Core i5 siblings. The quad-core mobile Core i7-2xxxQM/XM processors
follow the previous "Clarksfield" Core i7-xxxQM/XM processors, but now also include integrated graphics.

Codename Release
Brand name (list) Cores L3 Cache Socket TDP Process
(main article) Date
Core i7-3960X 15 MB
6 November 2011
Sandy Bridge-E (Desktop) Core i7-3930K 12 MB LGA 2011 130 W
Core i7-3820 4 10 MB November 2011
Core i7-2600, 2600K, 2700K 95 W
Sandy Bridge (Desktop) 4 8 MB LGA 1155 January 2011
Core i7-2xxxS 65 W
Core i7-2xxxXM 8 MB 55 W
32 nm
rPGA-988B
Core i7-2xxxQM 4 6 or 8 MB 45 W January 2011
BGA-1023
Core i7-2xxxQE 6 MB 45 W
Sandy Bridge (Mobile) rPGA-988B
Core i7-2xx0M 35 W
BGA-1023
2 4 MB February 2011
Core i7-2xx9M 25 W
BGA-1023
Core i7-2xx7M 17 W
AMD
Sockets
 AMD AM2 Socket

The Socket AM2, renamed from Socket M2 (to prevent using the same name as Cyrix MII
processors), is a CPU socket designed by AMD for desktop processors, including the
performance, mainstream and value segments. It was released on May 23, 2006, as a
replacement for Socket 939 & Socket 754.

AM2 processors are incompatible with 939 motherboards and vice versa, and although it
has 940 pins, it is incompatible with Socket 940. Socket AM2 supports DDR2 SDRAM
memory but not DDR memory, which the previous Socket 939 supported. AnandTech
reported that Socket AM2 system performance was up to 7% faster than Socket 939
equivalents, with most applications about 2% faster, despite having over 30% greater
memory bandwidth due to DDR2 support.

Contacts: 940
The first processor cores to support socket AM2 are the single-core Orleans (Athlon 64)
and Manila (Sempron), and the dual-core Windsor (Athlon 64 X2 and Athlon 64 FX). FSB frequency : 200 MHz
Most processors on Socket AM2 include SSE3 instructions and were developed with 90 System clock: 1 GHz HyperTransport 2.0
nanometer technology. Recent models feature 65 nanometer technology (to compete with Processors: Athlon 64
Intel and their 65 nm CPUs).
Athlon 64 X2
Socket AM2 supports AMD Phenom processors but some motherboard manufacturers did Athlon 64 FX
not supply newer BIOS files required to operate a Phenom processor.
Sempron (2800 – 3800+)
Socket AM2 was a part of AMD's generation of CPU sockets that included Socket F for (LE1100-1300)
servers and Socket S1 for mobile computing.
There are also single-socket Opteron processors available for AM2.[4]
 AMD AM2+ Socket

Socket AM2+ is a CPU socket, which is the immediate successor to Socket AM2 that is
used by several AMD processors such as Athlon 64 X2. Socket AM2+ is a mid-migration
from Socket AM2 to Socket AM3 and both AM2+ and AM2 socket CPUs and
motherboards have the potential to operate together. Actual interoperability depends upon
other factors, especially the availability of compatible BIOS software.

The main differences between Socket AM2 and AM2+ socket processors are as
follows:

While technical documentation was readily available for earlier generations of AMD
processor sockets, the "AM2r2 Processor Functional Data Sheet" (AMD document
number 41607) has not been made publicly available.
AMD confirmed that AM2 processors will work on AM2+ motherboards and AM2+
processors will work on AM2 motherboards. However, the operation of AM2+ processors Contacts: 940
on AM2 motherboards will be limited to the specifications of Socket AM2 (1 GHz FSB frequency: 200 MHz
HyperTransport 2.0, and one power plane for both cores and the IMC). AM2 processors
System clock: up to 2.6 GHz HyperTransprt 3.0
do not benefit from the faster HyperTransport 3.0 and separate power planes on AM2+
motherboards. As with AM2 components, AM2+ CPUs and motherboards are designed to Processors: Athlon 64 X2
use DDR2 RAM exclusively. Phenom X3 series
Many manufacturers, such as Dell in the case of their Inspiron 531, have yet to (and may Phenom II X3, X4 series
choose not to) release BIOS updates that would enable this compatibility. As a result,
some consumers are unable to upgrade their PCs with AM2+ CPUs despite this being
technically possible, and are instead forced to buy a new motherboard to upgrade the
processor. MSI has simply stated that their AM2 motherboards are not compatible with
AM2+ processors.

The pin configuration of the AM2+ socket (940 pins) is mechanically different from the
AM3 socket (941 pins).
 AMD AM3 Socket

Socket AM3 is a CPU socket for AMD processors. AM3 was launched on February 9,
2009 as the successor to Socket AM2+, alongside the initial grouping of Phenom II
processors designed for it.[2] The sole principal change from AM2+ to AM3 is support for
DDR3 SDRAM.

Like the previous AMD socket, the "AM3 Processor Functional Data Sheet" (AMD
document number 40778) has not been made publicly available. The "Family 10h AMD
Phenom™ Processor Product Data Sheet" (document 446878) has,[3] but contains only a
brief list of features of the Phenom, and does not contain any substantive technical data
regarding socket AM3.
Socket AM3 breaks compatibility with AM2/AM2+ processors due to a subtle change in
key placement. The AM3 socket has 941 pin contacts in a different layout[1] while AM2+
processors have 940 pins. Tom's Hardware removed the two obstructing key pins from an Contacts: 941 (Socket)[1]
AM2+ Phenom processor in order to fit it into an AM3 socket. The processor did not work 938 (CPU)
in the AM3 socket, but still worked in an AM2+ socket, suggesting that compatibility
FSB protocol: HyperTransport 3.x
issues run deeper than merely the key pins.[4] It is likely due to the fact that the built-in
memory controller in AM2/AM2+ processors only supports DDR2 (unlike AM3 FSB frequency: 200 MHz System clock
processors, which support both DDR2 & DDR3 memory).[5] HyperTransport : up to 3.2 GHz
Processors: Phenom II (X2,X4,X6)
Athlon II (X2,X3,X4)
As AM3 processors also support DDR2, they are backwards-compatible with Socket
AM2/AM2+, contingent upon a BIOS update for the motherboard. Manufacturers Sempron (140, 145, 150)
including Asus,[6] Gigabyte,[7] and others have labeled existing AM2/AM2+ boards as
being "AM3 Ready" or similar, indicating that BIOS support is provided for the specified
boards. This allows existing AM2/AM2+ systems to upgrade the CPU without having to
upgrade any other components.
 AMD AM3+ Socket

AMD has already (2011) a new socket type, the socket AM3+ or AM3b
MB, for their upcoming AMD FX Zambezi processors based on AMD’s
new microarchitecture, Bulldozer. The socket AM3+ is also known as the
black AM3b socket.
1. Noticeably, the new socket AM3+ is indicated by an “AM3b” written
on the socket and the socket is color black. AM3+ has bigger pin holes
from .45mm of AM3 to 0.51mm of AM3+. The problem is if CPU makers
decided to make the pins in the Zambezi processor bigger in order to
handle higher power current, it would not be able to fit in an AM3 socket.
2. AM3+ has faster link between CPU and Power Controller from
400KHz of the AM3 to 3.4MHz of AM3+.
3. AM3+ will have a more efficient power loadline as compared to AM3.
AM3+ has an up to 11.8% increase in the power supply efficiency
offering a better CPU power saving. Not only that AM3+ is pack with
VDD Tolerance Load Lines providing a stable power output and better Contacts: 942
OC capability. FSB protocol: HyperTransport 3.x

4. A reduction of up to 22% of electrical noise resulting in better system FSB frequency: 200 MHz System clock
stability HyperTransport : up to 3.2 GHz

5. Since the new socket AM3b can support thicker pins, socket AM3+ can Processors: AMD FX-4 Core Black Edition
handle higher current from 110A of AM3 MB to 145A of AM3+ MB. AMD FX-6 Core Black Edition
That’s a 32% increase. AMD FX-8 Core Black Edition
6. AM3+ now supports the Combo Cooler Retention Module or CCR
making the frame to hold the cooler into a two part kit. The CCR make
sure that the air suck into the cooler is blown downwards cooling the
VRMs/ CPU power choke around it.
Processors
The AMD64 core provides leading-edge performance for both 32-bit and 64-bit applications

•AMD64 technology provides full-speed support for x86 code base without compromising performance
•40-bit physical addresses, 48-bit virtual addresses
•Sixteen 64-bit integer registers
•Sixteen 128-bit SSE/SSE2/SSE3 registers
•AMD Digital Media XPress™ provides support for SSE, SSE2, SSE3 and MMX instructions

A high-bandwidth, low-latency integrated DDR memory controller

•Supports PC2-5300 (DDR2-667), PC2-4200 (DDR2-533) or PC2-3200 (DDR2-400) SDRAM unbuffered DIMMs
•Support for 64-bit DDR2 SDRAM memory
•Up to 10.6GB/s memory bandwidth

HyperTransport™ Technology for high speed I/O communication

•One 16-bit link up to 2000MHz bidirectional
•Up to 6.4GB/s HyperTransport™ I/O bandwidth
•Up to 17.0GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)

Large high performance on-chip cache

•64KB Level 1 instruction cache
•64KB Level 1 data cache
•Up to 256KB Level 2 cache
Performance Enhancements

AMD Direct Connect Architecture

An award-winning technology designed to reduce bottlenecks that can exist when multiple components
compete for access to the processor bus. Competing x86 systems use a single front-side bus (FSB) which
must carry memory access, graphics, and I/O traffic. Eliminate the FSB, and you can reduce delays that
competing access requests can cause.

AMD Wide Floating Point Accelerator

Doubles processor bandwidth from 64- to a full 128-Bit Floating-Point math processing pipeline that can
double many of the bandwidth paths that help keep it full.

AMD Digital Media XPress™ 2.0 Technology

Provides support for SSE, SSE2, SSE3, SSE4a, and MMX instructions for digital media applications and
security.

CPU Architectural Features

True Multi-Core Processing

The extensive AMD64 architectural optimizations and features enable thorough integration of multiple cores
within the same processor, with each core having its own L1 and L2 caches.
AMD Dedicated Multi-Cache
Each core has its own dedicated L2 cache, which enables simultaneous independent core access to L2
cache, eliminating the need for cores to arbitrate for cache access. This helps reduce latency on L2 cache
accesses.

AMD Virtualization™ (AMD-V™) Technology

Silicon feature-set enhancements designed to improve the performance, reliability, and security of both
existing and future virtualization environments.

AMD PowerNow! 3.0 Technology

The latest power management technologies that deliver performance on demand when you need it, and power
savings when you don't.

Simultaneous 32-bit and 64-bit Computing

AMD64 technology enables a breakthrough approach to 64-bit computing that doubles the number of registers
in the processor and allows PC users to use today’s 32-bit software applications while enabling them to also
use the next generation of 64-bit applications.
CPU Power Management Technologies Featured In AMD PowerNow!™ 3.0 Technology

Cool’n’Quiet™ 3.0 Technology

Up to eight different performance states help enhance power efficiency. Simplified performance state
transitions can reduce latency and the software overhead of performance state changes.

AMD Dynamic Power Management

Each processor core, and the integrated memory controller and HyperTransport™ controller, is powered by
dedicated voltage planes.

Integrated Dual-Channel Memory Controller

Directly connects the processor to memory for optimum performance, low latency, and high throughput.

Multi-Point Thermal Control

The next-generation design features multiple on-die thermal sensors with digital interface. Automatic reduction
of p-state when temperature exceeds pre-defined limit. Additional memory thermal management interface.

AMD CoolCore™ Technology

Coarse and fine transistor control that can automatically reduce processor energy consumption by turning off
unused parts of the processor.
AMD Sempron™ Key Architectural Features
AMD Athlon™ II Key Architectural Features
AMD Phenom™ II Key Architectural Features
AMD Phenom™ II X6 Six-Core Processors

The backbone of the VISION Black technology platform, the new AMD Phenom™ II X6 six-core
processors are the fastest CPUs AMD has ever created. The AMD Phenom™ II X6 six-core
processors are also the world's only six-core processors for under $200*. At the heart of a VISION
Black Technology platform, the AMD Phenom II X6 processor is the most advanced AMD desktop
processor and features innovative AMD Turbo CORE technology to adjust to the dynamic needs of
performance users.

New AMD Turbo CORE Technology

Both the AMD Phenom™ II X6 1055T and 1090T come equipped with AMD's new Turbo CORE
technology. AMD Turbo CORE technology is a performance boosting technology that automatically
switches from six cores to three turbocharged core for applications that just need raw speed over
multiple cores. While in Turbo CORE mode, the AMD Phenom™ II X6 1090T shifts frequency speed
from 3.2GHz on six cores, to 3.6GHz on three cores, making it the fastest processor AMD has ever
created.

AMD Phenom™ II Triple and Quad-Core Processors

True quad-core and triple-core designed from the ground up for better communication between cores.
Benefit: Cores can communicate on die rather than on package for better performance
AMD64 with Direct Connect Architecture

Helps improve system performance and efficiency by directly connecting the processors, the memory
controller, and the I/O to the CPU.
Designed to enable simultaneous 32- and 64-bit computing
Integrated Memory Controller
Benefits: Increases application performance by dramatically reducing memory latency
Scales memory bandwidth and performance to match compute needs
HyperTransport™ Technology provides up to 16.0GB/s peak bandwidth per processor—reducing
I/O bottlenecks
Up to 37GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)

AMD Balanced Smart Cache

Shared L3 cache (either 6MB or 4MB)

512K L2 cache per core
Benefit: Shortened access times to the highly accessed data for better performance.

AMD Wide Floating Point Accelerator

128-bit floating point unit (FPU)

High performance (128bit internal data path) floating point unit per core.
Benefit: Larger data paths and quicker floating point calculations for better performance.
HyperTransport™ Technology

One 16-bit link at up to 4000MT/s

Up to 8.0GB/s HyperTransport™ I/O bandwidth; Up to 16GB/s in HyperTransport Generation 3.0 mode
Up to 37GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)
Benefit: Quick access times to system I/O for better performance.

Integrated DRAM Controller with AMD Memory Optimizer Technology

A high-bandwidth, low-latency integrated memory controller

Supports PC2-8500 (DDR2-1066); PC2-6400 (DDR2-800), PC2-5300 (DDR2-667), PC2-4200 (DDR2-
533) or PC2-3200 (DDR2-400) SDRAM unbuffered DIMMs – AM2+
Support for unregistered DIMMs up to PC2 8500(DDR2-1066MHz) and PC3 10600 (DDR3-1333MHz)
– AM3
Up to 17.1GB/s memory bandwidth for DDR2 and up to 21GB/s memory bandwidth for DDR3
Benefit: Quick access to system memory for better performance.

AMD Virtualization™ (AMD-V™) Technology With Rapid Virtualization Indexing

Silicon feature-set enhancements designed to improve the performance, reliability, and security of
existing and future virtualization environments by allowing virtualized applications with direct and rapid
access to their allocated memory.
Benefit: Helps virtualization software to run more securely and efficiently enabling a better
experience when dealing with virtual systems
AMD PowerNow!™ Technology (Cool’n’Quiet™ Technology)

Enhanced power management features which automatically and instantaneously adjusts performance
states and features based on processor performance requirements
For quieter operation and reduced power requirements
Benefit: Enables cooler and quieter platform designs by providing extremely efficient
performance and energy usage.

AMD CoolCore™ Technology

Reduces processor energy consumption by turning off unused parts of the processor. For example,
the memory controller can turn off the write logic when reading from memory, helping reduce system
power.
Works automatically without the need for drivers or BIOS enablement.
Power can be switched on or off within a single clock cycle, saving energy with no impact to
performance.
Benefit: Helps users get more efficient performance by dynamically activating or turning off parts
of the processor.

Dual Dynamic Power Management™

Enables more granular power management capabilities to reduce processor energy consumption.
Separate power planes for cores and memory controller, for optimum power consumption and
performance, creating more opportunities for power savings within the cores and memory controller.
Benefit: Helps improve platform efficiency by providing on demand memory performance while
still allowing for decreased system power consumption
AMD FX Key Architectural Features
AMD FX Processors

We call it the new AMD FX 8-Core Processor Black Edition and it’s unlocked for your overclocking
pleasure.1 Experience unmatched multitasking and pure core performance with the industry’s first
32nm 8-core desktop processor. Get the speed you crave with AMD Turbo CORE Technology to push
your core frequencies to the limit when you need it most. Go beyond the limits of maximum speed with
easy-to-use AMD OverDrive™ and AMD Catalyst Control Center™ software suites. But the best part
of all? You’ll get all this impressive performance at an unbelievable price. You’ll be asking yourself
“what competition?” in no time.

AMD FX 8-Core Processors

The industry’s first and only native 8-core desktop processor for unmatched multitasking and pure
core performance with all-new CPU architecture.
New 32 nanometer die shrink designed to reduce leakage for improved efficiency, increased clock rate
headroom and better thermals.

AMD Turbo CORE Technology

The AMD FX Processors come equipped with AMD Turbo CORE Technology. AMD Turbo CORE
Technology is a performance boosting technology that helps increase performance on the applications
that need it the most.
New Instruction Capabilities
New Instruction Capabilities

AVX
Advanced Vector Extensions increase parallelism tailored for scientific and 3D applications that
use heavy floating point calculations
FMA4 and XOP
Floating Point Vector Multiply -Accumulate improves throughput and performance on many
vector functions (integer and floating point)
AES
Advanced Encryption Standard noticeably increase performance on the latest encryption
applications like TrueCrypt and benchmarks like PCMark

AMD Balanced Smart Cache

Shared L3 cache ( up to 8MB)

Improved scheduling and pre-fetch capabilities
64-ways (16-ways/sub-cache)
Increased data queue sizes
Coherency for 8-cores

AMD Wide Floating Point Accelerator

Shared FP Scheduler
Dual 128-bit Floating point engines – capable of teaming together for 256-bit AVX instructions or
operating separately with each core.
HyperTransport™ Technology

One 16-bit link at up to 5600MT/s

Up to 8.0GB/s HyperTransport™ I/O bandwidth; Up to 16GB/s in HyperTransport Generation 3.0
mode
Up to 37GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)
Benefit: Quick access times to system I/O for better performance.

Integrated DRAM Controller with AMD Memory Optimizer Technology

A high-bandwidth, low-latency integrated memory controller

Supports up to DDR3-18662
Supports new low voltage memories of 1.35V and 1.2V
Up to 29.9GB/s memory bandwidth for DDR3
New Pre-Fetcher improvements
Direct communications to each core in Dual-Core module (APIC registers in each core)
Benefit: Optimized memory controller to feed more cores

AMD Virtualization™ (AMD-V™) Technology with IOMMU

Silicon feature-set enhancements designed to improve the performance, reliability, and security of
existing and future virtualization environments by allowing virtualized applications with direct and
rapid access to their allocated memory.
IOMMU is an extension to AMD64 architecture to support address translation and access protection
on DMA transfers
Security for User Level application and Virtual Machine guest operating system
Address translation and access control
Device isolation
Device assignment in virtualized systems
Security & trusted boot support
AMD PowerNow!™ Technology (Cool’n’Quiet™ Technology)

Enhanced power management features which automatically and instantaneously adjusts performance
states and features based on processor performance requirements
C6 power state for cache flush, and voltage down individual core
CC6 power state allows all cores in C6 to power even lower
For quieter operation and reduced power requirements
Separate memory controller power control
IO-based c-state interface
Works automatically without the need for drivers or BIOS enablement.
Power can be switched on or off within a single clock cycle, saving energy with no impact to
performance.
Benefit: Helps users get more efficient performance by dynamically activating or turning off parts of the
processor.
AMD’s product warranty does not cover damage caused by overclocking (even when overclocking is
enabled via AMD OverDrive™ software).
1866 supported with 1 DPC (DIMM per Channel) in single memory slot motherboard designs
AMD Fusion and AMD A-series Key Architectural Features
AMD’s Accelerated Processing Units (APU) combine a multi-core CPU and discrete-level GPU on a
single power-efficient chip enabling vivid HD entertainment, blazing-fast Internet browsing and accelerated
media applications.
With desktop PCs based on VISION Technology you can enjoy rich, smooth performance in a quiet-
running, energy-efficient system. Experience smooth, skip-free HD playback and discover impressive speed
and performance in everyday applications

AMD Fusion is the marketing name for a series of APUs by AMD, aimed at providing good performance
with low power consumption, and integrating a CPU and a GPU based on a mobile stand-alone GPU.
There are two different types of the Fusion chip currently available, one with its CPU logic based on the
Bobcat core and the other its CPU logic based on the Bulldozer -the successor to the 10h (K10) core. In
both cases the GPU logic is HD6xxx, which itself is based on the mobile variant of the Radeon HD 5xxx
Series. Fusion was announced in 2006 and has been in development since then. The final design is the
product of the merger between AMD and ATI, combining general processor execution as well as 3D
geometry processing and other functions of modern GPUs (like GPGPU computation) into a single die. This
technology was shown to the general public in January 2011 at CES. Second-generation "Trinity" parts are
expected in June 2012.

The 2011 platform integrates CPU, GPU, Northbridge, PCIe, DDR3 memory controler, and UVD on the
same integrated circuit. The CPU and GPU are coupled together using a memory controller that arbitrates
between coherent and non-coherent memory request. The physical memory is partitioned: up to 512MB +
virtual for GPU, remainder + virtual for the CPU.

The 2012 platform will allow the GPU to access the CPU memory without going through a device driver.
The 2013 platform will use a unified memory controller for both CPU and GPU. The 2014 platform will add
hardware context switching for the GPU.
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