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• Theory
• Experiment
w R R cos( ) (1)
w
D
2R
D Wafer diameter
w Warp
R Radius of curvature
1000,0
1,0
10 100 1000
Warp [um]
• Thermal expansion
• Intrinsic
- growth
- misfit tot th int ext (3)
- phase transformation
• Extrinsic
- applied stress
- plastic deformation
f s
Compressive stress in layer
THIN FILM
SUBSTRATE
th 0 th ( f s )(Tdep Troom )
E
th th (4)
1
Material
[1/°C]
Silicon 2,6·10-6
Polysilicon 2,8·10-6
Thermal SiO2 0,35·10-6
PECVD SiO2 2,3·10-6
E ts2 1 1
f (5) WAFER
6(1 ) t f R R0
E Young’s modulus ; Silicon (100) – 1.3·1011 N/m2 R
Poisson’s ratio; Silicon (100) – 0.28
t s Wafer thickness
R Radius of curvature after film depo
R0 Radius of curvature before film depo
THIN LAYER
TENSILE STRESS in layer
Example of residual stress in different depo and thermal growth layers are in tables.
Values are just indicative as the intrinsic stress may vary with the process conditions.
Stress Stress
Layer Layer
[N/m2] [N/m2]
-50
[MPa]
-100
stress
Tensile Stress [MPa]
-150
Compressive
-200
-250
-300
600 700 800 900 1000 1100 1200 1300
160
140 4
120 4
3
2
100 2
Deviation (m)
1
80
1 3
60
40
20
0
-60 -40 -20 0 20 40 60
Position (mm)
180
measured data
160 spherical R=11.7m
140
deviation from sphere
1
120
Deviation (m)
Deviation (m)
100 0
80
-1
60
-60 -40 -20 0 20 40 60
Position (mm)
40
20
0
-60 -40 -20 0 20 40 60
Position (mm)
• To get low R we need to combine layers with high tensile stress on the front side and compressive
stress on the back side.
• All process steps have to keep high surface quality of the polished front side.
R < 10m
WAFER
THX ?
• For designed stack we can calculate the wafer thickness to achieve expected radius of curvature.
• As we can see in chart the wafer thickness 195 m would be needed for R ~ 2 m.
• That thin wafer is sensitive for handling and also it is affected by gravity sag.
7,0
6,0
5,0
4,0
R [m]
3,0
2,0
1,0
0,0
100 150 200 250 300 350 400
Wafer THX [um ]
• Layers with internal stress uniformly shape silicon wafer w/o deterioration of high quality of the
polished front side (surface RMS ~ 0.1 nm ).
• Stress in thin film is supposed to be constant regarding to the film thickness, which is valid for
most of dielectric thin films used in microelectronics, except of poly silicon.
• Stress in poly silicon layer is reduced with film thickness due to atoms migration into low
energy position.
• The circular wafer keeps the original axially symmetrical spherical shape after squaring. The
solid area can be build from squared segments.
• Multilayer stack has been designed to decrease the radius of wafer curvature to R ~ 2 m.
• For other than spherical shape photolithography has to be used. Suitable technology is
available in semiconductor industry.
• Research was partially supported by Projects MŠMT KONTAKT ME09028 & MŠMT ME0918.