A SEMINAR ON

OUTLINE
MEMS
Introduction, examples, fabrication


Sensors and actuators

Introduction, Historical perspective

 

fundamentals Concepts, modeling and design

Issues of automotive MEMS,comercial issues

  

Applications Future trends conclusion

MEMS Overview


Microelectromechanical Systems (MEMS) - integration of mechanical elements, sensors, actuators, and/or electronics on a common silicon substrate through microfabrication technologies
Capacitive Microphone Electroosmotic Pump

Ultrasonic Proximity Transducer/Sensor

Packaged Piezoresistive Microphone

1mm

3-Axis Capacitive Accelerometer

Thermally Actuated Micromirror

FABRICATION OF MEMS


   


The real power of this technology is that many machines can be built at the same time across the surface of the wafer, with no assembly required. Since it is a photographic-like process, it is just as easy to build a million machines on the wafer as it would be to build just one. Surface Micromachining Bulk Micromachining LIGA Deep Reactive Ion Etching
NASA's Glenn Research Center

INTRODUCTION TO SENSORS AND ACTUATORS



collect and act on information in the analog environment and link it to the world of digital electronics set of low-cost sensors and actuators to make the system application viable. Produces a class of micro machined sensors and actuator that combine signal processing and communication on a single silicon chip

Functional partitioning of automotive systems

SOFTWARE

components of automotive electronic control systems. All blocks work together to achieve desired control results

SENSORS

CONTROLLERS

ACTUATORS

HISTORY


 

1979, the microprocessor-based automotive engine control was developed MAP- developed by Delco Electronics Division of the General Motors Corporation and the Ford Motor Company A manifold absolute pressure (MAP) and a manifold air temperature (MAT) sensor were used to compute the density of air entering the engine. mid-1990, air-bag restraint systems were introduced Micro machined accelerometers are replacing most original sensing technologies in the automobile Actuators are used to fabricate intricate parts

MARKET FORCES


  

Using silicon wafer manufacturing techniques, micro machined Devices can often be produced in large batches. Low cost Reliable Small size

FUNDAMENTALS


The successful automotive device technology is one that manages the proper balance between these interacting aspects of sensor and actuator technology while simultaneously achieving high device performance at low unit cost. A particular sensor or actuator technology can be partitioned into 5 parts: An overall principle of operation Device modeling A materials technology system A packaging and interconnection system A manufacturing system for high volume production.

     

Fundamentals cont
 

High signal-to-noise ratio Analytical and computer-aided design (CAD) modeling techniques With MEMS technology, compatibility with the materials and operations in a production silicon integrated circuit (IC) foundry is the major issue. Packaging involves protecting from environment. To keep sensor cost low minimum number of wires should be connnected low-cost product can be obtained by employing productionproven techniques utilizing existing manufacturing equipment in order to minimize both development cost and time.

SENSOR CONEPTS AND MODELING

 

Piezo resistance is one of the most commonly employed micromachining transduction phenomena. Capacitance variation is another popular concept used in MEMS sensors. The programs SUPREM [21], DAVINCI, and PEPPER are used to determine the initial oxidation, diffusion, implant, and Epitomical parameters needed to form etch stops, diaphragm thickness, piezoresistors, and other semiconductor and micro machine elements.

MODELING CONT.


Mechanical modeling is utilized to determine the structural stability of device and resonant frequency in response to stress Forton-used to model nozzels,sensors valves which interact with surrounding ANSYS ,ABAQUSCS, or NASTRAN is used, as are MEMS-specific programs such as IntelliCAD, Anise, MEMCAD, and SENSIM

CONT.


A CMOS integrated, surfacemicro machined angular rate sensor.



Are used to drive the ring electrostatic ally into resonance and to monitor the vibration pattern capacitive in the ring. The sensor device measures rotation rate by monitoring the position of node lines in a vibrating ring. To sense rotation rate, the ring is electrostatic ally forced into an elliptically shaped resonant mode, and the position of the node lines is capacitive monitored.

PACKAGING OF MEMS


Wafer-to-wafer bonded micro machines.

. various sensors made using wafer bonding.

Die level-Si(NO)3 to prevent ionic contamination Parylene/pasivating gel-circuit side of micro machined device Chip level encapsulation-used by angular rate sensors to protect moving structures

CONT
     

Chip level packing wafer to wafer bonding Mechanical packaging Plastic packaging-to reduce cost Solder sealing-to produce reliable devices Vacuum packaging-to improve performance This combination of reliable, stress free packaging and system calibration often dominates cost of system

Automotive Environment
TEMPERATURE

MECHANICAL SHOCK

-40c to 85c driver interior, 125c under hood, 150c on the engine 200c-600c in the exhaust combustion areas 3000g during assembly (drop test), 50-500g on the vehicle 15g, 100Hz-20 kHz 100-200 volts/meter humidity, salt spray, in some applications Fuel, oil, break fluid, transmission fluid, Ethylene glycol, Freon, and exhaust gases

Mechanical vibration: Electromagnetic pulses: Exposure to:

FUTURE TRENDS


Additional research is needed to increase the current-carrying capability of these micro machines. There is a number of emerging MEMS technologies that will eventually find a place in the passenger compartment of the automobile. Tomorrows vehicle will be filled with various communications devices which will be linked to the outside world via satellites and microwave towers. Cellular phones, General Motors On Star program, and Internet and fax access are examples of current vehicular communications devices. Micromachined RF devices have been proposed as a way of shrinking and lowering the cost of future communications devices

CONT.


Bus communication is becoming a necessity in modern vehicles. Systems such as CLASS 2, controller area networks, and local-area networks are being employed on vehicles worldwide. By using common bus architecture, sensor and wire duplication is avoided and wiring becomes easier as the harness size goes down. Just reducing the number of cable connectors, via a bus, improves system reliability, minimizes repair problems, and makes fault detection simpler.

CONT.


.Smart sensors are currently made by using multiple chips. However, since many processes used to fabricate micro machines are taken from the integrated circuit arena, it is only natural that micro machines and circuitry should gradually merge together. Accelerometers were the first area in which this was begun in high volumes

APPLICATIONS


    

Angular rate sensor has high volume application in automotive industry Micro sensors detect different gases in vehicle Capacitive pressure sensor consumes less power used to detect fuel vapor leaks in the fuel tank Heads updisplay (HUD) technology Mix of bulk and surface etched devices used in crash detection Relays are manufactured using LIGA electro forming technology

Conclusion


Automotive sensors and actuators represent a major market for the MEMS technology. However, there are many development issues that must be brought into balance for a sensor or actuator technology to be commercially viable for automotive applications. Its a growing technology, and people like YOU can be involved in making awesome new devices and applications for them

REFERENCES
        

1. http://archives sensors.com 2. http://www maxim_ic.com 3. http://sciencedirect.com 4. http://www.mdpi.org 5. http://pdfgeni.com 6. www.wtec.org 7. www.nanogetters.com 8. www.waset.org 9. http://intellisensesoftware.com

THANK YOU