A SEMINAR ON

HEAT SINK APPLICATIONS

PRESENTED BY: Sameerakhtar A Betgeri VIII SEM USN: 2VD07EE031

Karnataka Law Societys Vishwanathrao Deshpande Rural Institute Of Technology HALIYAL (UTTAR KANNADA) 581329, KARANATAKA DEPARTMENT OF ELECTRICAL & ELECTRONICS ENGINEERING
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Contents
Introduction What is Heat Sink ? Need for the Heat Sink ? Heat transfer principle Construction and materials Applications Conclusion References

Introduction
Electronic equipment has made its way into practically every aspect of modern life. Electronic components depend on the passage of electric current to perform their duties, and they become potential sites for excessive heating. The failure rate of electronic equipment increases exponentially with temperature. Thermal control has become increasingly important in the design and operation of electronic equipment.

What is a HEAT SINK?

A heat sink is a component that is used to provide cooling to an electronic device. There are mainly two types 1.Passive Heat Sink 2.Active Heat Sink

Need For The Heat Sink

All semiconductor devices have some electrical resistance. When the component operates heat is generated. The component fails if it temperature rise above permissible value. We can increase the Power rating of a component by keeping its temperature down.
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Heat transfer principle

Practical heat sinks for electronic devices must have a temperature higher than the surroundings to transfer heat by convection, radiation, and conduction. To understand the principle of a heat sink, consider Fourier's law of heat conduction.

is the local heat flux, Wm2 is the material's conductivity, Wm1 K1 A is the cross-sectional surface area -dT/dx is the temperature gradient
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Cont
Consider a heat sink in a duct, where air flows through the duct, as shown in Figure.1 below

Figure.1

Construction and Material

Heat sink is a static object. A heat sink usually consists of a base with one or more flat surfaces. An array of comb or fin-like protrusions to increase the heat sink's surface area contacting the air. Heat sinks are made from a good thermal conductor such as silver, gold, copper, or aluminum alloy.

Advantages and Disadvantages

ADVANTAGES: Heat sinks provide a greater surface area to contact with the air compared to metal. The material structure, in turn enables overall better heat dissipation and convection properties, dissipating heat faster than metal heat sinks without storing heat within itself. Component can be used for longer time. Failure of components due to heating is minimized DISADVANTAGES: Cost of the system is increased. Compactness of the system will be reduces. For more efficient cooling a extra fan is needed

APPLICATIONS
1.Personal Computers 2.Soldering 3.Batteries

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Conclusion
From the above report I conclude that use of heat sink in electronic system can increase the life of the component and we can prevent the failure of component due to temperature rise above permissible temperature and enables overall better heat dissipation in the component.

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References
http://letsmakerobots.com/files/heatsink.pdf Heat sink basics by electus distribution references data sheet pdf. http://en.wikipedia.org/wiki/Heat_sink www.irf.com/technical-info/appnotes/an1057.pdf Aavid Thermalloy Thermal seminar, Mustafa S., El Segundo , CA ,November 2002
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THANK YOU

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