Ciprian Ionescu

Capitolele de curs:
1.Introducere n packagingul
electronic
2.Realizarea schemelor
electrice
3.Proiectarea structurii de
interconectare

Laboratorul
B302 6 lucrari/min. 5 prezene
Prezen LAB 2p
1 Test la laborator 3p
Verificare final sesiune 5p

Bibliografie
1. INTERNET: www.cetti.ro
(Centrul de Electronic Tehnologic i Tehnici de Interconectare)

2. Help /Documentaie program Orcad

1.Introducere n
packagingul electronic

Electronics packaging has become

recognized as a critical technology for
the continued growth of the nations
electronics industry. 1
Prof. James E. Morris Head of Department of Electrical
Engineering, Portland State University, Oregon, USA
______________
1 A Multidisciplinary Sophomore Course in Electronics
Packaging, Proceedings ECTC, May 1998

Electronic Packaging
The engineering discipline that
combines the engineering and
manufacturing technologies
required to convert an electrical
circuit into a manufactured
assembly. These include at least
electrical, mechanical and
material design and many
functions such as engineering,
manufacturing and quality
control.
Editura: McGraw-Hill, Inc. New York & all, 1993, ISBN 0-07-026688-3

Electronic Package
The electromechanical
assembly resulting from
electronic packaging design
and manufacture. The level
of an electronic package
may range from the
integrated circuit package
assembly to a printed
wiring board assembly to
a subsystem or system
package assembly.

Notiuni introductive in
ingineria microsistemelor
electronice

Scurta prezentare privind evoluia componentelor

electronice pasive

Locul i rolul componentelor pasive n actuala etapa dezvoltrii microelectronicii;

Etapa actual de dezvoltare a electronicii este caracterizat de integrarea pe
scar larg a funciilor electronice alturi de altele noi din domenii ca
optoelectronic, mecanic, microfluidic, biologie, chimie. Numrul de
tranzistoare echivalente a depit legea lui Moore, se vorbete de more than
Moore i beyond Moore.
n domeniile circuitelor integrate se trece la capsule tridimensionale, la
utilizarea TSV (Through Silicon Via). Evoluia n domeniul packaging-ului este
caracterizat de conceptul SIP System in Package,
Un nou domeniu este pe cale s se impun: electronica pe baz de polimeri:

Organics Electronics; Printed Electronics !!!!!!!!

Firme implicate n cercetare i dezvoltare n domeniul SOP

n domeniul componentelor pasive evoluia este orientat ctre:

Reducerea dimensiunilor,
Creterea frecvenelor de lucru,
Mrirea capacitii de dispare a puterii i a gamei de temperatur
(cerine speciale pentru industria auto),
mbuntirea stabilitii (cu temperatura i ali factori de mediu);
creterea fiabilitii,
Diversificarea produselor pentru a oferi componenta specific fiecrei
aplicaii,
Reducerea preului,
Utilizarea componentelor pasive integrate,
Dezvoltarea de noi componente LEC (Light Emmiting Capacitor),
Supercondensatoare.

Evoluii n domeniul electronicii (sursa: J. C. Eloy, EMPC 2009, Rimini)

Evoluii n domeniul capsulelor 3D (sursa: J. C. Eloy, EMPC 2009, Rimini)

ELECTRONIC PRODUCT:
Consumer
Communication
Automobile
Computers
Infrastructure
Medical

Building block technology of the information age

Semilogaritmic Moores plots of the Roadmap data

Porti / Chip

SEMICONDUCTOR ROADMAP
Semiconductor Industry Association (SIA)
International Technology Roadmap for Semiconductors (ITRS)

Product Category Product description

Low Cost

Harsh Environment

<$300: consumer products, microcontrollers, disk drives,

displays
<$1000: battery powered products such as mobile and cellular
products
<$3000: notebooks, desktop personal computers
>$3000: high-end workstations, servers, avionics,
supercomputers
Under-the-hood and other hostile environment products

Memory

DRAMs, SRAMs

Hand Held
Cost/Performance
High Performance

Most Important IC Packaging Parameters

1992
1995
1998
2001
Feature Size (um)
0.5
0.35
0.25
0.18
Gates/chip
300k
800k
2M
5M
Transistors
0.01B 0.04B 0.1B
0.22B
Chip Size
Logic/Uniprocessor
250
400
600
800
DRAM
132
200
320
500
Maximum Power (W/Die)

2004
0.12
10M
0.6B

2007
0.07
100M
2.1B

1000
700

1250
1000
40 200
4
1.5
1.5
5000

High Performance

10

15

30

40

Portable
Power Supply Voltage
(V)
Desktop
Portable
No. I/Os

40 120
4

5
3.3
500

3.3
2.2
750

2.2
2.2
1500

2.2
1.5
2000

1.5
1.5
3500

Package lead pitch, frequency, power dissipation estimates and comparisons

Package

DIP

QFP

CSP

Flip Chip

5x5
20
64
312
3.3 x 1.0
100

16 x 16
64
500
128
2.0 x 2.0
16

25 x 25
100
1600
625
1.0 x 1.0
25

36 x 36
144
3600
600
1.4 x 1.4
24

Top View Showing

Chip To Package
Connections

Plane View Showing

package to Board
Connections
Chip Size (mm X mm)
Chip Perimeter (mm)
Number of I/Os
Chip Pad Pitch (um)
Package Size (in. X in.)
Package Lead Pitch
(mils)

Package lead pitch, frequency, power dissipation estimates and comparisons

Package

DIP

QFP

CSP

256
0.5
300k
200k
80
7.5

625
0.25
2M
2M
320
30

Flip Chip

Top View Showing

Chip To Package
Connections

Plane View Showing

package to Board
Connections
Chip Area (mm X mm)
Feature Size (um)
Gates/Chip
Chip Area (70 x Feat. Size)
Max. Frequency
(MHz)
Power Dissipation
(W)

25
2.0
30k
1.25k
5
0.5

1296
0.125
10M
16.4M
1.28 GHz
120

Package lead pitch, frequency, power dissipation estimates and comparisons

Package

DIP

QFP

CSP

Flip Chip

Top View Showing

Chip To Package
Connections

Plane View Showing

package to Board
Connections
Chip Power Density (W /
cm x cm)
Package Power Density (W
/ cm x cm)
Supply Voltage (V)
Supply Current (A)
Chip Supply Lead Current
Density (A / mm x mm)
Package Supply Lead
Current Density (A / mm x
mm)

2.9

4.8

9.3

2.0

0.024
5
0.1
5.23

0.3
3.3
2.3
143

4.8
2.2
13.6
11.08

9.8
1.5
80
31.43

1.6

11.5

11.08

31.43

Worldwide systems packaging market ($ billions)

Printed Wiring Boards

30

Flex Circuits

3.2

Assembly Equipment

3.3

Materials

9.9

Connectors

23.4

Optoelectronics Packaging

10

RF Packaging

1.2

Passive Components

25

Thermal and Heat Skins

TOTAL

109

Producia mondial de PCB pe regiuni n 2008

(milioane US dollars)

Sursa: World PCB Production & Laminate Market Report for the Year 2008, IPC,
Association Connecting Electronics Industries

Producia mondial de PCB pe regiuni n 2008

Sursa: World PCB Production & Laminate Market Report for the Year 2008, IPC,
Association Connecting Electronics Industries

Producia mondial de PCB n 2008

pe tipuri de substraturi
pentru diverse regiuni

Sursa: World PCB Production & Laminate Market

Report for the Year 2008,
IPC, Association Connecting Electronics Industries

Electronics in automotive

Electronics in automotive

Electronics in automotive

Electronics in automotive

Vehicle environmental zone

Packaging hierarchy

A summary analysis reveals that any electronic package must be approached

by means of criteria shown in figure.
Economical Efficiency
Entrepreneurial Skills

Custom requirements
Reliability

Mentenability

ELECTRONIC
PACKAGE

Technology

Testability
Ecology

Electromagnetic
Compatibility

The presented image indicates a first set of criteria which aid at the realisation of
an electronic package and highlights once again the multitude of aspects which
must be taken into consideration during the product innovation.
Universitatea Politehnica din Bucureti

Centrul de Electronic Tehnologic i Tehnici de Interconectare

Custom requirements

Economical Efficiency

Entrepreneurial Skills

Ecological impact

Reliability

Mentenability
Testability

Technology
A suggestive
representation of
the importance of
these criteria in
sustaining a product
on the market is
represented in
figure.
Universitatea Politehnica din Bucureti

ELECTRONIC
PACKAGE

The robustivity chain

which hang an
electronic package

Centrul de Electronic Tehnologic i Tehnici de Interconectare

Mechanic

Mathematics
Electrotechnics
Passive Components
and Circuits

Engineering
Graphics

Electronic Devices
and Circuits
Chemistry

Programming

CAD Design
Materials Science
Physics

Foreign Language

Reliability

Signals, Circuits
and Systems
Microprocessors
Architecture
SPICE
Fundamentals of
Economical Theory
Technology
Numerical Methods

ELECTRONIC
PACKAGE
Legislation

Digital Integrated
Circuits

Information
Transmission Theory

Microwave
Interconnection
Techniques in
Electronics

Analog Integrated
Circuits

Digital Signal Processing

Electric & Electronic
Measurements
Data Acquisition
Systems

Electronic packaging oriented knowledge curriculum

Criterii de proiectare a cablajelor

imprimate
Economice

Ge
om
etr
ice

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Te

Mecanice

c
Ele

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g
lo
no

Termice

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tab

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46 / 37

The global electronic industry acts as

the engine for science, technology,
advanced manufacturing, and the overall
economy of the countries that participate
in it. 1
Prof. Rao Tumala, Packaging Research Center, Georgia
Institute of Technology, Atlanta, Georgia, Past President of
IEEE-CPMT Society
____________________
1 Fundamentals of Microsystems Packaging, McGrawHill, 2001

Componente
pasive

Diverse tipuri de
componente pasive
Componente
Componente SMD
SMD

Componente THT

Diverse componente pasive

Inductoare
Dispozitive opto-electronice

Rezonatoare

Rezistoare
neliniare

Diverse tipuri de componente pasive

Integrate

Rezistoare
Wire
Wire Wound
Wound
Metal
Metal Film
Film Fixed
Fixed

small
small size
size

Wire
Wire Wound
Wound
miniature
miniature

Carbon
Carbon Film
Film Fixed
Fixed

Wire
Wire Wound
Wound
Non
Non Inductive
Inductive

Standard
Standard

Miniature
Miniature

Metal
Metal Oxide
Oxide

Thick
Thick Film
Film Chip
Chip

Cement
Cement Wire
Wire Wound
Wound

Rezistor SMD
Condensator SMD
Reea rezistiv

MCM

THT
Minimelf

CADDOCK
2000

Rezistoare
de precizie
pentru
tensiune
nalt
( Precision High
Voltage
Resistors )

Condensatoare

Film Capacitors
2001

Universitatea Politehnica din Bucureti

Centrul de Electronic Tehnologic i Tehnici de Interconectare

Inductoare

Universitatea Politehnica din Bucureti

Centrul de Electronic Tehnologic i Tehnici de Interconectare

Inductoare planare

Finite element modeling for Ansys simulation

Inductoare planare

Inductoare
planare
FR4

Inductoare planare
LTCC

Universitatea Politehnica din Bucureti

Centrul de Electronic Tehnologic i Tehnici de Interconectare

Modalitati de
livrare a
componentelor
SMD

=9mm

TOP SIDE
BOTTOM SIDE

Structur de
interconectare

Poteniometre

Gaur de
prindere

Gaur de
prindere

Conector
Circuite
integrate

Transformator

Componente
discrete
Gaur de
prindere

Comutator ON/OFF

Componente optoelectronice

Butoane

STRUCTURA GENERAL A UNUI MODUL ELECTRONIC

Marcaje pentru tiere

(frezare)

Masc de lipire
(Solder mask)

Plan de mas
(alimentare) intern

Nume PCB
Gaur de
prindere
Gaur de
trecere

Trasee

Mitre
corner

Pastile
Masc de
inscripionare
(Silk mask)

Element mecanic de fixare pentru o

component electronic

Text cu cupru

Contururi de
componente

STRUCTURA DE INTERCONECTARE ATAAT

MODULULUI ELECTRONIC

Fluxul de proiectare automatizat

Proiectare schem
electric

CAE

Simulare schem electric

Plasare componente

C
A
D

Analiz termic

Postprocesri

Proiectare structur de
interconectare

Fabricaie

Analiz EMC i a
integritii semnalelor

Testare

CAM

PSPICE SIMULATION

Analiza termic

Analiza integritii semnalelor

TXLINE

CITS25

EMC ANALYSIS

EMC ANALYSIS

TTL

CMOS

Simulare electromagnetic a structurilor PCB